JPH01295960A - Composite adiabatic board - Google Patents
Composite adiabatic boardInfo
- Publication number
- JPH01295960A JPH01295960A JP12333388A JP12333388A JPH01295960A JP H01295960 A JPH01295960 A JP H01295960A JP 12333388 A JP12333388 A JP 12333388A JP 12333388 A JP12333388 A JP 12333388A JP H01295960 A JPH01295960 A JP H01295960A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- synthetic resin
- layer
- resin layer
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 39
- 239000010410 layer Substances 0.000 claims abstract description 84
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 65
- 239000000057 synthetic resin Substances 0.000 claims abstract description 65
- 239000011241 protective layer Substances 0.000 claims abstract description 41
- 125000006850 spacer group Chemical group 0.000 claims abstract description 8
- 239000011800 void material Substances 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 8
- 238000005187 foaming Methods 0.000 abstract 6
- 238000009825 accumulation Methods 0.000 abstract 1
- 230000006866 deterioration Effects 0.000 abstract 1
- 238000009413 insulation Methods 0.000 description 12
- 239000004567 concrete Substances 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004568 cement Substances 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002969 artificial stone Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Building Environments (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は上層の板状保護層と下層の板状発泡合成樹脂
断熱層を一体化した複合断熱板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a composite heat insulating board in which an upper plate-shaped protective layer and a lower plate-shaped foamed synthetic resin heat insulating layer are integrated.
例えば既存の建造物の屋根スラブ上にポリスチレン等か
ら成る板状発泡合成樹脂層を敷設して、屋根を断熱構造
とすることが広く採用されている。そしてこの板状発泡
合成樹脂層が軽量であるために風に飛ばされたり、紫外
線によって破損せぬようにするため、この板状発泡合成
樹脂層上にセメント系平板等から成る板状保護層を縦横
に敷設していた。For example, it is widely used to provide a heat-insulating roof structure by laying a plate-shaped foamed synthetic resin layer made of polystyrene or the like on the roof slab of an existing building. Since this plate-shaped foamed synthetic resin layer is lightweight, in order to prevent it from being blown away by the wind or damaged by ultraviolet rays, a plate-shaped protective layer made of a cement-based flat plate is placed on top of this plate-shaped foamed synthetic resin layer. They were laid out horizontally and vertically.
このような断熱構造の施工を容易とするために、板状保
護層と板状発泡合成樹脂断熱層を予め一体化して一度に
敷設を完了することが考えられる。In order to facilitate the construction of such a heat insulating structure, it is conceivable to integrate the plate-shaped protective layer and the plate-shaped foamed synthetic resin heat insulating layer in advance and complete the installation at once.
しかし、上記のような一体化した複合断熱板には、板状
発泡合成樹脂層が吸収した水分が板状発泡合成樹脂層内
に溜まったまま蒸発しないという問題がある。However, the integrated composite heat insulating board as described above has a problem in that the water absorbed by the foamed synthetic resin plate remains in the foamed synthetic resin layer and does not evaporate.
すなわち第９図及び第１０図に示すのは屋根スラブ上に
敷設した板状保護層ａと板状発泡合成樹脂層すを一体化
した複合断熱板であるが、屋根スラブ上に溜まった水は
蒸発して板状発泡合成樹脂層すの上方に登り、板状保護
層ａの直下近傍の発泡合成樹脂層に多く蓄積することに
なる。In other words, what is shown in Figs. 9 and 10 is a composite heat insulating board that integrates a plate-shaped protective layer a laid on a roof slab and a plate-shaped foamed synthetic resin layer. It evaporates and rises above the plate-shaped foamed synthetic resin layer, and a large amount of it accumulates in the foamed synthetic resin layer immediately below and in the vicinity of the plate-shaped protective layer a.
第１０図に示すように板状発泡合成樹脂層すを上面から
下面にかけて厚さを三等分して検討してみれば、最上方
の板状保護層ａ直下近傍の水分含有率は１２．７％にも
なっている。この水分を板状発泡合成樹脂層す全体にな
らして見れば４．７％となる。実験に使用した板状発泡
合成樹脂層は通常の乾燥した状態で熱伝導率０．０２３
１であるが、この４．７％水分を含有した発泡板は熱伝
導率０．０２７８となった。これは実に熱伝導率が約２
０％上昇したことを示すもので、このような板状発泡合
成樹脂層の断熱性がかなり低下したことを物語っている
。As shown in Fig. 10, if the thickness of the plate-shaped synthetic resin foam layer is divided into three equal parts from the top to the bottom, the moisture content in the vicinity immediately below the uppermost plate-shaped protective layer a is 12. It has reached 7%. If this moisture is equalized to the entire plate-shaped foamed synthetic resin layer, it will be 4.7%. The plate-shaped foamed synthetic resin layer used in the experiment has a thermal conductivity of 0.023 in a normal dry state.
