JPH01201926A - Vapor phase epitaxial growth - Google Patents
Vapor phase epitaxial growthInfo
- Publication number
- JPH01201926A JPH01201926A JP2591088A JP2591088A JPH01201926A JP H01201926 A JPH01201926 A JP H01201926A JP 2591088 A JP2591088 A JP 2591088A JP 2591088 A JP2591088 A JP 2591088A JP H01201926 A JPH01201926 A JP H01201926A
- Authority
- JP
- Japan
- Prior art keywords
- susceptor
- epitaxial growth
- temperature
- gas
- reaction tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【発明の詳細な説明】
〔概 要〕
気相エピタキシャル成長方法に関し、
反応管内に導入される複数の分解温度の異なるエピタキ
シャル成長用ガスが、基板上で確実に分解して組成変動
、および結晶欠陥の無い良好なエピタキシャル層が得ら
れるのを目的とし、基板を保持して加熱するり゛セブク
を反応管内に設置し、該反応管内に分解温度の異なるエ
ピタキシャル成長用ガスを導入して前記サセプタの加熱
によってエピタキシャル成長用ガスを分解してガスの分
解成分を基板に付着させる方法に於いて、前記反応管の
ガス流の方向に垂直な方向で前記サセプタに対向して所
定の距離を隔ててJ〕)1熱部材を設け、前記サセプタ
と前記加熱部材とをそれぞれ別個に加熱して前記ナセブ
タと加熱部材の間における反応管内のガス流の方向に垂
直な方向に所定の温度分布領域を形成するとともに、前
記分解温度の異なるエピタキシャル成長用ガスの各々を
、前記分解温度に近接した反応管内の温度分布領域内に
それぞれ別個に導入することで構成する。[Detailed Description of the Invention] [Summary] Regarding the vapor phase epitaxial growth method, a plurality of epitaxial growth gases having different decomposition temperatures introduced into a reaction tube are reliably decomposed on the substrate, and there is no compositional variation and no crystal defects. In order to obtain a good epitaxial layer, a susceptor for holding and heating the substrate is installed in a reaction tube, epitaxial growth gases having different decomposition temperatures are introduced into the reaction tube, and epitaxial growth is performed by heating the susceptor. In the method of decomposing a gas for use and attaching the decomposed components of the gas to a substrate, the susceptor is separated from the susceptor by a predetermined distance in a direction perpendicular to the direction of the gas flow in the reaction tube. a member is provided, and the susceptor and the heating member are heated separately to form a predetermined temperature distribution region in a direction perpendicular to the direction of gas flow in the reaction tube between the susceptor and the heating member, and the decomposition The epitaxial growth gases having different temperatures are separately introduced into a temperature distribution region in the reaction tube close to the decomposition temperature.
本発明は気相エビクキシャル成長装置に係り、特に分解
温度の異なる複数の種類のエピタキシャル成長用ガスを
反応管に導入しても基板上で確実に分解でき、組成変動
および結晶欠陥の生じないエピタキシャル層が形成でき
る気相エピタキシャル成長方法に関する。The present invention relates to a vapor phase epitaxial growth apparatus, and in particular, even if multiple types of epitaxial growth gases with different decomposition temperatures are introduced into a reaction tube, they can be reliably decomposed on a substrate, and an epitaxial layer can be formed without compositional fluctuations or crystal defects. This invention relates to a vapor phase epitaxial growth method.
赤外線検知素子の+A料として水銀・カドミウム・テル
ル(fig + −xCd、 Te)の化合物半導体結
晶が用いられており、このような結晶を薄層状態でかつ
大面積で得ろために気相エピタキシャル成長方法か用い
られている。A compound semiconductor crystal of mercury, cadmium, and tellurium (fig + -xCd, Te) is used as the +A material of an infrared sensing element, and in order to obtain such a crystal in a thin layer state and over a large area, a vapor phase epitaxial growth method is used. or is used.
