JPH012795A - Carbon dioxide laser processing monitor device - Google Patents
Carbon dioxide laser processing monitor deviceInfo
- Publication number
- JPH012795A JPH012795A JP62-157210A JP15721087A JPH012795A JP H012795 A JPH012795 A JP H012795A JP 15721087 A JP15721087 A JP 15721087A JP H012795 A JPH012795 A JP H012795A
- Authority
- JP
- Japan
- Prior art keywords
- lens
- processing
- carbon dioxide
- dioxide laser
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はレーザ加工装置の焦点位置の加工状態をモニ
ターする装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a device for monitoring the processing state of a focal position of a laser processing device.
第4図は従来の炭酸ガスレーザ加工装置の一例を示すも
のでレー士発振器(1)はレーザ光(2)を出力しベン
ドミラー(3)により加工へ・・ド(4)に導く。加工
ヘッド(4)には加工レンズ(5ンを備え、レーザ光(
2)を集光し、被加工物(6)を切断、溶接等のレーザ
加工を行う。FIG. 4 shows an example of a conventional carbon dioxide laser processing apparatus, in which a laser oscillator (1) outputs a laser beam (2) and guides it to processing by a bend mirror (3). The processing head (4) is equipped with a processing lens (5 lenses) and a laser beam (
2) is focused and laser processing such as cutting and welding is performed on the workpiece (6).
ま1こ、酸素、窒素、アルコン等の加工カス(7)を加
工へ・ラド(4)に送入し、ノズル(8)からレーザ光
(2)と同軸状に吹き出すことによりレーザ加工を促進
する。ノズル(3)の穴径は1〜2鰭が使用され、レー
ザ光の焦点スポ、ット径は0.1−0.2 fiである
ので焦点スボ、・−ト径はノズル径に対して十分に小さ
い、まrこ、加工レンズ(5)の材料はZn8e、KO
l などの可視光でも透明に近い物を使用する。Machining waste (7) containing oxygen, nitrogen, alcon, etc. is sent to the processing rad (4) and is blown out from the nozzle (8) coaxially with the laser beam (2) to promote laser processing. do. The hole diameter of the nozzle (3) is 1 to 2 fins, and the focal spot diameter of the laser beam is 0.1-0.2 fi, so the focal spot diameter is proportional to the nozzle diameter. The material of the machining lens (5) is Zn8e, KO, which is sufficiently small.
Use a material that is nearly transparent even under visible light, such as L.
従来の炭酸ガスレーザ加工装置は以上のようにr4成さ
れているので、M加工物(6)の可視光における反射光
は加工レンズ(5)を通ると炭酸ガスレーザ光(2)よ
りも加工レンズ(5)の屈折率が高い。そのためレーザ
光(2)より近くに集光され焦点付@(9)に集光する
。しかしこの焦点位置(9)は加工レンズ(5)から遠
く離れてしまう1こめ被加工物(6)の加工位置を拡大
して見ろことは困難であり、まγこ、加工レンズ(5)
のつくる被カロエ物(6)の加工位置の像はレーザ光(
2)のビーム径に比べ遥かに小さく、レーザ光(2)に
影響を与えずにレーザ加工中の状態をモニターすること
は従来装置では困難であった。Since the conventional carbon dioxide gas laser processing device is configured with r4 as described above, when the visible light reflected from the M workpiece (6) passes through the processing lens (5), it passes through the processing lens (5) more than the carbon dioxide laser light (2). 5) High refractive index. Therefore, the laser beam (2) is focused closer to the focal point (9). However, this focal position (9) is far away from the processing lens (5), so it is difficult to zoom in and see the processing position of the workpiece (6).
The image of the processing position of the object (6) created by the laser beam (
The beam diameter is much smaller than the beam diameter of (2), and it has been difficult with conventional equipment to monitor the state during laser processing without affecting the laser beam (2).
この発明は上記のような問題点を解決するtコめになさ
れfこものでレーザ光に影響を与え寸に艮好な加工を行
うことができるとともに、加工中であっても加工状態を
モニターすることが出来るレーザ加工モニター装置を得
ることを目的とする。This invention solves the above-mentioned problems. It is possible to perform precise machining by influencing the laser beam with a laser beam, and also to monitor the machining status even during machining. The purpose is to obtain a laser processing monitoring device that can perform the following tasks.
