JPH0125431B2 - - Google Patents
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- Publication number
- JPH0125431B2 JPH0125431B2 JP55157066A JP15706680A JPH0125431B2 JP H0125431 B2 JPH0125431 B2 JP H0125431B2 JP 55157066 A JP55157066 A JP 55157066A JP 15706680 A JP15706680 A JP 15706680A JP H0125431 B2 JPH0125431 B2 JP H0125431B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature compensation
- magnetoresistive
- magnetic field
- temperature
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Measuring Magnetic Variables (AREA)
Description
【発明の詳細な説明】
本発明は温度補償付磁気抵抗効果型薄膜磁気セ
ンサ(以下温度補償付MRセンサと略称)に係
り、さらに詳しくは外部の信号磁界によつて温度
補償部のMR素子が影響を受けにくく、温度に大
きく反応するように構成した温度補償付MRセン
サに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a temperature-compensated magnetoresistive thin film magnetic sensor (hereinafter referred to as a temperature-compensated MR sensor). The present invention relates to a temperature-compensated MR sensor that is not easily affected by temperature and is configured to respond greatly to temperature.
Fe,Ni合金や、NiCo合金等から成る磁気抵抗
効果素子(MR素子)を利用したMRセンサは広
く知られているが、素子自体の抵抗は温度依存性
があり温度補償が必要とされている。 MR sensors that use magnetoresistive elements (MR elements) made of Fe, Ni alloys, NiCo alloys, etc. are widely known, but the resistance of the element itself is temperature dependent and requires temperature compensation. .
この種の従来の温度補償付MRセンサの構造を
第1図に示す。即ち、第1図において符号1で示
すものはガラス等からなる基板でこの基板1の磁
気記録媒体摺動の近傍において、その側面には磁
気信号検出部となるMR素子2が薄膜堆積法によ
り形成されている。このMR素子2の磁気異方性
方位は第1図において矢印5で示す方向となるよ
うに形成されている。又、このMR素子2から所
定距離pだけ離れて温度補償部となるMR素子3
が前記MR素子2と同時に薄膜堆積法により平行
に形成されている。これらのMR素子2,3は薄
膜堆積法により形成された後、フオトリゾグラフ
イー技術によつて整形される。 The structure of this type of conventional temperature compensated MR sensor is shown in FIG. That is, the reference numeral 1 in FIG. 1 is a substrate made of glass or the like, and an MR element 2 serving as a magnetic signal detection section is formed on the side surface of the substrate 1 in the vicinity of the sliding magnetic recording medium by a thin film deposition method. has been done. The magnetic anisotropy direction of this MR element 2 is formed in the direction shown by arrow 5 in FIG. Further, an MR element 3 is located a predetermined distance p from this MR element 2 and serves as a temperature compensator.
are formed parallel to the MR element 2 by a thin film deposition method. These MR elements 2 and 3 are formed by a thin film deposition method and then shaped by a photolithography technique.
これらMR素子2,3を形成したのちAlやCu
などの金属を薄膜堆積法により電極4として形成
し、前記MR素子2,3に電気的に接続する。 After forming these MR elements 2 and 3, Al or Cu
The electrode 4 is formed by a thin film deposition method, and is electrically connected to the MR elements 2 and 3.
このようにして、温度補償付MRセンサが得ら
れるが、その後実装する時は必要に応じて保護膜
を付着させたり、カバーガラスをつけたり、端面
を切断したり研磨したりなどの種々の工程を経
る。 In this way, a temperature-compensated MR sensor is obtained, but when it is subsequently mounted, various steps such as attaching a protective film, attaching a cover glass, cutting and polishing the end face, etc., are necessary. pass
このような温度補償付MRセンサを使用する場
合を簡単な回路の一例を第2図に示す。第2図に
おいてMR1は前記MR素子2に相当し、MR2
は前記MR素子3に相当する。Ra,Rbは抵抗を
示す。このようにブリツヂを形成するとブリツヂ
のバランス状態は次の(1)式で表わされる。 FIG. 2 shows an example of a simple circuit in which such a temperature-compensated MR sensor is used. In FIG. 2, MR1 corresponds to the MR element 2, and MR2
corresponds to the MR element 3 described above. Ra and Rb show resistance. When a bridge is formed in this way, the balanced state of the bridge is expressed by the following equation (1).
