JPH01202443A - Laminate for electrical apparatus and printed-wiring board - Google Patents

Abstract

PURPOSE:To obtain laminate for electrical apparatus and printed-wiring board, in both of which no separation of through hole plating occurs, by a method wherein laminates, in each of which metal foils are arranged on the top surface and/or under surface of the required number of specified resin-impregnated base materials, are laminated to one another into an integral body and laminates, in each of which outer layer materials are arranged through the required number of resin-impregnated base materials, are laminated to one another into an integral body. CONSTITUTION:The laminate for electrical apparatus concerned is obtained by laminating laminates, in each of which metal foils are arranged on the top surface and/or under surface of the required number of base materials impregnated with thermosetting resin having glass transition temperature of 180 deg.C or higher, to one another into an integral body. Further, the printed-wiring board concerned is obtained by laminating laminates, in each of which outer layer materials are arranged through the required number of resin-impregnated base material, to one another into an integral body. Consequently, the difference between the expansion coefficients of the laminate for electrical apparatus and of the printed-wiring board can be made smaller and the separation of through hole plating can be remarkably prevented from occurring. As the resin, single phenolic resin, cresylic resin, epoxy resin or the like, their mixture or their modified resin is used. As the base material, inorganic fiber made of glass, asbestos or the like, organic synthetic fiber made of polyester or polyacrylic resin and natural fiber such as cotton or the like is employed.

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention is applicable to electrical equipment, total equipment, etc. m- for L equipment, communication equipment, etc.
The invention relates to electrical laminates and printed wiring boards.

[Conventional technology]

Conventionally, electrical laminates and printed wiring boards use resin-impregnated base materials in which the base material is impregnated with a thermosetting resin having a glass transition temperature of around 150°C from the viewpoint of impregnability and moldability. Ta.

[Problem that the invention seeks to solve]

As mentioned in the conventional technology, if a thermosetting resin with a glass transition temperature of around 150°C is used as the resin for the resin-impregnated base material, the impregnating property and moldability will be better, but it will be difficult to process electrical and laminated boards and printed wiring boards. During the soldering process at 260° C. for about 30 seconds, which sometimes receives heat, the plating adhesive strength decreases due to the expansion difference between the through-hole plating part and the resin part during heating [1. Plating peeling occurs]. The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide an electrical laminate and a printed wiring board in which through-hole plating does not peel off.

[Means to solve the problem]

The non-invention is to integrate a laminate in which a required number of resin-impregnated base materials are impregnated with a thermosetting resin having a glass transition temperature of 180° C. or higher and metal foils are disposed on the upper and/or lower surfaces of the base material. The outer layer material is arranged on the upper and/or lower surface of the electrical laminate and the inner layer material through the required number of resin-impregnated base materials in which the base material is impregnated with a thermosetting resin having a glass transition temperature of 180°C or higher. Since the printed wiring board is characterized by integrating 8 and the polar layer, it is possible to reduce the difference in expansion rate, thereby achieving the above object.Details of the present invention will be described below. Explain.

The resins used in the resin-impregnated base material used in the present invention include phenolic resins with a glass transition temperature of 180°C or higher, cresol resins, unsaturated polyester resins, epoxy resins, etc.
Imide resins, etc. alone, mixtures, and modified products, and the base materials include inorganic fibers such as glass and asbestos, 1) esters, polyamides, polyvinyl alcohol, and polyacrylic resins, synthetic fibers, and natural materials such as cotton. The base material is woven fabric, non-woven fabric, mermet or paper made of fibers, or a combination thereof. Metal foils are single, alloy, or composite products of copper, aluminum, iron, Nilacel, zinc, etc., and the adhesive surface is chemically and/or physically treated as necessary, and an adhesive layer is further provided as necessary. It is something. The inner layer material is an electrical laminate with an electric circuit formed on one or both sides, and preferably the glass transition temperature of the resin of the electrical laminate is 180° C. or higher. As the outer layer material, the above-mentioned metal foil or single-sided metal-clad laminate may be used. T cif as PkFJ integration means? jt M 7'' Less method, multi-roll method, double belt method, pressureless curing method, etc. may be used without any particular limitation.

Example 1 The present invention will be explained below based on examples.

On a glass cloth with a thickness of 0.2 mm, 100 parts by weight of epoxy resin (manufactured by Shell Chemical Co., Ltd., product number Epicote 828), 100 parts of Chlorendylic Quanhydride, and 200 parts of methyloxytol were added. The resin t after drying is SO**
A base material was obtained by impregnating, drying, and drying to obtain a base material. A laminate in which copper foil with a thickness of 0.035 wm was placed on the upper and lower surfaces of the seven resin-impregnated substrates was heated and pressure-molded at a molding pressure of 40 Kq/al 1) at 60°C for 120 minutes to determine the thickness. A dry laminate was obtained at 1.61'r.

Example 2 The same resin-impregnated base material as in Example 1 was interposed on the upper and lower surfaces of the inner layer material formed by forming electric circuits on both sides of the glass-based epoxy laminate of Example 1, respectively, to a thickness of 0. A laminate with 035m of copper foil arranged on each layer was molded under a molding pressure of 40Kg/c1). 1
Heat at 60℃ for 120 minutes, M pressure molding, T thickness: 2fl
A four-layer printed wiring board was obtained.

Comparative Example 1 100 parts of epoxy resin (manufactured by Shell Chemical Co., Ltd., product number Epicoat 828), 3 parts of metaphenylene diamine, and 1 part of methyloxytol were added to a glass cloth with a thickness of 0.21).
) was impregnated with 5 parts of epoxy resin varnish so that the amount of resin after drying was 50%, and dried to obtain a resin-impregnated base material. Next, a thickness of 0.035 m was applied to the top and bottom surfaces of the seven resin-impregnated base materials.
A laminate with copper foil of 40 g is molded at a pressure of 40 Kq/d.
, Heat and pressure mold at 160°C for 120 minutes to a thickness of 1.
A 6 fl electrical laminate was obtained.

Comparative Example 2 Using the glass base epoxy laminate of Comparative Example 1, Comparative Example 1
A 4-layer printed wiring board with a thickness of 2H was obtained in the same manner as in Example 2 except that the same resin-impregnated base material was used.

The glass transition temperature and through-hole plating peelability of Examples 1 and 2 and Comparative Examples 1 and 2 are as shown in Table 1.

〔Effect of the invention〕

The present invention is constructed as described above. The electrical laminate having the structure described in claim 1 has the effect of largely preventing peeling of through-hole plating.

In addition, the printed wiring board having the structure described in Section 2 of the TJ permit has the effect of largely preventing peeling of through-hole plating.

Claims (2)

[Claims] (1) A laminate in which a required number of resin-impregnated base materials are impregnated with a thermosetting resin having a glass transition temperature of 180°C or higher and metal foils are arranged on the upper and/or lower surfaces of the base material is laminated and integrated. Characteristic electrical laminates. (2) A laminate in which the outer layer material is arranged on the upper and/or lower surface of the inner layer material through the required number of resin-impregnated base materials in which the base material is impregnated with a thermosetting resin having a glass transition temperature of 180°C or higher is laminated. A printed wiring board characterized by being integrated.