〔問題点を解決するための手段)
この発明に係わるレーザ加工モニター装置は炭酸ガスレ
ーザ光の波長10.6jクロンに対して可視光線の波長
は0.4〜0.76jクロンでJ)す、波長が異なるこ
とを利用して、レンズの屈折率の違いにより炭酸ガスレ
ーザ光と可視光線を分離しレーザ加工中でもレーザ加工
をモニターすることができろようにし1こものである。[Means for Solving the Problems] The laser processing monitoring device according to the present invention has a wavelength of visible light of 0.4 to 0.76 j cron compared to the wavelength of carbon dioxide laser light of 10.6 j cron. By taking advantage of the difference in the refractive index of the lenses, the carbon dioxide laser light and the visible light can be separated, making it possible to monitor the laser processing even during laser processing.
この発明におけるレーザ加エモニター装舒は加工レンズ
の屈折率が炭酸ガスレーザ光と可視光線で異なることを
利用して炭酸ガスレーザ光と可視光線を焦点位置におい
て分離する、。The laser machining monitor device according to the present invention separates the carbon dioxide laser beam and the visible light beam at the focal position by utilizing the fact that the refractive index of the processing lens is different between the carbon dioxide laser beam and the visible light beam.
り下、この発明の一実施例を図について説明する。第1
図ま1こは第2図において、レーサ発振器(1)はレー
ザ光(2)を出力する。ベンドミラー(3)はレーザ光
(2)を加工へ・・・ド(4)に導き被加工物(6)を
切断、溶接などのレーザ加工をする。An embodiment of the present invention will now be described with reference to the drawings. 1st
In Figure 1 and Figure 2, a laser oscillator (1) outputs a laser beam (2). The bend mirror (3) guides the laser beam (2) to the processing section (4) to perform laser processing such as cutting and welding on the workpiece (6).
加工レンズ(5)とベンドミラー(3)の光路の中に、
ベンドミラー(3)側に第一のレンズαηと加工レンズ
(5)側に第二のレンズaOを備え、レーザ光(2)は
第一のレンズαυにより集光され、第゛1のレンズの焦
点位置(2)を過ぎると発散する。第二のレンズαQの
焦点位置は第1のレンズの焦点位置(2)と同じ位置に
設定する。In the optical path of the processed lens (5) and bend mirror (3),
A first lens αη is provided on the bend mirror (3) side, and a second lens aO is provided on the processing lens (5) side, and the laser beam (2) is focused by the first lens αυ and It diverges after the focal point (2). The focal position of the second lens αQ is set to the same position as the focal position (2) of the first lens.
発散するレーザ光(2)は第二のレンズaGにより平行
光にもどり加工レンズ(5)により再度集光され被加工
物(6)の位置を焦点位置とする。The diverging laser beam (2) is returned to parallel light by the second lens aG, and is focused again by the processing lens (5), so that the position of the workpiece (6) is the focus position.
可視光卯は図では点線であられすと、被加工物(6)の
表面から照明器α4の反射光ま1こはレーザ加工による
発光が加工レンズ(5)および第二のレンズ00を通る
と炭酸ガスレーザ光(2)より大きく屈折する。Visible light is indicated by a dotted line in the figure, and when the reflected light from the illuminator α4 from the surface of the workpiece (6) is emitted by laser processing, it passes through the processing lens (5) and the second lens 00. It is refracted more than the carbon dioxide laser beam (2).
例えば炭酸ガスレーザ光の波長10.6<クロンではZ
n8eのレンズの屈折率は2.40であるのに対し可視
光線例えば赤い光として波長0.633jクロンのヘリ
ウムネオンレーザの光に対して屈折率は2.59である
。さらに可視光線の波長の短い緑。For example, if the wavelength of carbon dioxide laser light is 10.6 < Z
The refractive index of an N8E lens is 2.40, whereas the refractive index for visible light, for example, red light from a helium neon laser with a wavelength of 0.633J chron, is 2.59. Furthermore, green has a shorter wavelength of visible light.
青等の光に対しては屈折率は小さくなる 焦点距離に換
算すると波長10.6tクロンに対して波長0.683
EクロンにおけるZn8eのレンズの焦点距離は0.8
82倍となる。可視光線0は加工レンズ(5)、第二の
レンズαQにより焦点位置(ト)に集光されろ。この焦
点位置α9は炭酸ガスレーザ光の焦点位置■にくらべて
加工レンズ(5)に近い位置になる。The refractive index becomes smaller for light such as blue. When converted to focal length, the wavelength is 0.683 for a wavelength of 10.6t chron.
The focal length of the Zn8e lens in E Cron is 0.8
It becomes 82 times. Visible light 0 is focused at the focal position (g) by the processing lens (5) and the second lens αQ. This focal position α9 is closer to the processing lens (5) than the focal position (2) of the carbon dioxide laser beam.
可視光線Uは焦点位置Q5を過ぎると発散し炭酸ガスレ
ーザ光の焦点付11(2)ではかなり拡かっている。The visible light ray U diverges after passing the focal point Q5, and is considerably expanded by the focal point 11(2) of the carbon dioxide laser beam.
