JPH01244849A - Manufacture of electric laminate - Google Patents
Manufacture of electric laminateInfo
- Publication number
- JPH01244849A JPH01244849A JP63073666A JP7366688A JPH01244849A JP H01244849 A JPH01244849 A JP H01244849A JP 63073666 A JP63073666 A JP 63073666A JP 7366688 A JP7366688 A JP 7366688A JP H01244849 A JPH01244849 A JP H01244849A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- prepreg
- hole
- filler
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000011347 resin Substances 0.000 claims abstract description 60
- 229920005989 resin Polymers 0.000 claims abstract description 60
- 239000000945 filler Substances 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims description 44
- 229910052751 metal Inorganic materials 0.000 claims description 44
- 239000000155 melt Substances 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 7
- 229910052802 copper Inorganic materials 0.000 abstract description 5
- 239000010949 copper Substances 0.000 abstract description 5
- 239000011888 foil Substances 0.000 abstract description 4
- 239000011889 copper foil Substances 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract 1
- 238000001035 drying Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 239000000843 powder Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 206010040844 Skin exfoliation Diseases 0.000 description 5
- 238000005553 drilling Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- 239000004760 aramid Substances 0.000 description 2
- 229920006231 aramid fiber Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 241000972773 Aulopiformes Species 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- 244000061354 Manilkara achras Species 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 235000019515 salmon Nutrition 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
本発明は、金属板を基板として用いた多層の電気積層板
の製造方法に関するらのである。The present invention relates to a method for manufacturing a multilayer electrical laminate using a metal plate as a substrate.
【従来の技術１
金属板を基板とする電気積層板においては、スルーホー
ルを形成するために孔明きの金属板が基板として用いら
れる。すなわち、金属板にスルーホールを形成すべき箇
所においてスルーホールの径よりも大きな通孔を設けて
おき、複数枚の金属板をプリプレグを介して重ねて加熱
加圧成形をおこなうことによって、プリプレグに含浸し
た樹脂を硬化させて各金属板を積層接着すると共にプリ
プレグに含浸した樹脂を金属板の各通孔に流入充填させ
て硬化させる。このとき各金属板の開には片面プリント
配線板や両面プリント配線板、多層プリント配線板など
の回路を形成した回路板がプリプレグを介して重ねてあ
り、各回路板を金属板間に積層接着するようにしである
。
そして金属板の通孔に充填させた樹脂の部分に・おいて
スルーホールを穿孔加工することによって、通孔内の樹
脂で金属板との間の絶縁性が確保されたスルーホールを
形成することができるのである。
さらにスルーホールの内周にはメツキを施してスルーホ
ールメツキ層が形成される。
しかし、金属板の通孔に充填した樹脂の部分において穿
孔加工して形成したスルーホールの内周面は樹脂面であ
るためにスルーホールメツキ層との密着性が悪く、この
ためにスルーホールの内周の樹脂面からスルーホールメ
ツキ層が剥がれ、スルーホール信頼性が低下するおそれ
があるという問題があった。そこで、プリプレグを調製
する樹脂中に充填剤を含有させておくことによって、金
属板の通孔に充填される樹脂中にも充填剤が混在される
ようにしておき、この樹脂の部分にスルーホールを穿孔
加工する際に内周面に充填剤が露出されるようにし、ス
ルーホールの内周面が充填剤で凹凸粗面となるようにし
てスルーホールメツキ層の密着性を高めることがおこな
われている。
【発明が解決しようとする課題】
しかしこのように樹脂に充填剤を配合した場合、充填剤
の粒子はその粒径の分布がばらついているために、成形
時の樹脂の流れに従った充填剤の移動の速度にばらつき
があり、充填剤が均一に分散されない状態で成形がなさ
れることがある。そしてこのように充填剤が均一に分散
されないと充填剤が多い部分と少ない部分とが生じ、充
填剤が多い部分では逆に樹脂の量が少なくなるために、
加熱応力が加わったときに充填剤と樹脂との界面に剥離
が生じ易く、積層板としての物性等に問題が生じ葛もの
であった。そしてこの界面剥離が発生するとその部分の
屈折率が変わるために色むらが出てくることになる。
本発明は上記の点に鑑みて為されたものであり、充填剤
