JPH01265145A - X-ray inspection device - Google Patents

Abstract

PURPOSE:To automate the positioning of plural inspection sections to subjects by previously detecting the information on the inspection position to one subject and storing the information on the detected inspection position into a memory. CONSTITUTION:The information on the inspection position to one subject is previously detected and the X-, Y-coordinate positions which are the information on the detected inspection position are stored into the 1st memory of a CPU 210. The X-, Y-coordinates are read out sequentially from the 1st memory and an X-Y table 109 is driven and controlled by a control means in such a manner that the inspection sections are disposed to the coordinate positions in case of continuously inspecting the same subjects. The X-ray image signals of the sequentially inspecting subjects 20 and the defectless reference subject 20 are stored as digital values into 2nd, 3rd memories 150, 160. The CPU 210 compares the signal values of the 2nd, 3rd memories 150, 160 by a comparator 170 and discriminates whether the subjects 20 have a defect or not.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention provides an XI! The present invention relates to an X-ray inspection device that performs non-destructive inspection.

(Prior Art) This type of X-ray inspection apparatus places a subject between an X-ray generation source and an X-ray TV camera, and uses ! It is configured to emit X-rays from the source toward the subject.

Then, the X-rays that have passed through the object are input to the XIITV camera, which converts the XwA transmitted image into an optical image, which is photographed by the camera and converted into an electrical signal, and the object image is displayed on the monitor. It is composed of

For example, if the subject is an electronic circuit board,
Since a plurality of electronic components such as ICs are mounted on this electronic circuit board, this electronic circuit board is supported on an X-Y table, and the position of the subject can be varied by table control. I am trying to image the parts.

(Problems to be Solved by the Invention) By the way, this type of non-destructive inspection places a heavy burden on the operator and has extremely low inspection efficiency.

For example, when there is a large number of objects to be inspected such as ICs on one board, such as an electronic circuit board, and it is necessary to perform image inspection on all of these boards, X
- It is necessary to position the Y table, and since it is necessary to inspect many circuit boards of the same type in normal inspection, it is necessary to perform the above-mentioned X and Y position positioning for each board. Ta.

Therefore, input operations for the above-mentioned positioning required during X-ray inspection are extremely complicated, the inspection speed is slow, and a great burden is placed on the operator.

In addition, there are various parts of different sizes on the electronic circuit board, and in some cases it is necessary to change the imaging magnification, but it is difficult to change the imaging magnification for each board and for each type of component. It was also a huge burden.

In addition, inspection for the presence or absence of defects based on the X-ray image of the subject was performed by the operator looking at the image on a display, which took time and ensured that accurate inspection was not possible. There was no guarantee that it would be done.

Therefore, it is an object of the present invention to provide a method for positioning and positioning of the object even when a single object has a plurality of inspection parts with different inspection positions and a large number of objects of the same type are to be inspected. Inspections can be automated,
It is an object of the present invention to provide an X-ray inspection apparatus' which can improve inspection speed and greatly reduce the burden on workers.

[Structure of the Invention] (Means for Solving the Problems) The present invention emits X-rays from a finely focused XII source,
In an xIl inspection device that non-destructively inspects an object by converting an X-ray image transmitted through an object supported on a Y-table into an image, a 1 memory, and a control means that reads the X and Y movement coordinates from the storage circuit when inspecting the object, drives and controls the X-Y table based on this coordinate information, and executes automatic positioning control for the same type of object. a second memory that stores the X-ray image signal at this controlled position as a digital value; and a third memory that stores the X-ray image signal of the object without defects as a reference for inspection comparison as a digital value. , No. 2 above. The configuration includes comparison means for comparing the contents of the third memory.

In addition, if the imaging magnification is important for each inspection part of the subject, it is preferable that the positional information from the X-ray source of the camera sensitive to X-rays is also stored in the first memory. .

(Operation) In the present invention, inspection position information for one subject is detected in advance, and the X and Y coordinate positions, which are this inspection position information, are stored in the first memory.

In this way, by storing the X and Y coordinates of multiple inspection points for one subject, when the same subject is inspected continuously, the
, Y coordinates are read out, and the control means drives and controls the X-Y table so that the inspection site is placed at each coordinate position, thereby making it possible to automate the positioning of a plurality of inspection sites on the subject.