1, but this foam board containing 4.7% water had a thermal conductivity of 0.0278. This actually has a thermal conductivity of about 2
This indicates an increase of 0%, which indicates that the heat insulation properties of such a plate-shaped foamed synthetic resin layer have decreased considerably.
以上は屋根スラブ上の断熱構造について説明したが、道
路の凍結によって路面上に敷設したタイルやブロックの
浮き上りを防ぐために、タイル等の板状保護層下に板状
発泡合成樹脂層を介在させるような場合にも同様な問題
がある。The above has explained the insulation structure on the roof slab, but in order to prevent the tiles and blocks laid on the road surface from lifting up due to frozen roads, a plate-shaped foamed synthetic resin layer is interposed under the plate-shaped protective layer of tiles etc. A similar problem exists in such cases.
この発明は以上のような課題を解決するためになされた
もので、長年の使用によっても板状発泡合成樹脂層が水
分を蓄積せず、断熱性能が低下しない複合断熱板を提供
することを目的とする。This invention was made to solve the above-mentioned problems, and the purpose is to provide a composite heat insulating board in which the plate-shaped foamed synthetic resin layer does not accumulate moisture and its heat insulating performance does not deteriorate even after many years of use. shall be.
この発明にかかる複合断熱板は、板状発泡合成樹脂層が
吸収した水分を蒸発させるための空隙を形成するもので
ある。The composite heat insulating board according to the present invention forms voids for evaporating moisture absorbed by the plate-shaped foamed synthetic resin layer.
上層の板状保護層の下面に突部を設ける。この突部を板
状発泡合成樹脂層の上面に接着する。A protrusion is provided on the lower surface of the upper plate-shaped protective layer. This protrusion is adhered to the upper surface of the plate-shaped foamed synthetic resin layer.
この上層と下層との界面に空隙を形成する。A void is formed at the interface between the upper layer and the lower layer.
また下層の板状発泡合成樹脂層の上面に突部を設ける。Further, a protrusion is provided on the upper surface of the lower plate-shaped foamed synthetic resin layer.
この突部を板状保護層の下面に接着する。この上層と下
層との界面に空隙を形成する。This protrusion is adhered to the lower surface of the plate-shaped protective layer. A void is formed at the interface between the upper layer and the lower layer.
更に上層の板状保護層下枠鎰
樹脂層間に所要厚さのスペーサーを介在させて接着する
。上層と下層との界面に空隙を形成してもよい。Furthermore, a spacer of a required thickness is interposed between the resin layer and the bottom frame of the upper plate-shaped protective layer, and the resin layer is bonded to the lower plate-shaped protective layer. A void may be formed at the interface between the upper layer and the lower layer.
また界面の空隙を一辺から他の辺へ連通ずるよう形成す
ることは好ましい。Further, it is preferable to form the gap at the interface so as to communicate from one side to the other side.
上層の板状保護層と下層の板状発泡合成樹脂層間に形成
した空隙に空気が通ることになる。Air passes through the gap formed between the upper plate-shaped protective layer and the lower plate-shaped foamed synthetic resin layer.
板状発泡合成樹脂層の上方に登った水分は、この空隙へ
蒸発し、板状発泡合成樹脂層の水分含有率が高くなるこ
とがない。The moisture that has risen above the plate-shaped foamed synthetic resin layer evaporates into the voids, and the moisture content of the plate-shaped foamed synthetic resin layer does not become high.
界面の空隙が一辺から他の辺へ連通することにて水分が
外界へより良好に蒸発する。The interfacial voids communicate from one side to the other, allowing moisture to evaporate better into the outside world.
以下、図に示す一実施例に基づきこの発明の詳細な説明
する。Hereinafter, the present invention will be described in detail based on an embodiment shown in the drawings.