〔従来の技イ+l;r )
従来の気相エピタキシャル成長方法は第2図に示すよう
に、石英より成る反応管1内にグラファイトよりなるサ
セプタ2を設置し、該サセプタ2上にエピタキシャル成
長用のカドミウムテルル(CdTe)の基板3を設置す
る。この反応管1内は所定の真空度になる迄排気した後
、ガス導入管4より導入された水素ガスに担持された水
銀カス、水素ガスに担持されたジメチルカドミウム((
CI+3)2Cd)ガス、および水素ガスに担持された
ジエチルテルルC(C2H5) zTe 〕ガスをガス
ミキサ5て混合し、ごの混合したエピタキシャル成長用
ガスを反応管1内に導入する。そして反応管1の周囲に
設けた高周波誘導コイル6に高周波電力を印加すること
でリーセプク2を加熱し、基板3を約400°Cの温度
に力■熱し、基板3上に導入されてきたエピタキシャル
成長用ガスを分解して基板」二にIIg+−x ca。[Conventional technique +l;r] As shown in FIG. 2, in the conventional vapor phase epitaxial growth method, a susceptor 2 made of graphite is installed in a reaction tube 1 made of quartz, and cadmium for epitaxial growth is placed on the susceptor 2. A tellurium (CdTe) substrate 3 is installed. After the inside of the reaction tube 1 is evacuated to a predetermined degree of vacuum, mercury scum supported by hydrogen gas introduced from the gas introduction tube 4 and dimethyl cadmium ((
CI+3)2Cd) gas and diethyltellurium C(C2H5)zTe] gas supported by hydrogen gas are mixed in a gas mixer 5, and the mixed epitaxial growth gas is introduced into the reaction tube 1. Then, by applying high frequency power to the high frequency induction coil 6 provided around the reaction tube 1, the receptacle 2 is heated, and the substrate 3 is heated to a temperature of approximately 400°C. IIg+-x ca to decompose the gas for the substrate.
T(!のエピタキシャル層を成長している。An epitaxial layer of T(!) is grown.
ところでト記したエピタキシャル成長用カスの内で、水
銀は既に重体元素であり、ジメチルカドミラl、の分解
温度は260°Cで、更にジエチルテルルの分解温度は
380°Cて上記三種類のエピタキシャル成長用ガスの
うちで最も分解し難い。By the way, among the epitaxial growth residues mentioned above, mercury is already a heavy element, and the decomposition temperature of dimethyl cadmilla is 260°C, and the decomposition temperature of diethyl tellurium is 380°C, which is suitable for the three types of epitaxial growth mentioned above. The most difficult to decompose of all gases.
そのため、加熱温度か一定な基板上では、水銀は既に単
体元素であり、次いでジメチルカドミウム、ジエチルテ
ルルの順に分解し易いため、ガスの分解の度合が各エピ
タキシャル成長用ガスによって異なるために、所望の組
成のエピタキシャル層が得られない問題がある。Therefore, on a substrate with a constant heating temperature, mercury is already a single element, and then dimethyl cadmium and diethyl tellurium are easily decomposed in that order, so the degree of gas decomposition varies depending on each epitaxial growth gas, so it is difficult to achieve the desired composition. There is a problem that it is not possible to obtain an epitaxial layer.
また分解が不十分なエピタキシャル成長用ガス成分が基
板に(=J若するため、形成されるエピタキシャル層が
所望の組成の結晶として得られず、形成されるエピタキ
シャル層に結晶欠陥が発生し、高品質なエピタキシャル
層が得られない問題が有る。In addition, insufficiently decomposed epitaxial growth gas components reach the substrate (=J), so the formed epitaxial layer cannot be obtained as a crystal with the desired composition, and crystal defects occur in the formed epitaxial layer, resulting in high quality. There is a problem that a suitable epitaxial layer cannot be obtained.
本発明は上記した問題点を解決し、基板の加熱温度を一
定にした状態でも、基板−ヒのエピタキシャル成長用ガ
スか確実に分解でき、組成変動および結晶欠陥の発生し
ない高品質なエピタキシャル層か得られるよ・)な気相
エビタキンヤル成長方法 J −−
の提供を目的とずろ。The present invention solves the above-mentioned problems, and even when the heating temperature of the substrate is kept constant, the epitaxial growth gas on the substrate can be reliably decomposed, and a high-quality epitaxial layer without compositional fluctuations or crystal defects can be obtained. The purpose of this project is to provide a vapor-phase Ettakinyal growth method J.