Further, when the imaging magnification for each examination site is changed, if parameters for changing the imaging magnification are also stored in the first memory, automatic setting of the imaging magnification can be executed. In other words, as shown in Figure 1, the path from xmii to the center of the subject! 1, and the distance from the center of the subject to the input surface of the image sensor! 2, the photographing magnification of the subject image displayed on the display is (!1
+12)/11. Therefore, the above distance w1!1 or! It is sufficient to memorize numerical values related to 2.

Furthermore, the present invention automates defect inspection of a photographed object based on the X-ray image signal of the photographed object.

That is, the third memory stores in advance the X-ray image signal as a defect-free inspection comparison object as a digital value, and the X-ray image signal of the subject to be X-rayed sequentially is stored as a digital value in the second memory. is memorized. And this second one. By comparing the contents of the third memory at the same position, it becomes possible to automatically inspect the object for defects. In addition,
Such a comparison does not necessarily have to be performed on all of the X-ray image signals of the subject, and may be performed only on areas of interest where defects such as pattern shorts are likely to occur, for example.

Furthermore, since the present invention employs an X-ray source with a minute focus, image blurring caused by a large focus can be eliminated, and a clear, high-resolution X-ray transmission image can be created. By using this fine-focus X&I source, it is possible to obtain high-resolution, high-magnification images, especially when taking images at a predetermined magnification necessary for detecting minute defects in this type of non-destructive X-ray inspection. can be obtained. It is also advantageous in that it does not require large amounts of power to increase the X-ray density.

(Example) The present invention will be described below as a non-destructive testing device for electronic circuit boards.
An embodiment applied to a line inspection device will be specifically described with reference to the drawings.

This X-ray inspection device has a subject 20 between an X-ray tube 11 of an X-ray generator 10 and an image sensor 30 that detects X-rays.
It is possible to perform X-ray photography by arranging the image sensor 30, and to take an X-ray transmission image on an X-ray recording medium, such as an instant film 200, which can be placed in front of the image sensor 30.

The X-ray generating section 10 includes the X-ray tube 11 that generates X-rays.
and a high voltage generator 1 that applies a high voltage to this X-ray tube 11.
It is composed of 2. X-ray tube ・11 is equipped with a cathode filament and an @ pole opposite to it in its internal vacuum.Thermionic electrons emitted by heating the filament are accelerated by a DC high voltage, and these are transferred to the anode. The kinetic energy of the thermoelectrons at this time is obtained as X-rays. Note 1. The amount of X-ray irradiation can be changed by varying the tW voltage or filament current of the X-ray tube 11.

In addition, in this embodiment, a so-called minute focus X-ray source is adopted as the X-ray tube 11, and the focal point size is 10.
A microfocus X-ray source of 0 microns or less, preferably 15 microns or less is used. In order to obtain such a minute focus, it is sufficient to cause the thermoelectrons to collide with a minute region on the anode, which is the target of the thermoelectrons, and this can be achieved by focusing the target region using a focusing electrode or the like.

In this embodiment, the subject 20 is an electronic circuit board on which electronic components such as ICs are mounted, and for example, an X-Y table 1.
A plurality of them are placed on a support jig 110 placed on the XY stage 109 of No. 00, and can be set in the xiIl irradiation area by moving the XY stage 109. Note that details of the X-Y table 100 and the support jig 110 will be described later.

In order to convert the above-mentioned X-ray image into an image,
The image sensor 40 for inputting lines is provided. In this embodiment, a vidicon is used as the image sensor 40, and the photoconductive surface of this vidicon, which is an X-ray input surface, is also sensitive to X-rays, and an electrical signal corresponding to the intensity of X-rays is sent. is output.

For example, a variable gain amplifier 50 is provided downstream of the image sensor 40, and is configured to amplify and output the electrical signal with a gain determined to obtain an optimal image.

Further, an image processing section 60 receives the output of the amplifier 50.
The image processing unit 60 divides the electric signal into 256 levels or 51 levels for each predetermined level range.
It is binarized in two stages, and image processing such as edge enhancement is performed on the binary gradation signal and output.

Furthermore, a T''V signal processing section 70 is provided at the subsequent stage of the image processing section 60, and converts the digital signal output from the image processing section 60 into an analog signal, and further performs processing such as superimposition of a synchronization signal to output the TV signal. The signal can be used to display an image on the display 80 at the subsequent stage.

Further, in this embodiment, X-ray images can be photographed on film, and for this purpose, the instant film 200 can be placed on the ITF stand 201. This instant film 200 has a negative and a positive film sealed in -sheets of film, and at the same time a liquid agent for developing and fixing is housed wrapped in a soft substance. After photographing on this film, development and fixing are started by squeezing the liquid agent, and if it is a black and white film, the image can be recognized in about 15 seconds.