図において１は複合断熱板であり、上層の板状保護層２
と下層の板状発泡合成樹脂層３から成っている。板状保
護層２と板状発泡合成樹脂Ｎ３は同サイズの略方形状（
３００ｘ ３００〜６００×６００１ｍが好適）の板体
である。また複合断熱板１は長方形（３００ｘ ６００
〜４５０Ｘ９００ｕ＋が好適）であってもよい。In the figure, 1 is a composite heat insulating board, and the upper plate-shaped protective layer 2
and a lower plate-shaped foamed synthetic resin layer 3. The plate-shaped protective layer 2 and the plate-shaped foamed synthetic resin N3 are approximately rectangular in size (
300 x 300 to 600 x 6001 m (preferably). In addition, the composite insulation board 1 is rectangular (300 x 600
~450X900u+ is suitable).
板状保護層２はモルタル、コンクリート、天然石、人工
石あるいはセラミックにて形成してもよ（、内部に鉄筋
を配筋してもよい。また軽量気泡コンクリート板等を採
用するのも好適である。The plate-shaped protective layer 2 may be formed of mortar, concrete, natural stone, artificial stone, or ceramic (and reinforcing bars may be arranged inside. It is also suitable to use lightweight aerated concrete plates, etc. .
板状発泡合成樹脂Ｎ３はポリスチレン、ポリ塩化ビニル
、ポリエチレン、ポリプロピレン。Plate-shaped foamed synthetic resin N3 is polystyrene, polyvinyl chloride, polyethylene, and polypropylene.
ポリウレタン等の合成樹脂製発泡板が採用できる。A foam board made of synthetic resin such as polyurethane can be used.
この発明にかかる複合断熱板１では上層の板状保護層２
と下層の板状発泡合成樹脂層３との界面に空隙４を形成
するものである。In the composite heat insulating board 1 according to the present invention, the upper plate-like protective layer 2
A void 4 is formed at the interface between the foamed synthetic resin layer 3 and the lower plate-shaped foamed synthetic resin layer 3.
第１図及び第２図に示す実施例では、板状保護層２の下
面に突部５が形成されである。第１図に示すのは突部５
は板状保護層２の一方向に連続するもので、この突部５
が巾方向に適宜間隔づつ離れて複数条形成されている。In the embodiment shown in FIGS. 1 and 2, a protrusion 5 is formed on the lower surface of the plate-shaped protective layer 2. As shown in FIG. Figure 1 shows the protrusion 5.
is continuous in one direction of the plate-shaped protective layer 2, and this protrusion 5
A plurality of strips are formed at appropriate intervals in the width direction.
従って表層板体２の下面は巾方向に凹凸が連続している
。Therefore, the lower surface of the surface plate 2 has continuous irregularities in the width direction.
板状保護層２の厚さ！、は１０〜５０ｍ■好しくは１５
〜２５龍が通常であり、下層の板状発泡合成樹脂層３の
厚さ１２は通常２５〜５０龍のものが採用でき、突部５
の高さｈとしては、２〜２０ｗ程度が採用できる。好ま
しくは突部５の高さｈは５〜１０１璽程度が良い。（第
８図）
以上のような板状保護層２の突部５をフラットな板状発
泡合成樹脂層３の上面に接着する。Thickness of plate-like protective layer 2! , is 10 to 50 m, preferably 15
~25 mm is normal, and the thickness 12 of the lower plate-shaped foamed synthetic resin layer 3 can normally be 25 ~ 50 mm.
As the height h, about 2 to 20 W can be adopted. Preferably, the height h of the protrusion 5 is about 5 to 101 cm. (FIG. 8) The protrusion 5 of the plate-shaped protective layer 2 as described above is adhered to the upper surface of the flat plate-shaped foamed synthetic resin layer 3.
接着するための接着材７としてはラテックスセメント、
エポキシ樹脂１モルタル等が採用できる。また両面テー
プ等でもよい。The adhesive 7 for bonding is latex cement,
Epoxy resin 1 mortar etc. can be used. Alternatively, double-sided tape or the like may be used.
このように接着して一体化した板状保ｓＩ層２と板状発
泡合成樹脂層３との界面に空隙４が形成されることにな
る。空隙４は複合断熱板１の表面積のうち２０〜８０％
であることが好ましい。A void 4 is formed at the interface between the plate-shaped insulation layer 2 and the plate-shaped foamed synthetic resin layer 3 which are bonded and integrated in this manner. The void 4 accounts for 20 to 80% of the surface area of the composite insulation board 1.