MR1×Rb=MR2×Ra (1)
(1)式において、任意の温度においてMR1に信
号磁界が加わらない時、Vの電圧が0になり、信
号磁界がMR1に印加されると検出部のMR素子
であるMR1の抵抗のみが変化し、電圧変動とな
り出力が得られる。従つて、もし信号磁界によつ
て温度補償の役割を果たすMR素子であるMR2
の抵抗値が変化すれば、正しい信号出力が得られ
ないことになる。 MR1×Rb=MR2×Ra (1) In equation (1), when no signal magnetic field is applied to MR1 at any temperature, the voltage of V becomes 0, and when a signal magnetic field is applied to MR1, the MR of the detection part Only the resistance of the element MR1 changes, resulting in voltage fluctuation and output. Therefore, if MR2, which is an MR element that plays the role of temperature compensation by the signal magnetic field,
If the resistance value changes, correct signal output will not be obtained.
以上のように従来の温度補償付MRセンサは外
部磁界に対して温度補償部の抵抗値が変化しにく
くなるように考慮する必要があり、そのためには
検出部と温度補償部のMR素子2,3の間隔Pを
大きくとる必要がある。例えば、第1図に示すよ
うにMR素子2の幅をw、長さをlとした時、w
=20μ、l=150μmの時、P=250μm以上を必要
とする。この結果、全体が大型化し、温度補償の
精度が悪くなり温度補償に時間的なずれが生じる
などの種々の欠点があつた。 As mentioned above, in the conventional temperature-compensated MR sensor, it is necessary to take into account that the resistance value of the temperature-compensating part is difficult to change due to external magnetic fields. 3. It is necessary to take a large interval P. For example, as shown in FIG. 1, when the width of the MR element 2 is w and the length is l, then w
When P=20μ and l=150μm, P=250μm or more is required. As a result, the overall size has increased, the accuracy of temperature compensation has deteriorated, and there have been various drawbacks such as a time lag in temperature compensation.
本発明の目的は外部の信号磁界に温度補償部の
MR素子が影響されにくく、温度補償機能を著し
く向上させた温度補償付MRセンサを提供するに
ある。 The purpose of the present invention is to apply a temperature compensator to an external signal magnetic field.
An object of the present invention is to provide a temperature-compensated MR sensor in which an MR element is not easily affected and the temperature compensation function is significantly improved.
本発明においては上記の目的を達成するため
に、基板の磁気記録媒体摺動面側に信号磁界検出
用の磁気抵抗効果素子が形成され、これより内側
に温度補償用の磁気抵抗効果素子を形成すると共
に両磁気抵抗効果素子の軸線方向を互いに非平行
とした薄膜磁気センサにおいて、前記温度補償用
の磁気抵抗効果素子の幅及び膜厚の寸法を反磁界
Hdと異方性磁界Hkに関してHd>Hkとなる寸法
に設定した構造を採用した。 In order to achieve the above object, in the present invention, a magnetoresistive element for signal magnetic field detection is formed on the magnetic recording medium sliding surface side of the substrate, and a magnetoresistive element for temperature compensation is formed inside this. In addition, in a thin film magnetic sensor in which the axial directions of both magnetoresistive elements are non-parallel to each other, the width and film thickness dimensions of the magnetoresistive element for temperature compensation are set in a demagnetizing field.
A structure was adopted in which dimensions were set such that Hd > Hk with respect to Hd and anisotropic magnetic field Hk.
以下、図面に示す実施例に基いて本発明の詳細
を説明する。 Hereinafter, details of the present invention will be explained based on embodiments shown in the drawings.
第3図は本発明の一実施例を説明するもので、
図中、第1図と同一部分又は相当する部分には同
一符号を付し、その説明は省略する。 FIG. 3 illustrates an embodiment of the present invention.
In the figure, parts that are the same as or correspond to those in FIG.