An example of this type of instant film is the film used in Polaroid cameras (trade name), which is also sensitive to the wavelength of X-rays.

Next, the automatic inspection function for the subject 20 will be explained.
A CPU 210 is provided that controls this automatic inspection function, and based on the control of this CPU 210, the
The X-ray image signal, which is a digital signal output from the image processing section 60, is stored in the second memory 150 or the third memory 160.

The second memory 150 stores objects 20 that are sequentially inspected.
On the other hand, the third memory 160 stores the X-ray image signal of the subject 20, which is known in advance to be free of defects, as a digital value.

Further, the CPU 210 is the second CPU. Third memory 15
Read out the memory contents of 0,160 and control the
0 above regarding the same position. The third signal value is compared by a ratio generator 170.

The output of the comparator 170 is input to the CPtJ 210, and this CPU 210 is connected to the ratio controller 17.
Based on the output of 0, it is determined whether or not there is a defect in the subject 20 corresponding to the X-ray image signal stored in the second memory 150, and this content is output to the output unit 180, where , printout, etc. will be output.

In the X-ray inspection apparatus having the above configuration, the orthogonal axis direction on the two-dimensional plane on the X-Y table 100 is X.

If Y is the direction perpendicular to the X and Y axes, then Z is the direction perpendicular to the X and Y axes.
In this embodiment, the X and Y positions of the subject 20 and the positions of the instant film 200 in two directions.

The position of the image sensor 40 in the Z direction is variable.

First, regarding the configuration of the X-Y table 100, the second
This will be explained with reference to the figures.

This X-Y table 100 has a ball screw 102 formed on a base 101 along the X direction, and this ball screw 102 is rotationally driven by a motor 103. It has a movable nut portion 104. An X-direction moving plate 105 is provided on the base 101, and the nut portion 1
04 allows movement in the same direction.

A ball screw 106 formed along the Y direction is provided on the X direction moving plate 105, and is rotationally driven by a motor 107. Further, a nut portion 108 is provided which is movable in the Y direction by rotation of the ball screw 106, and an XY stage 109 is supported by this nut portion 108.

Therefore, the X-Y stage 109 is connected to the motor 10.
3. It is movable in the X and Y directions by driving 107. Note that the base 101 and the X-Y stage 1
09 is set within the Xll projection area, the base 101 is made of stainless steel, but the XIi passage area is notched out, and the X-Y stage 109 is made of a material that easily transmits X-rays, such as aluminum. It is formed by etc.

Next, the support jig 110 fixedly supported on the XY stage 109 and supporting the subject 20 will be explained with reference to FIG. 3.

The subject 20 in this embodiment is an electronic circuit board as shown in FIG. It has a configuration in which a rod 114 that restricts the end face in the direction is hung, and by supporting the end of the substrate 20 on the stepped surface 112, the substrate 20 is parallel to the X-Y stage 109 and By partitioning with rods 114, a plurality of substrates 20 can be supported.

Next, a Z-direction adjustment mechanism 13 that changes the height of the instant film 200 and the image sensor 40 in the Z-direction is provided.
0 will be explained with reference to FIG.

As shown in the figure, a ball screw 131 is provided along the Z direction, and an idle pulley 132 is fixed to one end of the ball screw 131.
By passing a timing belt 135 around a drive pulley 134 fixed to the output shaft of a motor 133, the ball screw 131 is driven to rotate.

Further, the mounting table 201 for the image sensor 40 and the instant film 200 is supported by a Z-direction guide (not shown), and its height in the Z-direction is variable by fixing a nut portion 136 that is screwed into the ball screw 131. It becomes.

Next, a drive control system for the various drive units described above will be explained with reference to FIG. 5. Note that this drive control is also performed by the CPU
210 is in charge.

In this embodiment, control is possible by drive information input from the input section of the device, and as shown in FIG. The CPU 210 controls the motor drive control unit 230 to drive the corresponding motors 103, 107, and 133.

Here, to explain the above two types of input units 220 and 222, the second human power unit 222 is composed of a joystick, a mouse, etc., and the center of the image is set in two dimensions according to the amount of operation of the joystick or the amount of movement of the mouse. It can be moved arbitrarily on the surface.