[課題を解決するための手段]
上記問題点を解決する本発明の気相エピタキシャル成長
方法は、第1図に示すように反応管1の直径方向でサセ
プタ2に対向して所定の距離を隔てて力0熱部材11を
設け、前記サセプタ2と前記加熱部材11とをそれぞれ
別個に加熱して前記サセプタ2と加熱部材11の間にお
ける反応管1内のガス流の方向に垂直な方向に所定の温
度分布領域を形成するとともに、前記分解温度の異なる
エピタキシャル成長用ガスの各々を、前記分解温度に近
接した反応管1内の温度分布領域内にそれぞれ別個に導
入することで構成する。[Means for Solving the Problems] As shown in FIG. 1, the vapor phase epitaxial growth method of the present invention solves the above-mentioned problems. A zero force heating member 11 is provided, and the susceptor 2 and the heating member 11 are heated separately to produce a predetermined temperature in a direction perpendicular to the direction of gas flow in the reaction tube 1 between the susceptor 2 and the heating member 11. It is constructed by forming a temperature distribution region and separately introducing each of the epitaxial growth gases having different decomposition temperatures into the temperature distribution region in the reaction tube 1 close to the decomposition temperature.
(作 用〕
本発明の方法は基板を設置して加熱するり゛セプタに対
向して反応管のガス流の方向に垂直4(方向に所定の間
隔を隔てて加熱部材を設け、そのサセプタと加熱部制と
を別個に加熱することで反応管のガス流の方向に垂直な
方向に沿って所定の温度分布領域を形成する。そしてこ
の所定温度分布領域内に、該領域の温度に最も近接した
分解温度を有゛するエピタキシャル成長用ガスのカス導
入端部を持ってきて、エピタキシャル成長ガスの各々が
最も効率良く分解できるようにして、基板上に組成変動
を生じない、かつ結晶欠陥を生じない良質のエピター1
−シャル層が得られるようにする。(Function) In the method of the present invention, a substrate is placed and heated, and a heating member is provided facing the susceptor and spaced apart from the susceptor at a predetermined interval in the direction perpendicular to the direction of gas flow in the reaction tube. By heating the heating section separately, a predetermined temperature distribution region is formed along the direction perpendicular to the direction of gas flow in the reaction tube.Then, within this predetermined temperature distribution region, there is a temperature closest to the temperature of the region. The waste introduction end of the epitaxial growth gas having a decomposition temperature of Epiter 1
- Ensure that a clear layer is obtained.
〔実施例]
以下、図面を用いて本発明の一実施例につき詳細に説明
する。[Example] Hereinafter, an example of the present invention will be described in detail using the drawings.
前記した第1図に図示するように本発明の方法に用いる
装置は、CdTeのエピタキシャル成長用基板3を設置
し、内部に赤外線ランプ12を備えた石英製のり一セゾ
タ2を反応管1内に設置する。更に該サセプタ2と対1
ij]シて反応管1のガス流の方向に乗直な方向に所定
の間隔を陽でて内部に赤外線ランプ13を設;ξした石
英よりなる加熱部材11を設置ず7、。As shown in FIG. 1 described above, the apparatus used in the method of the present invention includes a CdTe epitaxial growth substrate 3 installed, and a quartz glue sezoter 2 equipped with an infrared lamp 12 inside a reaction tube 1. do. Furthermore, the susceptor 2 and pair 1
ij] An infrared lamp 13 is installed inside the reaction tube 1 at a predetermined interval in a direction perpendicular to the direction of gas flow; a heating member 11 made of quartz ξ is not installed 7.
また反応@1内にエピタキシャル成長用ガス導入管2L
22,23をそれぞれ挿入する。In addition, 2L of gas introduction pipes for epitaxial growth are installed in the reaction@1.
Insert 22 and 23, respectively.