と樹脂との開の剥離のおそれがなく色むらの発生のない
電気積層板の製造方法を提供することを目的とするもの
である。[Prior Art 1] In an electrical laminate using a metal plate as a substrate, a perforated metal plate is used as the substrate in order to form through holes. In other words, a hole larger than the diameter of the through hole is provided at the location where the through hole is to be formed in the metal plate, and multiple metal plates are layered with prepreg interposed in between and heated and press-formed to form the prepreg. The impregnated resin is cured and the metal plates are laminated and bonded together, and the resin impregnated into the prepreg is flowed and filled into each through hole of the metal plate and cured. At this time, circuit boards with circuits formed on them, such as single-sided printed wiring boards, double-sided printed wiring boards, and multilayer printed wiring boards, are stacked on the opening of each metal plate via prepreg, and each circuit board is laminated and bonded between the metal plates. That's what I do. Then, by drilling a through hole in the part of the resin filled in the through hole of the metal plate, the resin in the through hole forms a through hole that ensures insulation between it and the metal plate. This is possible. Further, the inner periphery of the through hole is plated to form a through hole plating layer. However, since the inner peripheral surface of the through hole formed by drilling in the resin filled part of the metal plate is a resin surface, it has poor adhesion with the through hole plating layer. There has been a problem in that the through-hole plating layer may peel off from the resin surface of the inner periphery, resulting in a risk that the reliability of the through-holes may deteriorate. Therefore, by including a filler in the resin used to prepare the prepreg, the filler is mixed in the resin that is filled into the through holes of the metal plate, and the resin is used to fill the through holes. When drilling the through-hole, the filler is exposed on the inner peripheral surface, and the inner peripheral surface of the through-hole is made to have an uneven surface with the filler to improve the adhesion of the through-hole plating layer. ing. Problems to be Solved by the Invention However, when a filler is blended with resin in this way, the particle size distribution of the filler particles varies, so the filler does not follow the flow of the resin during molding. There are variations in the speed of movement of the filler, and molding may be performed without the filler being uniformly dispersed. If the filler is not uniformly dispersed in this way, there will be areas with more filler and areas with less filler, and conversely, the amount of resin will be less in areas with more filler.
When thermal stress is applied, peeling tends to occur at the interface between the filler and the resin, causing problems in the physical properties of the laminate. When this interfacial peeling occurs, the refractive index of that part changes, resulting in color unevenness. The present invention has been made in view of the above points, and it is an object of the present invention to provide a method for manufacturing an electrical laminate that is free from the risk of peeling between the filler and the resin and free from color unevenness. It is.
