JPH0125217B2 - - Google Patents
Info
- Publication number
- JPH0125217B2 JPH0125217B2 JP57145975A JP14597582A JPH0125217B2 JP H0125217 B2 JPH0125217 B2 JP H0125217B2 JP 57145975 A JP57145975 A JP 57145975A JP 14597582 A JP14597582 A JP 14597582A JP H0125217 B2 JPH0125217 B2 JP H0125217B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- resin
- electronic components
- coating
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 239000002131 composite material Substances 0.000 claims description 14
- 238000009413 insulation Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007610 electrostatic coating method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Insulating Of Coils (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野と従来技術〕
本発明は複数個の電子部品素子を一体に結合し
て成形する複合電子部品の製造法に関するもので
ある。表面に樹脂被覆が施される電子部品によつ
て構成された従来の複合電子部品は第１図に示す
ように、完成された電子部品例えばコンデンサ
１，２の表面の樹脂被覆３，４を接着剤５で接合
することによつて複数個の電子部品を１個の複合
電子部品としている。第２図は複合電子部品の他
の従来例で、樹脂被覆のない未完成の電子部品に
よつて形成されている。同図において６は樹脂被
覆のない電子部品であり、７は部品６と絶縁する
ための絶縁被膜８を設けた電子部品である。９は
これらを収容するケース、１０は充填された樹脂
である。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application and Prior Art] The present invention relates to a method for manufacturing a composite electronic component by integrally bonding and molding a plurality of electronic component elements. A conventional composite electronic component composed of electronic components whose surfaces are coated with resin is, as shown in FIG. By bonding with agent 5, a plurality of electronic components are made into one composite electronic component. FIG. 2 shows another conventional example of a composite electronic component, which is formed by an unfinished electronic component without resin coating. In the figure, 6 is an electronic component without a resin coating, and 7 is an electronic component provided with an insulating coating 8 for insulating it from the component 6. Reference numeral 9 is a case that accommodates these, and reference numeral 10 is a filled resin.
ところで上記従来の複合電子部品の製造法は、
第１図の場合は個々の電子部品に樹脂被覆を設け
る工程と、これらの電子部品を複合する工程とよ
り成立つている。また、第２図の場合は、電子部
品に絶縁被覆８を設ける工程と、ケース９に収容
して樹脂１０を注入する工程とより成立つてい
る。本発明はこれらの工程を簡素合理化して生産
性の高い複合電子部品の製造法とすることを目的
とするものである。
By the way, the above-mentioned conventional method for manufacturing composite electronic components is as follows:
The case shown in FIG. 1 consists of a step of providing a resin coating on each electronic component and a step of combining these electronic components. The case shown in FIG. 2 consists of the step of providing an insulating coating 8 on the electronic component and the step of housing it in a case 9 and injecting the resin 10 therein. The object of the present invention is to simplify and rationalize these steps to provide a highly productive method for manufacturing composite electronic components.
本発明は最終工程において表面に樹脂被覆が施
される電子部品の複数個を一体に結合して複合電
子部品とする工程において、複合される各電子部
品の表面に相互間の絶縁を保持することのできる
絶縁被覆を未硬化の熱硬化性樹脂によつて形成
し、この絶縁被覆をその表面に設けた複数個の電
子部品を相互に接合し、これに熱処理を施して前
記未硬化の樹脂絶縁被覆を溶融、硬化して前記複
数個の電子部品を一体に結合することを特徴とす
る複合電子部品の製造法である。
The present invention is directed to maintaining insulation between the surfaces of each electronic component to be composited in the process of combining a plurality of electronic components whose surfaces are coated with resin in the final step to form a composite electronic component. A plurality of electronic components with this insulating coating provided on the surface thereof are bonded to each other, and a heat treatment is applied to the uncured resin insulation. This method of manufacturing a composite electronic component is characterized in that the plurality of electronic components are joined together by melting and hardening the coating.