On the other hand, as shown in FIG. 6, the first human power unit 220 is composed of a keyboard 220a and X, Y, and Z direction designation keys 220b. It is now possible to enter numerical values (for example, city units). Also provided are a correction key 220c used when correction is required, and a start key 220d used when moving after inputting numerical data.

As shown in FIG. 7, the display 80 of this embodiment has a photographing center O and a scale 81 of orthogonal axes coordinates that intersect with the photographing center O. Also, on the display 80,
The CPU 2 depending on the position of the image sensor 40 in the Z direction.
The photographing magnification calculated in step 10 is displayed in the photographing magnification column 82, and the unit length of one division of the scale 81 that can be calculated by the CPU 210 from this photographing magnification can be displayed in the unit length display column 83. It has become.

Here, the subject 20 of this embodiment is an electronic circuit board on which a plurality of electronic components are mounted as shown in FIG.
In contrast, there is a plurality of pieces of photographing position information.

Therefore, the initially set X and Y coordinate positions of the subject 20 are taught, and when changing the photographing magnification as necessary, the Z coordinate of the image sensor 40 is taught, and each coordinate position is memorized. It is configured so that it can be done.

For this purpose, each of the motors 103, 107, 133 includes a rotational position sensor 103A, 107A such as an encoder,
133A is connected so that the X and Y position coordinates of the subject 20 and the Z coordinate of the image sensor 40 can be detected.

Note that this position detection is not limited to detecting motor output;

A device that directly detects the Z position may also be used.

The position detection information of each of the sensors 103A, 107A, and 133A is input to the CPU 210, where it is treated as X, Y, and Z coordinate position information with respect to the reference position.
40 or a floppy disk 242. During the X-ray examination, the fixed disk 240. The information on the floppy disk 242 is sent to the CPU 2.
10 to be loaded into RAM 244 as a first memory. Further, each time the inspection site is changed, the CPU 210 updates the RAM 244 to X.

The drive control unit 230, which is controlled by the CPU 210, reads the Y coordinate and controls the motor 103 based on the above information.
．． 107 and 133 are configured to be driven and controlled.

Next, the effect will be explained.

First, when performing an X-ray examination on the first subject 20 in the inspection loft, the imaging position and imaging magnification are taught. For this purpose, first, the object 20 is The positions in the X and Y directions and the position in the Z direction of the image sensor 40 are set to predetermined values, and the object 20 is
X-rays are emitted towards.

In addition, in this embodiment, since a fine focus X-ray source is employed, a large amount of power is not required to increase the X-ray density.

Then, the X-rays that have passed through the subject 20 are input to the image sensor 30, and an Xsl transmitted image is taken by the image sensor 40 here. At this time, since this embodiment employs the X-ray tube 11, which is an X-ray source with a minute focus, clear X&! An image may be projected onto a photoconductive surface of image sensor 40.

That is, as shown in FIG. 8(b), when the focus is not minute, in addition to the original transmitted image A1 of the subject, image blurring A2 occurs due to the large focus;
As shown in a), in the case of a minute focus, only the transmitted X-ray image of the subject 20 will be incident on the image sensor 40, so a clear image without image blurring can be obtained.

The image sensor 40 outputs an electrical signal corresponding to the detected light intensity, and this electrical signal is amplified by the amplifier 50 and then input to the image processing section 60 .

The image processing unit 60 converts the analog electrical signals into 256,512
The digital signal is binarized into gradations such as steps, and various processes are executed at this digital signal stage.

Thereafter, this digital signal is input to the subsequent TV signal processing section 70, where it is converted into analog and processed into a TV signal on which a synchronization signal etc. are superimposed, and an image is displayed on the display 80 based on this TV signal. By doing so, the X-ray transmission image of the subject 20 is converted into an image.

In addition, when using a conventional X-ray source with a large focus as shown in Figure 8(b), parallel X-rays are emitted from this large focus, so the X-ray fluorescence multiplier tube, etc. X-ray photography was not possible without using a tube with a large input surface area, but since this embodiment uses a fine-focus X-ray tube 11, it can be used with a vidicon, etc., where the diameter of the input surface is as small as several inches. The image sensor 4
Can be adopted as o. In addition, even with such a small-diameter input surface, it is possible to scan electronic components by moving the X and Y positions of the subject 20 or by increasing the imaging magnification of the X-ray image as described above. It becomes possible to photograph the whole or part of it as desired. Furthermore, XI
l Fluorescence multiplier tubes are extremely expensive compared to vidicons;
This embodiment is also advantageous in that the device can be made inexpensive.