It is preferable that
これ以下であると水分の蒸発が不良となるし、これ以上
であると突部５が板状発泡合成樹脂層３表面にめり込ん
で空隙４が無くなってしまうことがある。If it is less than this, moisture evaporation will be poor, and if it is more than this, the protrusion 5 may sink into the surface of the plate-shaped foamed synthetic resin layer 3, and the void 4 may disappear.
水分蒸発の良否は空隙４の形状や分散状況による。好ま
しいのは、空隙４ができるかぎり細分化されてあり、し
かも空隙４が一辺から他の辺へ連通し外部へ通気するよ
う配されていることである。The quality of water evaporation depends on the shape of the voids 4 and the state of dispersion. It is preferable that the voids 4 are as finely divided as possible, and that the voids 4 are arranged so as to communicate from one side to the other and ventilate to the outside.
第２図に示す実施例では、突部５は板状保護Ｎ２の下面
に複数個離れて突設されている。突部５．５をフラット
な板状発泡合成樹脂層３上面と接着して空隙４を形成す
るが、この空隙４は複合断熱板１の四周へ通気可能とな
っている。In the embodiment shown in FIG. 2, a plurality of protrusions 5 are provided on the lower surface of the plate-shaped protection N2 at a distance. The protrusion 5.5 is adhered to the upper surface of the flat plate-shaped foamed synthetic resin layer 3 to form a gap 4, which allows air to pass through the four circumferences of the composite heat insulating board 1.
第３図及び第４図に示す実施例は板状発泡合成樹脂層３
上面に突部８を形成した場合であって、第３図に示す実
施例は一方向に連続する突部８を複数本平行に突設した
場合である。また第４図に示す実施例は板状発泡合成樹
脂層３上面に複数個の突部８を形成した場合である。板
状保ｇｉｉ層２との界面に空隙４が形成されることにな
る。The embodiment shown in FIGS. 3 and 4 is a plate-shaped foamed synthetic resin layer 3.
This is a case in which protrusions 8 are formed on the upper surface, and the embodiment shown in FIG. 3 is a case in which a plurality of protrusions 8 that are continuous in one direction are protruded in parallel. Further, the embodiment shown in FIG. 4 is a case where a plurality of protrusions 8 are formed on the upper surface of the plate-shaped foamed synthetic resin layer 3. A void 4 is formed at the interface with the plate-like protective layer 2.
第５図に示す実施例は、フラットな板状保護層２と板状
発泡合成樹脂層３を使用した場合であって、板状保護層
２と板状発泡合成樹脂層３間にスペーサー１０を介在さ
せた場合である。The embodiment shown in FIG. 5 uses a flat plate-shaped protective layer 2 and a plate-shaped foamed synthetic resin layer 3, and a spacer 10 is provided between the plate-shaped protective layer 2 and the plate-shaped foamed synthetic resin layer 3. This is a case of intervention.
スペーサー１０は所要の厚さを有する合成樹脂。The spacer 10 is made of synthetic resin having a required thickness.
木材、セメント材等の部材である。このスペーサー１０
を板状保護層２と板状発泡合成樹脂層３間の適宜位置に
介在させて、上下面を接着材７によって各々接着し、上
層の板状保護層２と下層の板状発泡合成樹脂層３を一体
化する。板状保護層２と板状発泡合成樹脂層３との界面
には、スペーサーｉｏ、 ｉｏの間を抜ける空隙４が形
成されることになる。It is a material such as wood or cement material. This spacer 10
are interposed at appropriate positions between the plate-shaped protective layer 2 and the plate-shaped foamed synthetic resin layer 3, and the upper and lower surfaces are adhered to each other with an adhesive 7, thereby forming the upper plate-shaped protective layer 2 and the lower plate-shaped foamed synthetic resin layer. Integrate 3. A gap 4 is formed at the interface between the plate-shaped protective layer 2 and the plate-shaped foamed synthetic resin layer 3, passing between the spacers io, io.
以上のようにして形成した複合断熱板１を屋根スラブ１
１上に縦横に並べて敷きつめる。屋根スラブ１１上に溜
まった水が板状発泡合成樹脂層３に吸収されて上方に登
った場合、空隙４を通って水分が蒸発する。複合断熱板
１の四周から出た水分は、隣り合う複合断熱板１，１間
の目地から外へ抜ける。このように複合断熱板１の板状
発泡合成樹脂層３内の水分が蒸発して乾燥し、断熱性が
低下することがない。The composite insulation board 1 formed as described above is used as a roof slab 1.