本実施例にあつては温度補償部のMR素子3を
検出部のMR素子2に対してほぼ直角方向で、そ
の幅を20〜40μmに形成してある。そしてMR素
子2,3の両者共その磁気異方性は第3図に矢印
5で示す方向となつている。このような構造を採
用すると温度補償部のMR素子3が外部の信号磁
界に対して影響されないことになるが、その理由
を以下に説明する。 In this embodiment, the MR element 3 of the temperature compensating section is formed in a direction substantially perpendicular to the MR element 2 of the detecting section, and has a width of 20 to 40 .mu.m. The magnetic anisotropy of both MR elements 2 and 3 is in the direction shown by arrow 5 in FIG. If such a structure is adopted, the MR element 3 of the temperature compensator will not be affected by the external signal magnetic field, and the reason for this will be explained below.
今第4図において、MR素子3に流れる電流の
方向を矢印7とすると、MR素子3の磁化容易軸
は矢印6で表わされ、両者の成す角度φは90度と
なる。そして磁化の方向を矢印8で示した場合、
電流の方向7と磁化の方向8との成す角がθであ
る場合、磁化のエネルギーEは次の(2)式で表わさ
れる。 In FIG. 4, if the direction of the current flowing through the MR element 3 is indicated by arrow 7, the axis of easy magnetization of the MR element 3 is indicated by arrow 6, and the angle φ between the two is 90 degrees. If the direction of magnetization is indicated by arrow 8,
When the angle between the current direction 7 and the magnetization direction 8 is θ, the magnetization energy E is expressed by the following equation (2).
E=−Ku sin2(π/2−θ)+1/2
MHd cos(π/2+θ) (2)
(2)式において、Kuは磁化異方性定数、Mは磁
化の大きさ、Hdは形状異方性による反磁界で、
次の(3)式で表わされる。 E=-Ku sin 2 (π/2-θ)+1/2 MHd cos (π/2+θ) (2) In equation (2), Ku is the magnetization anisotropy constant, M is the magnitude of magnetization, and Hd is the shape Due to the demagnetizing field due to anisotropy,
It is expressed by the following equation (3).
Hd=t/wM sinθ (3)
(3)式において、tはMR素子の膜厚、wは幅を
示す。上記の(2),(3)式から磁化のエネルギーEは
次の(4)式で表わされることになる。 Hd=t/wM sinθ (3) In equation (3), t is the film thickness of the MR element, and w is the width. From the above equations (2) and (3), the magnetization energy E is expressed by the following equation (4).
E=−Ku sin2(π/2−θ)−1/2M2t/wsin2
θ(4)
(4)式で示すエネルギーEの値が極小になる方位
θの向きに磁化が安定する。この磁化が安定する
時は(4)式を微分した値がOの時であり、次の(5)式
で表わされる。 E=-Ku sin 2 (π/2-θ)-1/2M 2 t/wsin 2
θ(4) The magnetization is stabilized in the direction θ where the value of the energy E shown by equation (4) becomes minimum. When this magnetization is stable, the value obtained by differentiating equation (4) is O, which is expressed by the following equation (5).
∂E/∂θ=2Ku sinθcosθ−M2t/w
sinθcosθ=O (5)
(5)式からθ=O又はπ/2の時がMの安定方向と
なり、
Hd>Hkのときθ=O (6)
Hd<Hkのときθ=π/2 (7)
となる。従つて、反磁界Hdが異方性磁界Hkより
大きければ磁化Mの向きは電流方向となり、さら
に信号磁界は常にMR素子3の電流方向と一致し
ているため、信号磁界に対しては何ら変化をしな
い。即ち、θ=Oとなつているわけである。 ∂ E /∂θ=2Ku sinθcosθ−M 2 t/w sinθcosθ=O (5) From equation (5), when θ=O or π/2 is the stable direction of M, and when Hd>Hk, θ=O ( 6) When Hd<Hk, θ=π/2 (7). Therefore, if the demagnetizing field Hd is larger than the anisotropic magnetic field Hk, the direction of magnetization M will be in the current direction, and since the signal magnetic field always matches the current direction of the MR element 3, there will be no change in the signal magnetic field. Don't do it. That is, θ=O.
なお通常はMR素子の膜厚は0.05〜0.1μ、Hkは
5〜10¨0、磁化の強さ4πMsは8000ガウス程度が
多く、反磁界HdがHkより十分大きくなるように
するにはMR素子3の幅は40μ以下がよい。又、
MR素子2と3とは直角に配置し、Hd>Hkにな
るようにすれば、両者をどのように接近させても
温度補償部のMR素子3は信号磁界をひろうこと
はない。 Usually, the film thickness of the MR element is 0.05 to 0.1μ, Hk is 5 to 10¨0, and the magnetization strength 4πMs is about 8000 Gauss. The width of 3 is preferably 40μ or less. or,
If the MR elements 2 and 3 are arranged at right angles so that Hd>Hk, the MR element 3 of the temperature compensator will not receive a signal magnetic field no matter how close they are brought together.