Here, the operator looks at the image on the display 80 and determines whether the area to be examined is appropriate and whether the imaging magnification is set to a predetermined value.

Here, especially when the center of photography is shifted, in addition to using the second human power section 222 such as a joystick, in this embodiment, it is possible to use the first human power section 220 that can input the movement amount numerically. It has become.

In the case of this embodiment, g graduations 81 are displayed on the display 80, and the unit length of this graduation 81 can also be recognized from the corresponding display m83. Therefore,
If the center of photography is off, check the scale 81 in the X and Y directions to determine the amount of movement in the X and Y directions, and also determine the length of each unit scale in the unit length display field 83. By doing so, it is possible to easily recognize the amount of movement in the X and Y directions to the imaging center to be set. After this, specify the direction using the direction specifying key 220b, and then use the numeric keypad 220.
After operating a and inputting the movement amount numerically, press start key 2.
By pressing 20d, it is possible to easily move to the desired imaging center. Note that a rough movement amount may be entered as a numerical value, and subsequent fine adjustments may be made using a joystick or the like that is the second human power section 222.

In this way, if no correction is required, the settings at that time will be used, and if correction is required, the position will be used.

Photographing is performed again by changing the photographing magnification to confirm suitability, and the X and Y coordinate positions of the subject 20 and the Z coordinate position of the image sensor 40 are detected under the revised setting conditions. That is, the sensor 10 of each motor 103, 107, 133
By inputting the outputs of 3A, 107A, and 133A to the CPU 210, the x, y, and z coordinates with respect to the reference position are detected.

This first coordinate is (Xl, Yl, Zl).
It will be stored in 2.

Next, in order to set the second inspection position of the subject 20, the X and Y coordinates are designated via the input unit 220, and the XY stage 109 of the XY table 100 is driven. and,
Similarly, X-ray photography is performed, and the suitability of the image is confirmed by viewing the image displayed on the display 80. At this time, the appropriateness of the imaging magnification is also determined, and if the inspection site and imaging magnification are appropriate, the X, Y coordinates and Z coordinate of the image sensor 40 are detected in the same manner as described above, and this The second coordinates (X2, Y2, Z2) are stored on disk 240 or 242.

Thereafter, similar operations are performed for the third coordinate, fourth coordinate, and so on.

After the coordinate position storage operation is completed, the coordinate information is loaded from the disk 240 or 242 into the RAM 244, and the X-ray examination is started.

In this embodiment, first, a reference object 20 with no defects is set, and X-ray image signals are collected for this reference object 20. Then, the first coordinates of this reference subject 20 are determined as described above.

X-ray image signals are collected for the second coordinates, and the output of the image processing unit 60 regarding this signal is stored in the third memory 160 under the control of the CPU 210.

After storing the image signals for the reference object 20, as shown in FIG. 3, a plurality of objects 20 to be inspected are mounted on the support jig 110, and an X-ray inspection is performed. There is. First, the leftmost subject 2 on the support jig 110
0 is set in the
Execute and control the X-ray inspection at the coordinates, then the second and third coordinates.
By automatically variably controlling the X and Y positions of the subject 20 and the imaging magnification, X-ray examinations can be performed continuously.

Then, the X-ray image signal of each coordinate is sent to the CPU 210.
will be stored in the second memory 150 under the control of.

The first coordinates are determined with respect to the subject 20 as described above.

After storing the second coordinates... and the X-ray image signal in the second memory 150, the second coordinates... and the X-ray image signal regarding the same position of the subject 20 are stored in the second memory 150. 3rd memory 1
The contents of 50 and 160 will be read and input to comparator 170.

Then, the comparator 170 compares the digital value of the reference object 20 with the digital value of the object 20 in the second memory 150 to be inspected, and converts the comparison result into a C
It will be output to PU210.

Then, the CPU 210 determines whether or not there is a defect in the object 20 to be inspected based on the comparison result of the comparator 170.

For example, when a circuit board pattern short circuit occurs, the digital gradation value of the reference object 20 with no short circuit and the object 20 to be inspected with a short circuit are used.
There is clearly a difference between the digital gradation value and the gradation value. Therefore, if a gradation value difference that clearly indicates whether or not a pattern short has occurred is used as a threshold value as a criterion for determining the presence or absence of a defect in the CPU 210, it becomes possible to automatically determine the presence or absence of a defect. .