Lay them out vertically and horizontally on top. When water accumulated on the roof slab 11 is absorbed by the plate-shaped foamed synthetic resin layer 3 and rises upward, the water passes through the voids 4 and evaporates. Moisture coming out from the four circumferences of the composite insulation board 1 escapes to the outside through the joint between the adjacent composite insulation boards 1, 1. In this way, the moisture in the plate-shaped foamed synthetic resin layer 3 of the composite heat insulating board 1 does not evaporate and dry, and the heat insulating properties do not deteriorate.
本発明にかかる複合断熱板を東京のコンクリート系住宅
屋上に敷設し４年間放置後その含水率を測定した。第８
図に示すように、この空隙４を形成した複合断熱板１に
あっては、厚さ方向を三等分して検出してみた場合、最
上方部分であっても １．２％の含水率しか示さなかっ
た。これは板状発泡合成樹脂層３全体にならしてみると
、 ０．８％の含水率にしかならず、実験に使用した
板状発泡合成樹脂層の通常の熱伝導率０．０２３１と余
り変らぬ熱伝導率０．０２３９を示した。A composite heat insulating board according to the present invention was laid on the roof of a concrete house in Tokyo, and after being left for four years, its moisture content was measured. 8th
As shown in the figure, when the composite heat insulating board 1 with the voids 4 is divided into three equal parts in the thickness direction, the water content is 1.2% even in the uppermost part. only showed. When this is normalized to the entire plate-shaped foamed synthetic resin layer 3, the moisture content is only 0.8%, which is not much different from the normal thermal conductivity of the plate-shaped foamed synthetic resin layer used in the experiment, which is 0.0231. It showed a thermal conductivity of 0.0239.
なお、第８図の複合断熱板は、第１図に示した形状と寸
法を有する。即ち、４５０ Ｘ ４５０１ｍの方形であ
り、上層の板状保護層２の厚さり、が２５龍、下層の板
状発泡合成樹脂層３の厚さｌ。The composite heat insulating board shown in FIG. 8 has the shape and dimensions shown in FIG. That is, it is a rectangle measuring 450 x 4501 m, the thickness of the upper plate-shaped protective layer 2 is 25 mm, and the thickness of the lower plate-shaped foamed synthetic resin layer 3 is 1.
が５０鶴、板状保護層の突部は平行に９条形成され、そ
の巾は両端４５ｎ、中間４０ｍ、高さｈが１Ｏｎである
。この場合の空隙面積率は、４４％である。The protrusions of the plate-like protective layer are formed in 9 parallel stripes, the width of which is 45n at both ends, 40m in the middle, and 1On in height. The void area ratio in this case is 44%.
又、比較の前に空隙を有さない複合断熱板について同様
に東京のコンクリ−１・系住宅屋上に敷設し４年間放置
後その含水率を測定した。その結果は前述した第１０図
の複合断熱板に示すように板状発泡合成樹脂層の最上部
で１２．７％にもなった。そこで平均では４．７％もの
含水率となった。なお、第１０図の複合断熱板は、４５
０Ｘ ４５（ｂｍの方形であり、板状保護層ｌ、が２５
鶴、下層の板状発泡合成樹脂層の厚さｌｔが５０ｍのも
のである。In addition, before comparison, a composite heat insulating board without voids was similarly laid on the roof of a concrete 1 type house in Tokyo, and its moisture content was measured after it was left for 4 years. The result was as high as 12.7% at the top of the plate-shaped foamed synthetic resin layer, as shown in the above-mentioned composite heat insulating board in FIG. Therefore, the average moisture content was 4.7%. The composite heat insulating board shown in Fig. 10 has a diameter of 45
0X 45 (bm square, plate-like protective layer l, 25
The thickness of the lower plate-shaped foamed synthetic resin layer is 50 m.
以上の実施例は屋根スラブ上の断熱構造に複合断熱板１
を使用した場合であるが、その地道路の凍結防止を図る
断熱構造にもこの発明にかかる複合断熱板１を使用する
ことができる。この場合板状像８８Ｎ２としてはタイル
等のセラミック板等も採用できる。In the above embodiment, the composite insulation board 1 is used for the insulation structure on the roof slab.
However, the composite heat insulating board 1 according to the present invention can also be used in a heat insulating structure for preventing freezing of local roads. In this case, a ceramic plate such as a tile can be used as the plate-shaped image 88N2.
