JPH01295478A - Manufacture of metal base substrate - Google Patents
Manufacture of metal base substrateInfo
- Publication number
- JPH01295478A JPH01295478A JP12665788A JP12665788A JPH01295478A JP H01295478 A JPH01295478 A JP H01295478A JP 12665788 A JP12665788 A JP 12665788A JP 12665788 A JP12665788 A JP 12665788A JP H01295478 A JPH01295478 A JP H01295478A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- layer
- ceramic
- sprayed layer
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 25
- 239000002184 metal Substances 0.000 title claims description 25
- 239000000758 substrate Substances 0.000 title claims description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000000919 ceramic Substances 0.000 claims abstract description 41
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 33
- 229920001651 Cyanoacrylate Polymers 0.000 claims abstract description 17
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 8
- 239000007921 spray Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 10
- 239000002904 solvent Substances 0.000 abstract description 5
- 238000005470 impregnation Methods 0.000 abstract description 4
- 239000004925 Acrylic resin Substances 0.000 abstract 4
- 239000012466 permeate Substances 0.000 abstract 1
- 239000011148 porous material Substances 0.000 description 13
- 238000005507 spraying Methods 0.000 description 8
- 239000004033 plastic Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000007751 thermal spraying Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- -1 etc. are used Inorganic materials 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000011866 long-term treatment Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、熱放散性にすぐれた金属ベース基板の製造方
法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a metal base substrate with excellent heat dissipation properties.
（従来の技術）
従来、プリント配線板として用いられる基板は、紙基材
フェノール樹脂積層板、ガラス布基材エポキシ樹脂積層
板、あるいはガラス布基材ポリイミド樹脂積層板などの
プラスチック系基板が用いられてきた。ところが近年、
電子機器の高密度化、高出力化の進歩はめざましく、そ
れに伴なってプリント配線板に用いられる基板材料にも
種々の特性の改善が強く求められるようになってきてい
る。(Prior Art) Conventionally, the substrates used as printed wiring boards are plastic substrates such as paper-based phenol resin laminates, glass cloth-based epoxy resin laminates, or glass cloth-based polyimide resin laminates. It's here. However, in recent years,
BACKGROUND ART Electronic devices have made remarkable progress in increasing their density and output, and along with this, there has been a strong demand for improvements in various properties of substrate materials used in printed wiring boards.
その中でも、プリント配線板に組込まれた電子部品から
発生する熱をいかに効率よく放散するかということは特
に大きな問題である。このことから、基板には熱放散性
すなわち、熱伝導性にすぐれたものが要求されるように
なってきている。Among these, a particularly big problem is how to efficiently dissipate heat generated from electronic components incorporated into printed wiring boards. For this reason, substrates are required to have excellent heat dissipation properties, that is, excellent thermal conductivity.
このような用途には、従来のプラスチック系基板では熱
伝導性が極めて低いために金属ベース基板が使用される
。金属ベース基板とは、−ｉ的にはアルミニウム、銅、
鉄などの金属板の表面にガラス布基材エポキシ樹脂、ガ
ラス布基材ポリイミド樹脂などの絶縁層を形成し、その
上に銅箔からなる導体層を形成したものである。このよ
うな構造にすると絶縁層を介して熱伝導性のよい金属層
が存在するために基板の熱伝導性は従来のプラスチック
系基板よりすぐれる。Metal-based substrates are used for such applications because conventional plastic-based substrates have extremely low thermal conductivity. Metal-based substrates include aluminum, copper,
An insulating layer made of glass cloth base epoxy resin, glass cloth base polyimide resin, etc. is formed on the surface of a metal plate such as iron, and a conductor layer made of copper foil is formed on top of the insulating layer. With this structure, the thermal conductivity of the substrate is superior to that of conventional plastic substrates because a metal layer with good thermal conductivity is present through the insulating layer.