上記課題を解決するために本発明は、充填剤を配合した
ａｆｔを含浸してプリプレグ３を調製すると共に通孔１
を設けた複数枚の金属板２をこのプリプレグ３を介して
重ね、これを加熱加圧成形してプリプレグ３に含浸した
樹脂を硬化させて各金属板２を積層接着すると共にプリ
プレグ３に含浸した樹脂を金属板２の各通孔１に流入充
填させて硬化させ、通孔１内の樹脂４の部分においてス
ルーホール５を穿孔加工して電気積層板を製造するにあ
たって、プリプレグ３としてその含浸した樹脂の１３０
℃での溶融粘度が３００〜１５００ポイズで、１７０℃
、２０ｋｇ／ｅ醜２．１０分間の条件でのグリニスが１
２〜３０％であるものを用いるようにしたことを特徴と
するものである。
以下本発明の詳細な説明する。プリプレグ３はプラスペ
ーパー（〃ラス不織布）やがラスクロス（７ｙラス紘布
）などの基材にエポキシ樹脂やポリイミド樹脂などの熱
硬化性樹脂を含浸して乾燥することによってｌ１ｉＩ！
ｌｉ！されるものであるが、プラスペーパーはガラスク
ロスに比べて組織が疎であって、含浸される樹脂を浸透
させて十分な量で保有することがでさるために、ガラス
ペーパーを基材としてプリプレグ３を調製するようにす
るのがよい。
また基材に含浸する樹脂には無機質等の充填剤が配合し
である。この充填剤としては、ＡＮ２０．、Ａｔ２ｚＯ
ｉ−Ｈ２Ｏ，Ａ１２０ｉ−３Ｈ２０，ｙルク、Ｍｇ Ｏ
ＳＣａ ＣＯ）、５ｂ２ｏ、、Ａ ｂ２０ ｓなどの球
状粉末、ＥｆプラスＤガラス、Ｔ７ｙラス、Ｒ〃ガラス
Ｑ７７′ラスなどのプラス繊維や、ケブラー（デュポン
社９１）、チク／−ラ（音大社製）などのアラミド繊維
等を細かく切断してすりつぶした針状粉末など、任意の
ものを用いることができる。そして充填剤はその粒径が
ばらついて分布する粉粒体として形成されているが、球
状粉末では直径０．１−・５０μ程度の範囲、針状粉末
では長さ２０〜１０００μ（好ましくは２０〜２００μ
）程度が好ましい。また充填剤の配合量は特に限定され
るものではないが１０〜１５０ＰＨＲ程度が好ましい。
そして、基材にこのような充填剤を配合した熱硬化性樹
脂のワニスを含浸し、これを加熱乾燥することによって
プリプレグ３を調製するにあたって、本発明ではプリプ
レグ３に含浸した樹脂が１３０゛Ｃでの溶融粘度が３０
０〜１５００ポイズに、１７０℃１２０ｋｇ／ｃｎ＋２
．１０分間の条件でのグワニスが１２〜３０％になるよ
うに乾燥条件を調整するものである。グリニスは樹脂流
れ性とも称される特性であり、プリプレグ３を１７０℃
の温度で加熱しつつ２０ｋｇ／ｃｏ２の圧力で１０分間
加圧し、この際にプリプレグ３から流れ出る樹脂の重量
を測定すると共にこの測定重量をプリプレグ３に含浸し
た樹脂の重量で除した百分率として算出される数値であ
る。樹脂はこの溶融粘度とグリニスで流動特性を評価す
ることができるものであり、溶融粘度が３００ポイズ未
満でグリニスが３０％を超える流動性の場合には、樹脂
の流動性が高すぎて後述する成形の際に樹脂の流れとと
もに充填剤を良好に流動させることができず、充填剤を
均一に分散させることができない。また逆に溶融粘度が
１５００ポイズを慈えグリニスが１２％未満の流動性の
場合には、樹脂の流動性が悪く成形性が低下して後述す
る成形の際に金属板２の通孔１への樹脂の充填不良が発
生するおそれがある。
従って、成形性を保持しつつ充填剤を均一に分散させる
ために本発明では、プリプレグ３に含浸したＵ！脂の１
３０℃での溶融粘度が３００〜１５゜Ｏポイズに、１７
０℃、２０ｋｇ／ ｃｍ２．１０分間の条件でのグリニ
スが１２〜３０％になるように設定する必要がある。
しかして上記のように調製したプリプレグ３を用い、金
属板２を基板とする電気積層板を製造するにあたっては
、まず、銅板など金属板２にスルーホール５を形成する
箇所においてパンチ加工やドリル加工などで通孔１を形
成する。通孔１はスルーホール５の直径よりも大きな直
径で形成されるものである。そして第１図（、）のよう
にプリプレグ３を介して金属板２を数枚重ね、さらに上
下にプリプレグ３を介して＠箔など金属箔９を重ねる。
このときさらに各金属板２の開には片面プリント配線板
や両面プリント配線板、多層プリント配線板などの回路
を形成した回路板１０がプリプレグ３を介して重ねであ
る。そしてこれを加熱加圧成形することによって、プリ
プレグ３に含浸したり（脂を硬化させて各金属板２と回
路板１ｏとを交互に積層接着させると共に最外層に金属
Ｍ９を積層接着させ、さらにプリプレグ３に含浸した樹
脂の一部を金属板２の各通孔１内に流入させて第１図（
ｂ）のようにこの樹脂４を通孔１内に充填させる。この
ようにして金属板２の通孔１に樹脂４を充填させた状態
で各金属板２を積層すると共に上下にそれぞれ金属箔９
を積層したのちに、ドリル加工やパンチ加工などで第１
図（ｃ）のようにスルーホール５を？ｌＬ加工する。ス
ルーホール５は通孔１に充填した樹脂４の部分において
通孔１の直径よりも小さい直径で形成されるものであり
、従ってスルーホール５の内周と金属板２どの開の電気
絶縁性は０（脂４によって確保されることになる。尚、
上記実施例では一部の金属板２にスルーホール５を貫通
させてアースなどをとることができるようにしである。
上記のようにスルーホール５を加工したのちに、スルー
ホール５の内周に銅などのスルーホールメツキを施して
スルーホールメツキ層を形成し、また金属ｔｔｉ９をエ
ツチング処理して回路を形成したりなどすることによっ
て、金属板２を基板とし回路板１０に形成された内層回
路と金属Ｍ９の加工で形成される外層回路がそれぞれ設
けられた電気積層板に仕上げるのである。このように形
成される電気積層板にあって、プリプレグ３に含浸した
樹脂中には充填剤が配合されているために、金属板２の
通孔１に充填される樹脂４中にも充填剤が含有されてお
り、従って樹脂４の部分においてスルーホール５を穿孔
加工するとスルーホール５の内周に充填剤が露出して凹
凸面が形成されることになる。このためにスルーホール
５の内周面が樹脂面であってもアンカー効果などでスル
ーホールメツキ層の密着性が高まるものである。In order to solve the above problems, the present invention prepares the prepreg 3 by impregnating aft containing a filler, and also prepares the prepreg 3 through the through holes 1.