本実施例は以上のように構成されているため、
信号磁界に対して温度補償部のMR素子の抵抗変
化がないように構成でき、(1)構造が簡単で、(2)小
型化が可能であり、(3)検出部と温度補償部のMR
素子とが接近できるように構成されているため、
温度補償精度が向上し、(4)温度補償の時間的ずれ
が生じないなどの優れた利点のある温度補償付
MRセンサが得られる。 Since this embodiment is configured as described above,
It can be configured so that the resistance of the MR element in the temperature compensation section does not change with respect to the signal magnetic field, (1) the structure is simple, (2) it can be made smaller, and (3) the MR element in the detection section and temperature compensation section
Because it is configured so that the element can be approached,
With temperature compensation, which has excellent advantages such as improved temperature compensation accuracy and (4) no time lag in temperature compensation.
An MR sensor is obtained.
第5図は本発明の他の実施例をを示すもので、
本実施例にあつては温度補償部のMR素子3と
MR素子2とを相似の形状とし、かつMR素子3
の幅w2がHd>Hkとなるように40μ以下としてあ
る。 FIG. 5 shows another embodiment of the present invention.
In this embodiment, the MR element 3 of the temperature compensation section and
MR element 2 has a similar shape, and MR element 3
The width w2 is set to 40μ or less so that Hd>Hk.
このようにMR素子2,3とを相似の形状とす
れば、MR素子2の抵抗R1及びMR素子3の抵抗
R2はρを個有抵抗とすると(8),(9)式で表わされ
る。 If MR elements 2 and 3 have similar shapes in this way, the resistance R 1 of MR element 2 and the resistance of MR element 3
R 2 is expressed by equations (8) and (9) where ρ is the individual resistance.
R1=ρ1l1/t1w1 (8)
R2=ρ2l2/t2w2 (9)
MR素子2,3を同時に形成した場合ρ1=ρ2,
t1=t2であり、MR素子2,3は相似に形成され
ているため、両者の長さをl1,l2、幅をW1,W2
とすればl1/w1=l2/w2となり、R1=R2とする
ことができ、しかもMR素子3の反磁界を任意に
コントロールできることになる。 R 1 = ρ 1 l 1 /t 1 w 1 (8) R 2 = ρ 2 l 2 /t 2 w 2 (9) When MR elements 2 and 3 are formed at the same time, ρ 1 = ρ 2 ,
Since t 1 = t 2 and MR elements 2 and 3 are formed similarly, their lengths are l 1 and l 2 and their widths are W 1 and W 2.
Then, l 1 /w 1 =l 2 /w 2 , R 1 =R 2 can be set, and the demagnetizing field of the MR element 3 can be arbitrarily controlled.
この時、第2図に示した回路においてRa=Rb
となり、ブリツヂバランスをとるのに容易な回路
が構成でき、検出部のMR素子2の抵抗変化に対
して最も効率よく出力を得ることができる。 At this time, in the circuit shown in Figure 2, Ra=Rb
Therefore, a circuit can be constructed that is easy to maintain bridge balance, and the output can be obtained most efficiently with respect to the resistance change of the MR element 2 of the detection section.
なお、両実施例において各MR素子を直角とし
て説明したが、必ずしも直角に限定されることな
く直角に近い角度であつても実質的には信号磁界
の影響を除去できる。又その他の角度(非平行)
であつてもその角度に相応して信号磁界の影響を
取りのぞくことができるものである。 In both embodiments, each MR element has been described as being at a right angle, but it is not necessarily limited to a right angle, and even if the angle is close to a right angle, the influence of the signal magnetic field can be substantially eliminated. Also, other angles (non-parallel)
Even if it is, the influence of the signal magnetic field can be removed in accordance with the angle.
