JPH01222045A - 真空蒸着装置 - Google Patents

真空蒸着装置

Info

Publication number
JPH01222045A
JPH01222045A JP30842887A JP30842887A JPH01222045A JP H01222045 A JPH01222045 A JP H01222045A JP 30842887 A JP30842887 A JP 30842887A JP 30842887 A JP30842887 A JP 30842887A JP H01222045 A JPH01222045 A JP H01222045A
Authority
JP
Japan
Prior art keywords
vapor deposition
substrate
deposition material
evaporation
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30842887A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0532468B2 (2
Inventor
Shintaro Hattori
服部　紳太郎
Takayuki Takahagi
隆行 高萩
Akira Ishitani
石谷　炯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Science and Technology Agency
Original Assignee
Research Development Corp of Japan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Research Development Corp of Japan filed Critical Research Development Corp of Japan
Priority to JP30842887A priority Critical patent/JPH01222045A/ja
Priority to DE3850941T priority patent/DE3850941T2/de
Priority to EP88311500A priority patent/EP0319347B1/en
Priority to US07/280,152 priority patent/US5007372A/en
Publication of JPH01222045A publication Critical patent/JPH01222045A/ja
Publication of JPH0532468B2 publication Critical patent/JPH0532468B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
JP30842887A 1987-12-04 1987-12-04 真空蒸着装置 Granted JPH01222045A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP30842887A JPH01222045A (ja) 1987-12-04 1987-12-04 真空蒸着装置
DE3850941T DE3850941T2 (de) 1987-12-04 1988-12-05 Vakuumbeschichtungsanlage.
EP88311500A EP0319347B1 (en) 1987-12-04 1988-12-05 Vacuum depositing apparatus
US07/280,152 US5007372A (en) 1987-12-04 1988-12-05 Vacuum depositing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30842887A JPH01222045A (ja) 1987-12-04 1987-12-04 真空蒸着装置

Publications (2)

Publication Number Publication Date
JPH01222045A true JPH01222045A (ja) 1989-09-05
JPH0532468B2 JPH0532468B2 (2) 1993-05-17

Family

ID=17980933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30842887A Granted JPH01222045A (ja) 1987-12-04 1987-12-04 真空蒸着装置

Country Status (1)

Country Link
JP (1) JPH01222045A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5785763A (en) * 1994-08-30 1998-07-28 Nec Corporation Electron-gun evaporation system having evaporation-source stream regulator
US6036821A (en) * 1998-01-29 2000-03-14 International Business Machines Corporation Enhanced collimated sputtering apparatus and its method of use
US7070697B2 (en) 2003-04-14 2006-07-04 Hitachi Global Storage Technologies Netherlands B.V. Methods of making a read sensor with use of a barrier structure for depositing materials

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6157907A (ja) * 1984-08-29 1986-03-25 Hitachi Cable Ltd イメ−ジガイド素線配列方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6157907A (ja) * 1984-08-29 1986-03-25 Hitachi Cable Ltd イメ−ジガイド素線配列方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5785763A (en) * 1994-08-30 1998-07-28 Nec Corporation Electron-gun evaporation system having evaporation-source stream regulator
US6036821A (en) * 1998-01-29 2000-03-14 International Business Machines Corporation Enhanced collimated sputtering apparatus and its method of use
US7070697B2 (en) 2003-04-14 2006-07-04 Hitachi Global Storage Technologies Netherlands B.V. Methods of making a read sensor with use of a barrier structure for depositing materials

Also Published As

Publication number Publication date
JPH0532468B2 (2) 1993-05-17

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