A plurality of metal plates 2 provided with the above were stacked with the prepreg 3 interposed therebetween, and this was heated and press-molded to harden the resin impregnated into the prepreg 3, and the metal plates 2 were laminated and bonded, and the resin was impregnated into the prepreg 3. The resin was injected and filled into each through hole 1 of the metal plate 2 and cured, and a through hole 5 was punched in the resin 4 portion in the through hole 1 to produce an electrical laminate. 130 of resin
Melt viscosity at °C is 300-1500 poise, 170 °C
, 20kg/e Ugly 2. Glinnis under 10 minute conditions is 1
It is characterized in that a content of 2 to 30% is used. The present invention will be explained in detail below. Prepreg 3 is produced by impregnating a base material such as plus paper (〃lath nonwoven fabric) or lath cloth (7y lath cloth) with thermosetting resin such as epoxy resin or polyimide resin and drying it.
li! However, compared to glass cloth, Plus Paper has a looser structure and is able to penetrate and retain a sufficient amount of resin to be impregnated. It is best to prepare 3. In addition, the resin impregnated into the base material is blended with an inorganic filler. As this filler, AN20. , At2zO
i-H2O, A120i-3H20,yluc, MgO
Spherical powders such as SCa CO), 5b2o, and A b20 s, plus fibers such as Ef plus D glass, T7y lath, R〃glass Q77' lath, Kevlar (Dupont 91), Chiku/-ra (Ontaisha) ) Any material can be used, such as needle-shaped powder obtained by cutting and grinding aramid fibers such as Aramid fibers. The filler is formed as a powder or granule whose particle size is distributed with variation, but spherical powder has a diameter in the range of about 0.1-50μ, and needle-shaped powder has a length of 20 to 1000μ (preferably 20 to 50μ). 200μ
) degree is preferable. Further, the amount of filler blended is not particularly limited, but is preferably about 10 to 150 PHR. Then, in preparing the prepreg 3 by impregnating the base material with a thermosetting resin varnish containing such a filler and drying it by heating, in the present invention, the resin impregnated into the prepreg 3 is heated to 130°C. The melt viscosity at
0 to 1500 poise, 170℃120kg/cn+2
．． The drying conditions are adjusted so that the gwanis content after 10 minutes is 12 to 30%. Greenis is a property also called resin flowability, and prepreg 3 is heated at 170℃.