If there is a clear difference in tone value from the reference object 20, a signal indicating that the defect has occurred is sent.
Preferably, it is output to the output section 180 together with the address position. Therefore, the operator
By looking at the printout of 0, it is possible to determine whether there is a defect in the subject 20. As described above, if the address position of the object 20 that causes the defect is output, it will be easier to recognize where the defect is occurring, and the cause of the defect can also be immediately determined. Immediate feedback of the cause to the manufacturing process will also help improve throughput.

When the above-described inspection of the first subject 20 is completed, the second subject 20 of the support jig 110 is set in the X-ray exposure area, and X-ray imaging is performed at each coordinate position in the same manner, and , the automatic inspection by the CPU 210 is executed. Thereafter, all the objects 20 in the support jig 110 are
An X-ray inspection will be performed on the Support jig 1
After the inspection of all the objects 20 in the jig 110 is completed, the objects 20 in the jig 110 are replaced with new objects 20, and the X-ray inspection of the same type of objects 20 is continued. Note that it is also possible to set the instant film 200 and take an X-ray transmission image on the instant film 200 if necessary.

As described above, according to the present embodiment, when a plurality of inspection parts exist in one subject 20 and such subjects 20 of the same type are to be inspected continuously, positioning can be manually set for each subject 20. first memory 24
The object 20 can be automatically positioned based on the stored information in the third memory 160, and the CPU 210 can automatically inspect the object 20 based on the stored contents of the third memory 160.
Inspection speed can be improved and the burden on workers can be significantly reduced.

Note that the present invention is not limited to the above embodiments,
Various modifications are possible within the scope of the invention.

For example, the mechanism for varying the X and Y positions of the subject 20 and the mechanism for changing the imaging magnification described above are not limited to the above embodiments and can be replaced with other mechanisms having the same functions.

Further, for example, for a defective object 20, it is possible to mark the defective object 20 easily with an inker or a scratch marker, such as in the case of a semiconductor wafer probe device.

Further, the object to which the X-ray inspection apparatus of the present invention can be applied is not limited to electronic circuit boards, but can be applied to various objects that require X-ray inspection by changing the inspection part within one object.

[Effects of the Invention] As explained above, according to the present invention, when a single subject has a plurality of inspection parts with different inspection positions and a large number of such subjects of the same type are inspected, it is possible to Since positioning can be automated and defect inspection can be performed automatically by comparing the defect inspection with a standard inspection comparison target, inspection speed can be improved and the burden on the operator can be significantly reduced.

[Brief explanation of the drawing]

FIG. 1 is a schematic explanatory diagram for explaining an embodiment of the XvL imaging system and image processing system when the present invention is applied to nondestructive inspection of electronic circuit boards, and FIG. FIG. 3 is a schematic perspective view for explaining the subject and supporting jig; FIG. 4 is for explaining the position variable mechanism of the image sensor and the X-ray recording medium. 5 is a schematic block diagram of the drive control system, FIG. 6 is a schematic diagram of the first human power section that specifies X and Y coordinates numerically, and FIG. 7 is a scale and unit scale. Schematic explanatory diagrams for explaining a display having a length etc., FIGS. 8(a) and 8(b)
) is a schematic explanatory diagram for explaining an X-ray transmission image in the case of a minute focus and in a case where it is not. 11... X-ray source, 20... Subject, 103.107,133... Motor, 103A, 10
7A, 133A...Sensor, 109...X-Y stage, 150...Second memory, 160...Third memory, 170...Comparison means, 210...Control means, 244 ...First memory. Agent Patent Attorney Inoue - (1 other person) Figure 3 Figure 4 Figure 5 @ Figure 6 Figure 7 C5t 55

Claims (1)

[Claims] X-ray inspection that non-destructively inspects the object by emitting X-rays from a micro-focus X-ray source and converting the X-ray image transmitted through the object supported on an X-Y table into an image. The device includes a first memory that stores in advance the X and Y movement coordinates necessary for imaging multiple locations on the object, and a first memory that reads the X and Y movement coordinates from the storage circuit when inspecting the object, and performs operations based on this coordinate information. A control means for driving and controlling an X-Y table to perform automatic positioning control for objects of the same type; a second memory for storing an X-ray image signal at the controlled position as a digital value; and an inspection comparison standard. A third memory for storing an X-ray image signal of the object free of defects as a digital value, and a comparison means for comparing the contents of the second and third memories. Inspection equipment.