しかし、このような構成の金属ベース基板においては、
熱が金属板に伝わるには熱伝導性の低いプラスチックを
主体とする絶縁層を通過しなければならない。したがっ
て、基板全体の熱伝導性はこの絶縁層で著しく低下し、
金属板の高熱伝導性を有効に生かしているとはいい難い
。However, in a metal base substrate with such a configuration,
In order for heat to be transferred to the metal plate, it must pass through an insulating layer mainly made of plastic, which has low thermal conductivity. Therefore, the thermal conductivity of the entire board is significantly reduced by this insulating layer,
It cannot be said that the high thermal conductivity of the metal plate is effectively utilized.
このようなことから、金属ベース基板の絶縁層としてこ
れまでのプラスチック系からセラミック系で形成しよう
とする考え方があり、古くから検討されている。すなわ
ち、金属板の表面にアルミナなどのセラミックを溶射し
てセラミックの絶縁層を形成する方法である。このよう
にすると、絶縁層もプラスチック系に比べて高熱伝導性
のために金属ベースの高熱伝導性を有効に生かすことが
できる。この方式の基板において導体層の形成は、セラ
ミック溶射層の上にさらに銅を溶射する、あるいはセラ
ミック溶射層の表面に銅をめっきするなどの方法が考え
られている。For this reason, there is a concept of forming the insulating layer of a metal base substrate from a ceramic material instead of the conventional plastic material, and this has been considered for a long time. That is, this is a method of thermally spraying ceramic such as alumina onto the surface of a metal plate to form a ceramic insulating layer. In this way, since the insulating layer also has higher thermal conductivity than plastic-based materials, the high thermal conductivity of the metal base can be effectively utilized. In this type of substrate, the conductor layer can be formed by further thermal spraying copper on the ceramic sprayed layer, or by plating copper on the surface of the ceramic sprayed layer.
（発明が解決しようとする課題）
ところが、このようなセラミック溶射を利用した金属ベ
ース基板には大きな問題点がある。セラミック溶射層に
本質的に存在する気孔の問題である。(Problems to be Solved by the Invention) However, there are major problems with metal-based substrates using such ceramic spraying. This is a problem due to the porosity that inherently exists in ceramic sprayed layers.
セラミック溶射とは、その方式によりガス溶射法、プラ
ズマ溶射法などがあるが、原理はセラミック粉末を高温
で溶融状態にし、高速で被溶射体に衝突させて固化、た
い積させるものである。Ceramic thermal spraying includes gas spraying, plasma spraying, and other methods, but the principle is that ceramic powder is molten at high temperature and collided with the object to be thermally sprayed at high speed to solidify and accumulate.
したがって、本質的に気孔が存在するもので減圧下での
溶射などにより多少少なくはなるものの依然として存在
する。このような気孔を有するセラミック溶射層を絶縁
層として利用すると、特に吸湿時の絶縁特性の低下が太
き（信鎖性の高い基板は得られない、したがって、封孔
処理が必要である。Therefore, pores are essentially present, and although they are somewhat reduced by thermal spraying under reduced pressure, they still exist. If a ceramic sprayed layer having such pores is used as an insulating layer, the insulating properties will deteriorate particularly when moisture is absorbed (a substrate with high reliability cannot be obtained, therefore, pore sealing treatment is necessary).
封孔方法としては、セラミシフ溶射層に樹脂を含浸する
方法が一般的である。すなわち、フェノール樹脂、エポ
キシ樹脂、不飽和ポリエステル樹脂などの熱硬化性樹脂
をスプレー、はけ塗り、浸漬などの方法で塗布して含浸
させて硬化するものである。しかし、この封孔法には次
に述べる二つの問題点がある。A common method for sealing is to impregnate a ceramic sprayed layer with a resin. That is, a thermosetting resin such as a phenol resin, an epoxy resin, or an unsaturated polyester resin is applied by spraying, brushing, dipping, or the like, and is then impregnated and cured. However, this sealing method has two problems as described below.