このような装置を用いて本発明の方法を実施するには、
前記り°セプタ2にCdTeのエピタキシャル成長用基
板3を設置したのら、反応管1の内部をIQ−5tor
rの真空度に成る迄排気した後、・す°セプタ2の温度
を320°Cに、加熱部材11の温度を400°Cの温
度に加熱する。するとリセプタ2と加熱部材11とて挟
まれた反応管1内の直径方向の温度分布領域は、加熱部
材11に最も近接した領域31は最も温度か高く、サセ
プタ2に最も近接した領域32は最も温度が低く、これ
等の領域31、32に挟まれた領域33は、領域31と
32の聞の中間の温度である。To carry out the method of the present invention using such an apparatus,
After installing the CdTe epitaxial growth substrate 3 in the septa 2 as described above, the inside of the reaction tube 1 was cleaned with an IQ-5tor.
After evacuation to a degree of vacuum of r, the temperature of the septa 2 is heated to 320°C, and the temperature of the heating member 11 is heated to 400°C. Then, the temperature distribution area in the diametrical direction inside the reaction tube 1 sandwiched between the receptor 2 and the heating member 11 is that the area 31 closest to the heating member 11 has the highest temperature, and the area 32 closest to the susceptor 2 has the highest temperature. The lower temperature region 33 sandwiched between these regions 31 and 32 has a temperature intermediate between the regions 31 and 32.
従って最も高温である領域31に導入端部を有するカス
導入管21内には最も分解温度の裔いシ:Lチルテルル
を担持した水素ガスより成るエピタキシャル成長用ガス
を、最も低温である領域32に導入端部を有するカス導
入管22内には水銀ガスを担持した水素ガスよりなるエ
ピタキシャル成長用ガスを、手記した領域31と32の
温度分布の中間の温度分布を有づる領域33内に導入端
部を有するガス導入管23には分解温度が前記した両者
のエピタキシャル成長ガスの中間の温度であるジメチル
カドミラJ、をt’、’!、 4.1j シた水素ガス
よりなるエピタキシャル成長用ガスをそれぞれ導入する
。Therefore, in the waste introduction tube 21 having the introduction end in the region 31 having the highest temperature, there is a descendant having the highest decomposition temperature: an epitaxial growth gas consisting of hydrogen gas carrying L-titellurium is introduced into the region 32 having the lowest temperature. An epitaxial growth gas consisting of hydrogen gas carrying mercury gas is introduced into the waste introduction tube 22 having an end, and the introduction end is introduced into a region 33 having a temperature distribution intermediate between the temperature distributions of regions 31 and 32. Dimethyl cadmilla J, whose decomposition temperature is between the above-mentioned epitaxial growth gases, is introduced into the gas introduction pipe 23 having t','! , 4.1j Introduce an epitaxial growth gas consisting of hydrogen gas.
このようにして、カス導入管21はジエチルテルルカス
導入管となり、ガス導入管22は水銀ガス導入管となり
、ガス導入管23はジメチルカドミウムガス導入管とす
る。In this way, the waste introduction tube 21 becomes a diethyl telluric gas introduction tube, the gas introduction tube 22 becomes a mercury gas introduction tube, and the gas introduction tube 23 becomes a dimethyl cadmium gas introduction tube.
するとカス導入管2L22,23の各々より導入された
エピクー)−シャ用成長用ガスは、そのガスの分解温度
に最も近接した温度分布領域に導入されるので確実に分
解されるため、基板−ヒに組成変動を生じない、かつ結
晶欠陥を生じない良質なエピタキシャル結晶か得られる
。Then, the epicooler growth gas introduced from each of the waste introduction pipes 2L22 and 23 is introduced into the temperature distribution region closest to the decomposition temperature of the gas, so that it is reliably decomposed, and the substrate-heater is A high-quality epitaxial crystal that does not cause compositional fluctuations or crystal defects can be obtained.
尚、木実施例では基板を保持し、加熱するサセプタ並び
に加熱部材を石英部材に赤外線ランプを埋設して用いた
が、石英の代わりにグラファイトを用い、該グラファイ
トを高周波電力を用いて加熱しても良い。Incidentally, in the wood embodiment, an infrared lamp was embedded in a quartz member as a susceptor for holding and heating the substrate, and a heating member was used, but graphite was used instead of quartz, and the graphite was heated using high-frequency power. Also good.