While heating at a temperature of 20 kg/co2 for 10 minutes, the weight of the resin flowing out from the prepreg 3 was measured and calculated as a percentage by dividing this measured weight by the weight of the resin impregnated into the prepreg 3. This is the numerical value. The fluidity of the resin can be evaluated using this melt viscosity and Glinnis, and if the melt viscosity is less than 300 poise and the Glinnis is more than 30%, the fluidity of the resin is too high and will be discussed later. During molding, the filler cannot flow well with the flow of the resin, and the filler cannot be uniformly dispersed. On the other hand, if the melt viscosity is 1500 poise and the Glinnis fluidity is less than 12%, the fluidity of the resin is poor and the moldability is reduced, and it will not flow into the through hole 1 of the metal plate 2 during molding, which will be described later. There is a risk of resin filling failure. Therefore, in the present invention, in order to uniformly disperse the filler while maintaining moldability, the prepreg 3 is impregnated with U! fat 1
The melt viscosity at 30°C is 300 to 15°O poise, 17
It is necessary to set the Glinnis ratio at 0°C and 20 kg/cm2 for 10 minutes to be 12 to 30%. Therefore, when manufacturing an electrical laminate using the prepreg 3 prepared as described above and the metal plate 2 as a substrate, first punching or drilling is performed at the location where the through hole 5 is to be formed in the metal plate 2 such as a copper plate. The through hole 1 is formed by etching, etc. The through hole 1 is formed with a diameter larger than that of the through hole 5. Then, as shown in FIG. 1 (,), several metal plates 2 are stacked with prepregs 3 interposed therebetween, and metal foils 9 such as @ foils are stacked above and below with prepregs 3 interposed therebetween. At this time, a circuit board 10 on which a circuit is formed, such as a single-sided printed wiring board, a double-sided printed wiring board, or a multilayer printed wiring board, is stacked on the opening of each metal plate 2 via a prepreg 3. Then, by heating and press-molding this, the prepreg 3 is impregnated (the fat is hardened and each metal plate 2 and the circuit board 1o are laminated and bonded alternately, and the metal M9 is laminated and bonded to the outermost layer. A part of the resin impregnated into the prepreg 3 is flowed into each through hole 1 of the metal plate 2, and as shown in FIG.
The resin 4 is filled into the through hole 1 as in b). In this way, each metal plate 2 is laminated with the resin 4 filled in the through hole 1 of the metal plate 2, and the metal foil 9 is placed on the top and bottom respectively.
After laminating the layers, the first step is performed by drilling or punching.
Through hole 5 as shown in figure (c)? LL processing. The through hole 5 is formed with a smaller diameter than the diameter of the through hole 1 in the resin 4 filled in the through hole 1, and therefore the electrical insulation between the inner circumference of the through hole 5 and the metal plate 2 is 0 (will be secured by fat 4. In addition,
In the above embodiment, a through hole 5 is passed through a part of the metal plate 2 so that it can be grounded. After processing the through hole 5 as described above, the inner periphery of the through hole 5 is plated with copper or the like to form a through hole plating layer, and the metal tti 9 is etched to form a circuit. By doing so, an electrical laminate is completed, in which the metal plate 2 is used as a substrate and the inner layer circuit formed on the circuit board 10 and the outer layer circuit formed by processing the metal M9 are respectively provided. In the electrical laminate formed in this way, since the resin impregnated into the prepreg 3 contains a filler, the resin 4 filled into the through hole 1 of the metal plate 2 also contains filler. Therefore, when a through hole 5 is drilled in a portion of the resin 4, the filler is exposed on the inner periphery of the through hole 5, and an uneven surface is formed. For this reason, even if the inner peripheral surface of the through hole 5 is a resin surface, the adhesion of the through hole plating layer is enhanced due to the anchor effect or the like.