第一は、セラミック溶射層の気孔の量は溶射条件によっ
て左右され、少ない熱伝導性、耐熱性、密着性などの特
性がすぐれることから気孔の量は少ない方が好ましい、
ところが、セラミック溶射層の気孔の量が少なくなり微
密になると樹脂の含浸性が悪くなる。したがって、含浸
用の樹脂は低粘度であることが必要となるが、上記のよ
うな樹脂はそのままでは粘度が高すぎるために溶剤で希
釈して用いられることが多い、溶剤で希釈して用いると
樹脂を硬化するために加熱した際に発泡しやすくこれを
避けるためには溶剤で希釈した樹脂を何度かに分けて塗
布する、あるいは低温で長時間放置して溶剤を揮散、除
去してから樹脂を硬化する等の対策があるが、工程が煩
雑となり、量産性の面からみると好ましい方法ではない
。First, the amount of pores in the ceramic sprayed layer depends on the thermal spraying conditions, and the smaller the number of pores, the better the properties such as low thermal conductivity, heat resistance, and adhesion.
However, when the amount of pores in the ceramic sprayed layer decreases and becomes micro-dense, resin impregnation becomes poor. Therefore, the resin for impregnation needs to have a low viscosity, but the resins mentioned above have too high a viscosity when used as is, so they are often diluted with a solvent. When heated to harden the resin, it tends to foam, and to avoid this, you can apply the resin diluted with a solvent in several parts, or leave it at a low temperature for a long time to volatilize and remove the solvent. Although there are countermeasures such as curing the resin, the process becomes complicated and is not a preferable method from the viewpoint of mass production.
第２の問題点は、これらの封孔樹脂はセラミック溶射層
に含浸後、硬化するためには長時間、あるいは高温雰囲
気での処理を必要とする点である。The second problem is that these pore-sealing resins require treatment for a long time or in a high-temperature atmosphere in order to harden after being impregnated into the ceramic sprayed layer.
したがってこれも量産性を損なう原因となる。Therefore, this also causes a loss in mass productivity.
本発明は、これらの問題点を解決し、量産性にすぐれた
セラミック溶射層の封孔法を提供し、すなわち、量産性
にすぐれた高熱放散性の金属ベース基板の製造方法を提
供するものである。The present invention solves these problems and provides a method for sealing a ceramic sprayed layer that is suitable for mass production. In other words, it provides a method for manufacturing a metal-based substrate with high heat dissipation that is suitable for mass production. be.
（課題を解決するための手段）
すなわち、本発明は金属板にセラミツを溶射してこれを
絶縁層とする金属ベース基板の製造法において、セラミ
ック層の気孔を封孔するのに樹脂としてシアノアクリレ
ート樹脂を用い、このシアノアクリレート樹脂をセラミ
ック溶射層に塗布、含浸、硬化することを特徴とするも
のである。(Means for Solving the Problems) That is, the present invention is a method for manufacturing a metal base substrate in which ceramic is sprayed onto a metal plate and used as an insulating layer, in which cyanoacrylate is used as a resin to seal the pores of the ceramic layer. The method is characterized in that the cyanoacrylate resin is applied to a ceramic sprayed layer, impregnated, and cured.
シアノアクリレート樹脂は瞬間接着剤として広く用いら
れているが、硬化前は非常に低粘度であり、しかもこの
硬化速度は極めて速い、したがってセラミック溶射層の
気孔を封孔するのにシアノアクリレート樹脂を用いると
、樹脂が低粘度であるために溶剤で希釈せずにそのまま
で容易にセラミック溶射層の気孔に含浸する。しかも、
含浸した後瞬時に硬化するために従来の樹脂のような高
温での長時間処理は必要ない。Cyanoacrylate resin is widely used as an instant adhesive, but it has a very low viscosity before curing, and the curing speed is extremely fast.Therefore, cyanoacrylate resin is used to seal the pores of ceramic sprayed layers. Since the resin has a low viscosity, it can be easily impregnated into the pores of the ceramic sprayed layer without being diluted with a solvent. Moreover,
Because it hardens instantly after being impregnated, there is no need for long-term treatment at high temperatures like with conventional resins.