以上の説明から明らかなように本発明によれば、エピタ
キシャル成長用ガスか確実に分解できるので、組成変動
を生じ無く、かつ結晶欠陥の発生を見ない良質なエピタ
キシャル結晶が得られる効果がある。As is clear from the above description, according to the present invention, since the epitaxial growth gas can be reliably decomposed, it is possible to obtain a high-quality epitaxial crystal without compositional fluctuation and without occurrence of crystal defects.
第1図は本発明の方法に用いる装置の説明図、第2図は
従来の方法に用いる装置の説明図である。
図において、
1は反応管、2はサセプタ、3ばエピタキシャル成1長
用基板、11は加熱部材、12.13は赤外線ランプ、
21はジエチルテルルガス導入管、22は水銀ガス導入
管、23はジメチルカドミウムガス導入管、3132.
33は温度分布領域を示す。FIG. 1 is an explanatory diagram of an apparatus used in the method of the present invention, and FIG. 2 is an explanatory diagram of an apparatus used in a conventional method. In the figure, 1 is a reaction tube, 2 is a susceptor, 3 is a substrate for epitaxial growth, 11 is a heating member, 12.13 is an infrared lamp,
21 is a diethyl tellurium gas introduction tube, 22 is a mercury gas introduction tube, 23 is a dimethyl cadmium gas introduction tube, 3132.
33 indicates a temperature distribution area.
Claims (1)
管(1)内に設置し、該反応管(1)内に分解温度の異
なるエピタキシャル成長用ガスを導入して前記サセプタ
(2)の加熱によってエピタキシャル成長用ガスを分解
してガスの分解成分を基板(3)に付着させる方法に於
いて、 前記反応管(1)のガス流の方向に垂直な方向で前記サ
セプタ(2)に対向して所定の距離を隔てて加熱部材(
11)を設け、前記サセプタ(2)と前記加熱部材(1
1)とをそれぞれ別個に加熱して前記サセプタ(2)と
加熱部材(11)の間における反応管(1)内のガス流
の方向に垂直な方向に所定の温度分布領域(31、32
、33)を形成するとともに、前記分解温度の異なるエ
ピタキシャル成長用ガスの各々を、前記分解温度に近接
した反応管(1)内の温度分布領域(31、32、33
)内にそれぞれ別個に導入するごとを特徴とする気相エ
ピタキシャル成長方法。[Claims] A susceptor (2) that holds and heats a substrate (3) is installed in a reaction tube (1), and epitaxial growth gases having different decomposition temperatures are introduced into the reaction tube (1). In the method of decomposing the epitaxial growth gas by heating the susceptor (2) and attaching the decomposed components of the gas to the substrate (3), the susceptor (2) is heated in a direction perpendicular to the direction of gas flow in the reaction tube (1). The heating member (
11) is provided, and the susceptor (2) and the heating member (1
1) and are heated separately to form a predetermined temperature distribution area (31, 32) in a direction perpendicular to the direction of gas flow in the reaction tube (1) between the susceptor (2) and the heating member (11).
.
) is a vapor phase epitaxial growth method characterized by introducing each layer separately into a layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2591088A JPH01201926A (en) | 1988-02-05 | 1988-02-05 | Vapor phase epitaxial growth |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2591088A JPH01201926A (en) | 1988-02-05 | 1988-02-05 | Vapor phase epitaxial growth |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01201926A true JPH01201926A (en) | 1989-08-14 |
Family
ID=12178932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2591088A Pending JPH01201926A (en) | 1988-02-05 | 1988-02-05 | Vapor phase epitaxial growth |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01201926A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6218212B1 (en) | 1991-03-18 | 2001-04-17 | Fujitsu Limited | Apparatus for growing mixed compound semiconductor and growth method using the same |
| JP2008159740A (en) * | 2006-12-22 | 2008-07-10 | Matsushita Electric Ind Co Ltd | SiC single crystal manufacturing method and SiC single crystal manufacturing apparatus |
-
1988
- 1988-02-05 JP JP2591088A patent/JPH01201926A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6218212B1 (en) | 1991-03-18 | 2001-04-17 | Fujitsu Limited | Apparatus for growing mixed compound semiconductor and growth method using the same |
| JP2008159740A (en) * | 2006-12-22 | 2008-07-10 | Matsushita Electric Ind Co Ltd | SiC single crystal manufacturing method and SiC single crystal manufacturing apparatus |
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