以上の説明から明らかなように、本発明によれ
ば、温度補償部のMR素子が信号磁界に対して感
度をもつことがないように構成でき、検出部と温
度補償部のMR素子を極めて接近させて設けるこ
とができ、このため、(1)極めて簡単な構造で、(2)
小型化でき、(3)温度補償精度が向上し、(4)温度補
償部のMR素子を検出部に近接できるため、温度
補償の時間的ずれが生じないなどの優れた効果の
ある温度補償付MRセンサを得ることができる。 As is clear from the above explanation, according to the present invention, the MR element of the temperature compensation section can be configured so as not to be sensitive to the signal magnetic field, and the MR element of the detection section and the temperature compensation section can be placed very close together. Therefore, (1) it has an extremely simple structure, and (2)
Temperature compensation has excellent effects such as being smaller, (3) improving temperature compensation accuracy, and (4) allowing the MR element of the temperature compensation section to be placed close to the detection section, so there is no time lag in temperature compensation. MR sensor can be obtained.
第1図は従来の構造を説明する斜視図、第2図
は第1図に示した構造のセンサを使用した場合の
回路図、第3図は本発明の一実施例を説明する斜
視図、第4図は第3図に示した温度補償部のMR
素子の磁化方向の説明図、第5図は本発明の他の
実施例を示す斜視図である。
1…基板、2,3…MR素子、4…電極。
FIG. 1 is a perspective view illustrating a conventional structure, FIG. 2 is a circuit diagram when the sensor having the structure shown in FIG. 1 is used, and FIG. 3 is a perspective view illustrating an embodiment of the present invention. Figure 4 shows the MR of the temperature compensation section shown in Figure 3.
FIG. 5, which is an explanatory diagram of the magnetization direction of the element, is a perspective view showing another embodiment of the present invention. 1... Substrate, 2, 3... MR element, 4... Electrode.
Claims (1)
用の磁気抵抗効果素子が形成され、これより内側
に温度補償用の磁気抵抗効果素子を形成すると共
に両磁気抵抗効果素子の軸線方向を互いに非平行
とした薄膜磁気センサにおいて、前記温度補償用
の磁気抵抗効果素子の幅及び膜厚の寸法を反磁界
Hdと異方性磁界Hkに関してHd>Hkとなる寸法
に設定したことを特徴とする温度補償付磁気抵抗
効果型薄膜磁気センサ。 2 信号磁界検出用及び温度補償用の磁気抵抗効
果素子の形状を相似となるように形成したことを
特徴とする特許請求の範囲第1項に記載の温度補
償付磁気抵抗効果型薄膜磁気センサ。[Claims] 1. A magnetoresistive element for detecting a signal magnetic field is formed on the side of the magnetic recording medium sliding surface of the substrate, and a magnetoresistive element for temperature compensation is formed inside this, and both magnetoresistive effects In a thin film magnetic sensor in which the axial directions of the elements are non-parallel to each other, the width and film thickness of the magnetoresistive element for temperature compensation are determined by the demagnetizing field.
A magnetoresistive thin film magnetic sensor with temperature compensation, characterized in that dimensions are set such that Hd>Hk with respect to Hd and anisotropic magnetic field Hk. 2. The magnetoresistive thin film magnetic sensor with temperature compensation according to claim 1, wherein the magnetoresistive elements for signal magnetic field detection and temperature compensation are formed to have similar shapes.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55157066A JPS5780578A (en) | 1980-11-10 | 1980-11-10 | Magneto resistive thin film magnetic sensor with thermal compensation |
| US06/317,386 US4506220A (en) | 1980-11-10 | 1981-11-02 | Temperature compensated magnetoresistive effect thin film magnetic sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55157066A JPS5780578A (en) | 1980-11-10 | 1980-11-10 | Magneto resistive thin film magnetic sensor with thermal compensation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5780578A JPS5780578A (en) | 1982-05-20 |
| JPH0125431B2 true JPH0125431B2 (en) | 1989-05-17 |
Family
ID=15641468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55157066A Granted JPS5780578A (en) | 1980-11-10 | 1980-11-10 | Magneto resistive thin film magnetic sensor with thermal compensation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5780578A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02176484A (en) * | 1988-12-28 | 1990-07-09 | Asahi Chem Ind Co Ltd | Ferromagnetic magnetoresistance element |
-
1980
- 1980-11-10 JP JP55157066A patent/JPS5780578A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5780578A (en) | 1982-05-20 |
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