シアノアクリレート樹脂をセラミック溶射層に塗布する
には、浸漬、ドクターブレード法、ハケ塗り等によるこ
とができる。The cyanoacrylate resin can be applied to the ceramic sprayed layer by dipping, doctor blading, brushing, or the like.
金属板としては、アルミニウム、銅、鉄、ステンレス、
４２合金、インバー合金などが用いられ、セラミック溶
射層のセラミックは溶射のしやすさ、電気絶縁性の点か
らアルミナが好適であるが、その他にムライト、スピネ
ルなどの電気絶縁性のセラミックが用いられる。Metal plates include aluminum, copper, iron, stainless steel,
42 alloy, Invar alloy, etc. are used, and alumina is preferred as the ceramic for the ceramic sprayed layer in terms of ease of spraying and electrical insulation, but electrically insulating ceramics such as mullite and spinel are also used. .
また、シアノアクリレート樹脂により封孔したセラミッ
ク溶射層の表面には樹脂層が形成されるため、そのまま
でその上に銅層を形成すると樹脂層で熱伝導性が大きく
損なわれる。したがって、表面の樹脂層は研磨すること
によって除去してはじめて熱伝導性のよい基板が得られ
るのである。Furthermore, since a resin layer is formed on the surface of the ceramic sprayed layer sealed with cyanoacrylate resin, if a copper layer is formed thereon as it is, the thermal conductivity will be greatly impaired by the resin layer. Therefore, a substrate with good thermal conductivity can only be obtained by removing the resin layer on the surface by polishing.
さらに、セラミック溶射層の表面に形成される導体層は
、一つに銅を溶射することによってｗ４溶射層を形成す
る方法が考えられるが、溶射によって形成される銅層は
気孔が存在するために電気抵抗が高い欠点を有する。し
たがって、無電解銅めっきによって銅めっき層を形成す
るのが最もよい方法である。Furthermore, the conductor layer formed on the surface of the ceramic sprayed layer can be formed by spraying copper on one layer to form a W4 sprayed layer, but since the copper layer formed by spraying has pores, It has the disadvantage of high electrical resistance. Therefore, the best method is to form the copper plating layer by electroless copper plating.
（作用）
従来、金属板の表面に電気絶縁性のセラミック溶射層を
形成して絶縁層とする金属ベース基板において、絶縁特
性を改良するためのセラミック溶射層の封孔は作業性、
量産性に問題であるものであった。(Function) Conventionally, in metal base substrates in which an electrically insulating ceramic sprayed layer is formed on the surface of a metal plate to serve as an insulating layer, sealing of the ceramic sprayed layer to improve insulation properties is difficult to work with.
This was a problem in mass production.
ところが、本発明のように封孔用の樹脂してシアノアク
リレート樹脂を用いると低粘度であるために溶射層への
含浸性が極めてすぐれており、しかも速硬化性であるた
めに含浸後、瞬時に硬化することができる。したがって
、従来のセラミック溶射層の封孔の作業性、量産性を著
しく改善できるものである。However, when a cyanoacrylate resin is used as the sealing resin as in the present invention, its low viscosity allows it to be impregnated into the sprayed layer very well, and it cures quickly, so it can be used instantly after impregnation. can be cured. Therefore, the workability and mass productivity of sealing conventional ceramic sprayed layers can be significantly improved.
（実施例） 本発明の実施例を以下説明する。(Example) Examples of the present invention will be described below.
厚さ１鶴のアルミニウム板の片面をサンドブラスト処理
して粗面化した後、その粗化面にプラズマ溶射装置（プ
ラズマダイン３６００−８０Ｒ型：米国プラズマダイン
社製）を用いてアルミナ（９９，６％アルミナ、昭和電
工型）を溶射して厚さ１００μｍのアルミナ溶射層を形
成した。After roughening one side of an aluminum plate with a thickness of 1 crane by sandblasting, the roughened surface was coated with alumina (99,6 % alumina, Showa Denko type) to form an alumina sprayed layer with a thickness of 100 μm.