一方、炭酸ガスレーザ光の焦点位置(2)におけるビー
ム径は0.1〜0.8ffであるので微小穴Ql19を
有する穴付きミラーαηを傾斜して設け、炭酸ガスレー
ザ光(2)を通過させることにより可視光線0のみを反
射することができる。結像レンズ(至)は微小穴付きミ
ラーαηにより反射された可視光線a3を集光しテレビ
カメラα1または目による結像位置に被加工物(6)の
焦点位置■の像を結像する。結像レンズ0引マ炭酸ガス
レー→ト先の全反射コーティングe;!υをすることに
よって強力な炭酸ガスレーザ光がテレビカメラαlには
いりこ11.を焼損してしまうことを防ぐことができる
。On the other hand, since the beam diameter at the focal position (2) of the carbon dioxide laser beam is 0.1 to 0.8ff, a mirror αη with a hole having a microhole Ql19 is provided at an angle to allow the carbon dioxide laser beam (2) to pass. Therefore, only visible light 0 can be reflected. The imaging lens (to) condenses the visible light a3 reflected by the micro-hole-equipped mirror αη, and forms an image at the focus position (2) of the workpiece (6) at the imaging position by the television camera α1 or the eye. Total reflection coating at the tip of the imaging lens 0-attractive carbon dioxide gas e;! By moving υ, a powerful carbon dioxide laser beam enters the television camera αl.11. You can prevent it from burning out.
テレビカメラα9は被加工物(6)の焦点位置−の可視
光線の像を撮り、制御装置(イ)によりテレピロに映す
。このテレビのはレーザ加工の操作位置に備え付けるこ
とによって遠隔で加工状態を知ることができる。The television camera α9 takes an image of visible light at the focal position of the workpiece (6), and displays it on a television screen using the control device (a). By installing this television at the operating position of laser processing, the processing status can be monitored remotely.
第3図はatのレンズ@が焦点距離を短くして、入射す
るレーザ光(2)のビーム径が細いものを第二のレンズ
α0において太くするビームコリメーションをおこなう
ことかでき、加工性能を向上することができる。Figure 3 shows that the at lens @ shortens the focal length, allowing beam collimation to increase the narrow beam diameter of the incident laser beam (2) with the second lens α0, improving processing performance. can do.
ま1こ、加工レンズ(5)と第二のレンズQOは同一の
レンズであってもよく上記実施例と同様の効果を奏する
。Alternatively, the processed lens (5) and the second lens QO may be the same lens, and the same effect as in the above embodiment can be achieved.
以上のように、この発明によれはレーザ光を集光する第
一のレンズと第一のレンズにより発散されるレーザ光を
平行光に戻す第二のレンズ、第一のレンズの焦点位負近
傍に傾斜して設置されろ微小穴付きミラー及び結像レン
ズを備えるように構成し1こので、炭酸ガスレーザ光に
影#を与えずに被加工物の焦点位置のレーぜ加工中の状
態をモニターすることかできる。その1こめ加工の状態
や、異常加工を遠隔で容易に監視することが出来、加工
の失敗などを本然に防ぐことができる。As described above, the present invention includes a first lens that condenses laser light, a second lens that returns the laser light diverged by the first lens to parallel light, and a focal point of the first lens in the negative vicinity. It is configured to include a mirror with a microhole and an imaging lens, which is installed at an angle.1 This allows monitoring the state of the focus position of the workpiece during laser processing without casting a shadow on the carbon dioxide laser beam. I can do something. The state of the first round of machining and abnormal machining can be easily monitored remotely, making it possible to prevent machining failures.
まrこ、加工していないときでも被加工物につζブγこ
印に対して、焦点位置・\の昂精度の位置合わセをする
ことができる。Even when not machining, it is possible to align the focus position and \ with high accuracy with respect to the ζ and γ marks on the workpiece.
さらに、微小穴付きミラーの微小穴は、レーザ光の集光
スポー・ト径に近くすること(−よt)、レーザ光の不
用成分を取り除くスベーシ々ルフィルタの効果も持1こ
せることができる等の効果かある。Furthermore, the micro-holes of the mirror with micro-holes can be made close to the diameter of the focusing port of the laser beam (-yot), and the effect of a basic filter that removes unnecessary components of the laser beam can also be maintained. There is an effect.