【実施例１
以下本発明を実施例によって具体的に説明する。
Ｋ（鮭
硬化剤（ジシアンジアミド）含有ＰＲ−４難燃性エポキ
シ樹脂のワニスに充填剤として中心粒径（粒径分布の中
心値）が１０μのＡｌ２Ｏ３・Ｈ２０粉末を５０ Ｐ
ＨＲの配合量で配合して混合した。
次にこのエポキシ樹脂ワニスに基材としてがうスベーバ
ー（日本バイリーン製ＥＰ−４０７５ニア５ｇ／ｍ’）
を浸漬し、次いで乾燥することによって、７８０ｇ／ｍ
２のプリプレグを作成した。ここで乾燥の条件は、プリ
プレグ中の樹脂の１３Ｑ℃での溶融粘度が７００ポイズ
に、１７０℃、２０ｋｇ／ｅｍ２．１０分間の条件での
グリニスが２０％になるように設定した。
一方、金属板として５００＋ｗＸ４００ｍｍＸＯ。
５■の銅板を用い、直径が１．５１１１１１の通孔を１
．８１ピツチで縦１００×横６０の個数設けた。そして
この金属板を３枚、両面銅張ポリイミド樹脂積層板の銅
箔をエツチング加工して回路を設けることによって形成
した両面プリント配線板を回路板として２枚用い、これ
らを第１図（ａ）のように上記プリプレグを介して交互
に重ねると共に上下にプリプレグを介して銅箔を重ね、
２０ ｋｇ／ Ｃｍ２の加圧条件を′維持しつつ、１４
０℃で２０分間、１７０℃で９０分間加熱すると共に２
０分間を要して冷却して積層成形をおこなうことによっ
て、金属板と回路板とを交互に積層し表面に＃ｌ箔を張
りた多層積層板を得た。
こののちに金属板の通孔の部分におい１”、多層積層板
に直径が０６９１のスルーホールをドリル加工し、そし
てさらに銅メツキをおこなってスルーホールの内周にス
ルーホールメツキを施した。
Ｋ牧胴士
プリプレグを作成する際の乾燥の条件を、グリプレグ中
の樹脂の１３０℃での溶融粘度が２０００ポイズに、１
７０℃、２０ ｋｇ／ ０ｍ２．１０分間の条件でのグ
リニスが１０％になるように設定した他は、実施例と同
様にした。
ル１（列」ニ
プリプレグを作成する際の乾燥の条件を、プリプレグ中
の樹脂の１３０℃での溶融粘度が２００ポイズに、１７
０℃，２０ｋｇ／ｃｍ２．１０分間の条件でのグリニス
が３５％になるように設定しただ他は、実施例と同様に
した。
上記実施例及び比較例１〜２で得た多層積層板について
、２６０″Ｃ″？６０秒間加熱処理した後の色むらの発
生の有無を測定し、また金属板の通孔への樹脂の充填性
を測定した。結果を第１表に示温 １ 表
○：良好 △：やや不良 ×：不良
第１表の結果にみられるように、溶融粘度が高くグリニ
スが低い比較例１のものでは樹脂の流動性が悪くて充填
性に問題があり、溶融粘度が低くグリニスが高い比較例
２のものでは樹脂の流動性が高すぎて充填剤が均一に流
れず、充填剤が均一に分散しないために樹脂と充填剤と
の間に加熱応力による界面剥離が生じて加熱応力により
色むらが発生することが確認される。従って実施例のよ
うに溶融粘度は３００〜１５００ポイズの範囲に、グリ
ニスは１２〜３０％の範囲に設定する必要のあることが
確認される。
【発明の効果】
上述のように本発明にあっては、プリプレグとしてその
含浸した樹脂の１３０℃での溶融粘度が３００〜１５０
０ボイスで、１７０℃、２０ｋｇ／ＣｌｌＩ２．１０分
間の条件でのグリニスが１２〜３０％であるものを用い
るようにしたので、成形に際して金属板の通孔への樹脂
の充填性を損なうことなく充填剤を樹脂の流れとともに
均一に流動させることができ、充填剤を均一に分散させ
て充填剤の偏在による充填剤と樹脂との界面剥離の発生
を防止して、色むらが生じることを防止することがでさ
るものである。[Example 1] The present invention will be specifically explained below with reference to Examples. 50 P of Al2O3/H20 powder with a center particle size (center value of particle size distribution) of 10μ was added as a filler to PR-4 flame-retardant epoxy resin varnish containing K (salmon hardening agent (dicyandiamide)).
They were blended and mixed in the amount of HR. Next, a substrate (EP-4075 near 5 g/m' manufactured by Nippon Vilene) is applied to this epoxy resin varnish as a base material.
780g/m by soaking and then drying
2 prepregs were created. Here, the drying conditions were set such that the melt viscosity of the resin in the prepreg at 13Q°C was 700 poise, and the Glynis ratio was 20% at 170°C and 20 kg/em2 for 10 minutes. On the other hand, 500+wX400mmXO as a metal plate. Using a 5-inch copper plate, make one through hole with a diameter of 1.511111.