このようにして得たアルミナ溶射層をもつアルミニウム
板のアルミナ溶射層にシアノアクリレート樹脂（アロン
アルファ：東亜合成化学型）を塗布した。塗布したシア
ノアクリレート樹脂は瞬時にアルミナ溶射層に含浸し、
その気孔は封孔され、約５分でシアノアクリレート樹脂
は完全に硬化した。このようにして封孔したアルミナ溶
射層の表面を表面研磨機で研磨することによって表面の
樹脂層を除去した後、その表面に無電解銅めっきにより
銅めっき層を形成した。Cyanoacrylate resin (Aron Alpha: Toagosei Chemical Co., Ltd.) was applied to the alumina sprayed layer of the aluminum plate having the alumina sprayed layer thus obtained. The applied cyanoacrylate resin instantly impregnates the alumina sprayed layer,
The pores were sealed and the cyanoacrylate resin was completely cured in about 5 minutes. The surface of the alumina sprayed layer sealed in this way was polished with a surface polisher to remove the resin layer on the surface, and then a copper plating layer was formed on the surface by electroless copper plating.
このようにして得た金属ベース基板は銅めっき層とアル
ミニウム板の間にアルミナ溶射層からなる絶縁層を有す
るため、高い熱放散性を示した。The metal base substrate thus obtained had an insulating layer consisting of an alumina sprayed layer between the copper plating layer and the aluminum plate, and therefore exhibited high heat dissipation.
また、アルミナ溶射層の気孔はシアノアクリレート樹脂
で封孔されているため吸湿もなく、絶縁特性も十分なも
のであった。Furthermore, since the pores of the alumina sprayed layer were sealed with cyanoacrylate resin, there was no moisture absorption and the insulation properties were sufficient.
（発明の効果）
本発明は、従来のセラミック溶射を利用した金属ベース
基板の製造において最も問題であった溶射層の気孔を封
孔する方法に極めて量産性にすぐれた方法を提供するも
のである。この方法によれば熱放散性、耐熱性にすぐれ
、しかも信鯨性の高い金属ベース基板を容易に得ること
ができる。(Effects of the Invention) The present invention provides a method for sealing the pores in a sprayed layer, which has been the most problematic in the production of metal base substrates using conventional ceramic spraying, and is extremely suitable for mass production. . According to this method, it is possible to easily obtain a metal base substrate with excellent heat dissipation and heat resistance, and also with high reliability.
Claims (2)
ック層を形成する第１工程、該セラミック層にシアノア
クリレート樹脂を含浸、硬化する第２工程、シアノアク
リレート樹脂を含浸したセラミック層の表面を研磨して
表面の樹脂層を除去する第３工程、セラミック層の表面
に無電解銅めっきを施して銅めっき層を形成する第４工
程からなることを特徴とする金属ベース基板の製造方法
。1. The first step is to thermally spray an electrically insulating ceramic onto a metal plate to form a ceramic layer, the second step is to impregnate the ceramic layer with a cyanoacrylate resin and harden it, and the surface of the ceramic layer impregnated with the cyanoacrylate resin is polished. A method for manufacturing a metal base substrate, comprising: a third step of removing a resin layer on the surface of the ceramic layer; and a fourth step of applying electroless copper plating to the surface of the ceramic layer to form a copper plating layer.
るものである請求項１記載の金属ベース基板の製造方法
。2. 2. The method of manufacturing a metal base substrate according to claim 1, wherein the electrically insulating ceramic contains alumina as a main component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12665788A JPH01295478A (en) | 1988-05-24 | 1988-05-24 | Manufacture of metal base substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12665788A JPH01295478A (en) | 1988-05-24 | 1988-05-24 | Manufacture of metal base substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01295478A true JPH01295478A (en) | 1989-11-29 |
Family
ID=14940644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12665788A Pending JPH01295478A (en) | 1988-05-24 | 1988-05-24 | Manufacture of metal base substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01295478A (en) |
-
1988
- 1988-05-24 JP JP12665788A patent/JPH01295478A/en active Pending
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