第1図はこの発明の一実施例によるレーザ加工モニター
装置の構成図、第2図は第1図に示す装置の動作を説明
する1こめのレーザ加工モニター装置の拡大図、第3図
はこの発明の他の実施例をしめず構成図、第4図は従来
のレーザ加工装置を示す構成図である。
図において(1)はレーサ発振器、(2)はレーザ光、
(3)はベンドミラー、(4)は加工へ・・ド、(5)
は加工レンズ、(6)は被加工物、(7)は加工カス、
(8)はノズル、(9)(2)09(4)は焦点位置、
QOは第二のレンズ、aυ(財)は第一のレンズ、日は
可視光線、α4は照明器、αGは微小穴、αDは微小穴
付きミラー、(ト)は結像レンズ、α9はテレビカメラ
、シηは全反射コーチインク、(イ)は制御lI!I装
訛、aはテレビである−なお、図中、同一符号は同一、
又は相当部分を示す。FIG. 1 is a block diagram of a laser processing monitor device according to an embodiment of the present invention, FIG. 2 is an enlarged view of the laser processing monitor device for explaining the operation of the device shown in FIG. 1, and FIG. FIG. 4 is a block diagram showing another embodiment of the invention, and FIG. 4 is a block diagram showing a conventional laser processing apparatus. In the figure, (1) is a laser oscillator, (2) is a laser beam,
(3) is a bend mirror, (4) is for processing, (5)
is the processed lens, (6) is the workpiece, (7) is the processed waste,
(8) is the nozzle, (9) (2) 09 (4) is the focal position,
QO is the second lens, aυ (goods) is the first lens, day is visible light, α4 is the illuminator, αG is a microhole, αD is a mirror with a microhole, (g) is an imaging lens, α9 is a TV Camera, η is total reflection coach ink, (A) is control lI! I accent, a is TV - In addition, in the figure, the same code is the same,
or a corresponding portion.
Claims (3)
ンドミラーにより加工ヘッドに導き、加工ヘッド内に具
備する加工レンズにより前記レーザ光を集光し、焦点位
置において被加工物を加工する炭酸ガスレーザ加工装置
において、加工レンズとベンドミラーの光路の途中に、
前記ベンドミラー側に第一のレンズと、前記加工レンズ
側に第二のレンズを備えると共に、前記第一のレンズの
焦点位置に傾斜して取り付けた微小穴付きミラーと、前
記ミラーに基づく像を結像する結像レンズを備えたこと
を特徴とする炭酸ガスレーザ加工モニター装置。(1) Carbon dioxide laser processing in which the laser beam output from a carbon dioxide laser oscillator is guided to the processing head by a bend mirror, the laser beam is focused by a processing lens provided in the processing head, and the workpiece is processed at the focal position. In the equipment, in the middle of the optical path between the processing lens and the bend mirror,
A first lens is provided on the bend mirror side, a second lens is provided on the processing lens side, and a mirror with a minute hole is installed at an angle to the focal position of the first lens, and an image based on the mirror is provided. A carbon dioxide laser processing monitor device characterized by being equipped with an imaging lens that forms an image.
ングをしたことを特徴とする特許請求の範囲第1項記載
の炭酸ガスレーザ加工モニター装置。(2) The carbon dioxide laser processing monitor device according to claim 1, wherein the imaging lens is coated with a total reflection coating for carbon dioxide laser light.
工の状態をテレビによりモニターすることを特徴とする
特許請求の範囲第1項又は第2項記載の炭酸ガスレーザ
加工モニター装置。(3) The carbon dioxide laser processing monitoring device according to claim 1 or 2, characterized in that a television camera is provided at the imaging position of the imaging lens, and the processing status is monitored by the television.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62157210A JPS642795A (en) | 1987-06-24 | 1987-06-24 | Monitoring device for carbonic acid gas laser beam machining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62157210A JPS642795A (en) | 1987-06-24 | 1987-06-24 | Monitoring device for carbonic acid gas laser beam machining |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH012795A true JPH012795A (en) | 1989-01-06 |
| JPS642795A JPS642795A (en) | 1989-01-06 |
| JPH0520194B2 JPH0520194B2 (en) | 1993-03-18 |
Family
ID=15644617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62157210A Granted JPS642795A (en) | 1987-06-24 | 1987-06-24 | Monitoring device for carbonic acid gas laser beam machining |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS642795A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009072831A (en) * | 2008-12-25 | 2009-04-09 | Bp Corp North America Inc | Apparatus for forming laser scribes |
| JP5463104B2 (en) * | 2009-09-03 | 2014-04-09 | 株式会社Ihi検査計測 | Laser welding equipment |
| JP5912293B2 (en) * | 2011-05-24 | 2016-04-27 | 株式会社ディスコ | Laser processing equipment |
| WO2025069364A1 (en) * | 2023-09-29 | 2025-04-03 | 株式会社ニコン | Beam scanning device, processing device, and processing method |
-
1987
- 1987-06-24 JP JP62157210A patent/JPS642795A/en active Granted
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