．． The number of pieces was set at 81 pitches, 100 vertically by 60 horizontally. Three of these metal plates and two double-sided printed wiring boards formed by etching the copper foil of a double-sided copper-clad polyimide resin laminate to form a circuit were used as circuit boards, and these were assembled as shown in Figure 1(a). As shown in the above, the above prepregs are layered alternately, and copper foil is layered on top and bottom through the prepregs,
While maintaining the pressurization condition of 20 kg/Cm2,
Heating at 0℃ for 20 minutes and at 170℃ for 90 minutes and 2
By cooling for 0 minutes and performing lamination molding, a multilayer laminate in which metal plates and circuit boards were alternately laminated and #l foil was applied on the surface was obtained. After this, a through hole with a diameter of 1" was drilled in the through hole part of the metal plate and a diameter of 0691 in the multilayer laminate board, and copper plating was further performed to plate the inner circumference of the through hole. K The drying conditions when making Makidoji prepreg were set such that the melt viscosity of the resin in Gripreg at 130°C was 2000 poise, and 1
The procedure was the same as in the example except that the Glinnis was set to 10% under the conditions of 70° C., 20 kg/0 m2, and 10 minutes. The drying conditions when making the 1st column (column) prepreg were set such that the melt viscosity of the resin in the prepreg at 130°C was 200 poise, 17
The procedure was the same as in the example except that the Glinnis was set to 35% under the conditions of 0° C., 20 kg/cm2, and 10 minutes. Regarding the multilayer laminates obtained in the above Examples and Comparative Examples 1 and 2, 260″C″? After heat treatment for 60 seconds, the presence or absence of color unevenness was measured, and the ability of the resin to fill the through holes of the metal plate was also measured. The results are shown in Table 1. 1 Table ○: Good △: Slightly poor ×: Poor As seen in the results in Table 1, in Comparative Example 1, which had a high melt viscosity and a low Glynis, the fluidity of the resin was poor. In Comparative Example 2, which had a problem with filling properties and had a low melt viscosity and high Glinnis, the fluidity of the resin was too high and the filler did not flow uniformly, and the filler was not evenly dispersed, so the resin and filler did not mix well. It is confirmed that interfacial peeling occurs due to heating stress during this time, and color unevenness occurs due to heating stress. Therefore, it is confirmed that it is necessary to set the melt viscosity in the range of 300 to 1500 poise and the Glynis in the range of 12 to 30% as in the examples. Effects of the Invention As described above, in the present invention, the melt viscosity of the resin impregnated as a prepreg at 130°C is 300 to 150.
Since we used a material with a Glinnis of 12 to 30% under the conditions of 0 voice, 170°C, 20kg/CllI2.10 minutes, we did not impair the ability of the resin to fill the holes in the metal plate during molding. The filler can be flowed uniformly with the flow of the resin, and the filler is evenly dispersed to prevent interfacial peeling between the filler and the resin due to uneven distribution of the filler, thereby preventing color unevenness. It is a good thing to do.
第１図（ａ）（ｂ）（ｅ）は電気積層板の製造の各工程
を示す断面図である。
１は通孔、２は金属板、３はプリプレグ、４は通孔内の
樹脂、５はスルーホールである。FIGS. 1(a), 1(b), and 1(e) are cross-sectional views showing each step of manufacturing an electrical laminate. 1 is a through hole, 2 is a metal plate, 3 is a prepreg, 4 is a resin in the through hole, and 5 is a through hole.
Claims (1)
製すると共に通孔を設けた複数枚の金属板をこのプリプ
レグを介して重ね、これを加熱加圧成形してプリプレグ
に含浸した樹脂を硬化させて各金属板を積層接着すると
共にプリプレグに含浸した樹脂を金属板の各通孔に流入
充填させて硬化させ、通孔内の樹脂の部分においてスル
ーホールを穿孔加工して電気積層板を製造するにあたっ
て、プリプレグとしてその含浸した樹脂の１３０℃での
溶融粘度が３００〜１５００ポイズで、１７０℃、２０
ｋｇ／ｃｍ＾２、１０分間の条件でのグリニスが１２〜
３０％であるものを用いるようにしたことを特徴とする
電気積層板の製造方法。(1) Prepreg is prepared by impregnating a resin containing a filler, stacking multiple metal plates with through holes through the prepreg, and molding them under heat and pressure to form the prepreg with the resin impregnated. After curing, each metal plate is laminated and bonded, and the resin impregnated with the prepreg is flowed into and filled into each through hole of the metal plate and cured, and a through hole is drilled in the resin part of the through hole to form an electrical laminate. In manufacturing, the impregnated resin as a prepreg has a melt viscosity of 300 to 1500 poise at 130°C,