本発明の実施例を第３図について説明する。イ
は電子部品１１，１２の表面に未硬化の樹脂絶縁
被覆１３を形成した状態を示している。使用され
る樹脂は熱硬化性樹脂例えばエポキシ樹脂の粉末
であつて、流動浸漬法、あるいは静電塗装法等に
よつて形成される。ロはこの粉末樹脂を塗装した
電子部品を接合した状態を示しており、電子部品
１１，１２はこの粉末樹脂によつて完全に絶縁さ
れている。ハはロに熱処理を施して樹脂絶縁被覆
１３を溶融して硬化させた状態を示している。１
４は硬化した樹脂保護被覆である。なお、複合さ
れる複数個の電子部品のうち、表面に、すでに樹
脂被覆を有するものがある場合は、そのものにつ
いては未硬化の樹脂絶縁被覆１３を設ける必要は
なく、未硬化の樹脂絶縁被覆１３を有する他の電
子部品と直接、接合すればよい。 An embodiment of the invention will be described with reference to FIG. A shows a state in which an uncured resin insulation coating 13 is formed on the surfaces of electronic components 11 and 12. The resin used is a powder of a thermosetting resin, such as an epoxy resin, and is formed by a fluidized dipping method, an electrostatic coating method, or the like. B shows a state in which electronic components coated with this powdered resin are joined, and the electronic components 11 and 12 are completely insulated by this powdered resin. C shows a state where B is heat-treated to melt and harden the resin insulation coating 13. 1
4 is a cured resin protective coating. Note that if some of the multiple electronic components to be composited already have a resin coating on their surface, there is no need to provide the uncured resin insulation coating 13 on the surface of the electronic component; It can be directly connected to other electronic components having
以上述べたように本発明の製造法は電子部品の
表面被覆と複合とを同一工程で同時に行なうこと
ができるので、表面に樹脂被覆を有する複合電子
部品の生産性を著しく向上するすぐれた効果を有
する。
As described above, the manufacturing method of the present invention allows the surface coating and composite of electronic components to be performed simultaneously in the same process, and therefore has the excellent effect of significantly improving the productivity of composite electronic components having resin coating on the surface. have
第１図：従来の複合電子部品を示す図、第２
図：従来の他の複合電子部品を示す図、第３図：
本発明の製造法の説明図で、イ，ロ，ハはその工
程を示す。
記号、１１，１２……電子部品、１３……未硬
化の樹脂絶縁被覆、１４……硬化した樹脂保護被
覆。
Figure 1: Diagram showing a conventional composite electronic component, Figure 2
Figure: Diagram showing another conventional composite electronic component, Figure 3:
FIG. 1 is an explanatory diagram of the manufacturing method of the present invention, where A, B, and C indicate the steps. Symbols, 11, 12... Electronic parts, 13... Uncured resin insulation coating, 14... Cured resin protective coating.
Claims (1)
電子部品の複数個を一体に結合して複合電子部品
とする工程において、複合される各電子部品の表
面に、相互間の絶縁を保持することのできる絶縁
被覆を未硬化の熱硬化性樹脂によつて形成し、こ
の絶縁被覆をその表面に設けた複数個の電子部品
を相互に接合し、これに熱処理を施して前記未硬
化の樹脂絶縁被覆を溶融硬化して前記複数個の電
子部品を一体に結合することを特徴とする複合電
子部品の製造法。1. In the process of combining a plurality of electronic components whose surfaces are coated with resin in the final process to form a composite electronic component, it is necessary to maintain insulation between the surfaces of each electronic component to be composited. A plurality of electronic components having this insulating coating provided on the surface thereof are bonded to each other, and a heat treatment is applied to the insulating coating to form the uncured resin insulating coating. A method for manufacturing a composite electronic component, characterized in that the plurality of electronic components are joined together by melting and hardening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57145975A JPS5935417A (en) | 1982-08-23 | 1982-08-23 | Method of producing composite electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57145975A JPS5935417A (en) | 1982-08-23 | 1982-08-23 | Method of producing composite electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5935417A JPS5935417A (en) | 1984-02-27 |
| JPH0125217B2 true JPH0125217B2 (en) | 1989-05-16 |
Family
ID=15397304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57145975A Granted JPS5935417A (en) | 1982-08-23 | 1982-08-23 | Method of producing composite electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5935417A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61278121A (en) * | 1985-06-03 | 1986-12-09 | 北陸電気工業株式会社 | Manufacture of compound electronic component |
| JPS62193108A (en) * | 1986-02-19 | 1987-08-25 | Kijima Musen Kk | Reinforcing film of small-sized electric winding part and production thereof |
| JPS63168036A (en) * | 1986-12-29 | 1988-07-12 | Tanaka Electron Ind Co Ltd | Connection of semiconductor material and connecting material used therefor |
| JPH09279380A (en) * | 1996-04-10 | 1997-10-28 | Hiranuma Sangyo Kk | Anodic electrolysis electrode material using a noble metal-based amorphous alloy that has excellent plastic workability and can be applied to large parts |
-
1982
- 1982-08-23 JP JP57145975A patent/JPS5935417A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5935417A (en) | 1984-02-27 |
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