kg/cm^2, Glinnis under the conditions of 10 minutes is 12 ~
30% of the electrical laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63073666A JPH01244849A (en) | 1988-03-28 | 1988-03-28 | Manufacture of electric laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63073666A JPH01244849A (en) | 1988-03-28 | 1988-03-28 | Manufacture of electric laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01244849A true JPH01244849A (en) | 1989-09-29 |
Family
ID=13524803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63073666A Pending JPH01244849A (en) | 1988-03-28 | 1988-03-28 | Manufacture of electric laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01244849A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5120384A (en) * | 1989-05-25 | 1992-06-09 | Matsushita Electric Works, Ltd. | Method of manufacturing multilayer laminate |
| JP2008084993A (en) * | 2006-09-26 | 2008-04-10 | Matsushita Electric Works Ltd | Method of manufacturing printed wiring board |
| US7914898B2 (en) * | 2003-12-09 | 2011-03-29 | Kabushiki Kaisha Kobe Seiko Sho | Resin-coated metal plate for use in perforating printed-wiring board |
| CN103512832A (en) * | 2013-10-09 | 2014-01-15 | 广东生益科技股份有限公司 | Method for detecting flowing condition of glue during laminating boards |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54163359A (en) * | 1978-06-16 | 1979-12-25 | Hitachi Ltd | Method of producing multiilayer printed circuit board |
| JPS5998587A (en) * | 1982-11-27 | 1984-06-06 | 日立化成工業株式会社 | Metal core-filled printed circuit board |
-
1988
- 1988-03-28 JP JP63073666A patent/JPH01244849A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54163359A (en) * | 1978-06-16 | 1979-12-25 | Hitachi Ltd | Method of producing multiilayer printed circuit board |
| JPS5998587A (en) * | 1982-11-27 | 1984-06-06 | 日立化成工業株式会社 | Metal core-filled printed circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5120384A (en) * | 1989-05-25 | 1992-06-09 | Matsushita Electric Works, Ltd. | Method of manufacturing multilayer laminate |
| US7914898B2 (en) * | 2003-12-09 | 2011-03-29 | Kabushiki Kaisha Kobe Seiko Sho | Resin-coated metal plate for use in perforating printed-wiring board |
| JP2008084993A (en) * | 2006-09-26 | 2008-04-10 | Matsushita Electric Works Ltd | Method of manufacturing printed wiring board |
| CN103512832A (en) * | 2013-10-09 | 2014-01-15 | 广东生益科技股份有限公司 | Method for detecting flowing condition of glue during laminating boards |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2010103805A1 (en) | Multilayer wiring substrate producing method and multilayer wiring substrate obtained by the same | |
| EP1353541B1 (en) | Circuit board and production method therefor | |
| JPH01244849A (en) | Manufacture of electric laminate | |
| JP2006182918A (en) | Prepreg, rigid flexible board and multilayer circuit board | |
| JP3951601B2 (en) | Manufacturing method for composite laminates | |
| JPH02133439A (en) | Production of electrical laminate | |
| JP2675810B2 (en) | Manufacturing method of electric laminate | |
| JPH04215496A (en) | Manufacture of multilayer circuit board | |
| JPH01235293A (en) | Manufacture of electric laminated board | |
| JPH01244853A (en) | Manufacture of electric laminate | |
| JPH01244854A (en) | Manufacture of electric laminate | |
| JPH11214844A (en) | Production of multilayer board | |
| JPS61226998A (en) | Manufacture of metal core printed wiring board | |
| JPH01244852A (en) | Manufacture of electric laminate | |
| JP3883727B2 (en) | Aramid fiber base insulation board and printed wiring board | |
| JPH02133437A (en) | Production of electrical laminate | |
| JP2003012836A (en) | Prepreg and laminate using the same | |
| JPH01244851A (en) | Manufacture of electric laminate | |
| JPH0466181B2 (en) | ||
| JPH01235295A (en) | Manufacture of electric laminated board | |
| JP2633286B2 (en) | Manufacturing method of electric laminate | |
| TWI418593B (en) | Non-halogen varnish and a prepreg and a laminated substrate thereof | |
| JPH02133444A (en) | Production of electrical laminate | |
| JPH02133443A (en) | Production of electrical laminate | |
| JPH01244855A (en) | Manufacture of electric laminate |