この発明にかかる複合断熱板は上層の板状保護層と下層
の板状発泡合成樹脂層間に空隙を設けたものである。従
って板状発泡合成樹脂層に吸収された水分は空隙を通っ
て蒸発し、板状発泡合成樹脂層は乾燥状態を保つことと
なる。これによって断熱板体の熱伝導率が低く維持され
、複合断熱板の断熱性能が低下することがない。The composite heat insulating board according to the present invention has a gap between an upper plate-shaped protective layer and a lower plate-shaped foamed synthetic resin layer. Therefore, the moisture absorbed in the plate-shaped foamed synthetic resin layer evaporates through the voids, and the plate-shaped foamed synthetic resin layer is kept in a dry state. As a result, the thermal conductivity of the heat insulating board is maintained low, and the heat insulating performance of the composite heat insulating board does not deteriorate.
また空隙を複合断熱板の一辺から他の一辺に連通ずるよ
う形成すると、水分の蒸発がより良好になり、板状発泡
合成樹脂層の乾燥状態をより良く保つことができる。Furthermore, if the voids are formed so as to communicate from one side of the composite heat insulating plate to the other side, moisture evaporation will be better, and the dry state of the plate-shaped foamed synthetic resin layer can be better maintained.
第１図〜第５図はこの発明にかかる複合断熱板を示すも
ので（Ｉ）は分解斜視図、（ｎ）は断面図、第６図は屋
根スラブ上に複合断熱板を敷設した状態の斜視図、第７
図はその断面図、第８図は複合断熱板の一部拡大断面図
、第９図は従来の複合断熱板の断面図、第１０図はその
一部拡大図である。
１・・・・・・複合断熱板、 ２・・・・・・板状保護
層、３・・・・・・板状発泡合成樹脂層、４・・・・・
・空隙、５・・・・・・突部、 ７・・・・・・
接着材、８・・・・・・突部、 １０・・・・・
・スペーサー、１１・・・・・・屋根スラブ。
第２図
（Ｉ）
第 ５ 区
（Ｉ）
第８図
第９図
第 １０ 図Figures 1 to 5 show the composite insulation board according to the present invention, where (I) is an exploded perspective view, (n) is a sectional view, and Figure 6 shows the composite insulation board laid on a roof slab. Perspective view, No. 7
8 is a partially enlarged sectional view of a composite heat insulating board, FIG. 9 is a sectional view of a conventional composite heat insulating board, and FIG. 10 is a partially enlarged view of the same. DESCRIPTION OF SYMBOLS 1... Composite heat insulating board, 2... Plate-shaped protective layer, 3... Plate-shaped foamed synthetic resin layer, 4...
・Gap, 5...protrusion, 7...
Adhesive material, 8...Protrusion, 10...
・Spacer, 11...Roof slab. Figure 2 (I) Ward 5 (I) Figure 8 Figure 9 Figure 10
Claims (4)
が重合一体化された複合断熱板であって、前記の板状保
護層の下面に突部を設け、この突部を前記の板状発泡合
成樹脂層に接着して、上層と下層との界面に空隙を形成
したことを特徴とする複合断熱板。(1) A composite heat insulating board in which an upper plate-shaped protective layer and a lower plate-shaped foamed synthetic resin layer are polymerized and integrated, and a protrusion is provided on the lower surface of the plate-shaped protective layer. A composite heat insulating board, characterized in that it is adhered to the above plate-shaped foamed synthetic resin layer to form a void at the interface between the upper layer and the lower layer.
が重合一体化された複合断熱板であって、前記の板状発
泡合成樹脂層の上面に突部を設け、この突部を前記の板
状保護層に接着して、上層と下層との界面に空隙を形成
したことを特徴とする複合断熱板。(2) A composite heat insulating board in which an upper plate-shaped protective layer and a lower plate-shaped foamed synthetic resin layer are polymerized and integrated, and a protrusion is provided on the upper surface of the plate-shaped synthetic resin layer. 1. A composite heat insulating board, characterized in that a part is adhered to the above-mentioned plate-shaped protective layer, and a void is formed at the interface between the upper layer and the lower layer.
が重合一体化された複合断熱板であって、前記の板状保
護層と板状発泡合成樹脂層間に所要厚さのスペーサーを
介在させて接着し、上層と下層との界面に空隙を形成し
たことを特徴とする複合断熱板。(3) A composite heat insulating board in which an upper plate-shaped protective layer and a lower plate-shaped foamed synthetic resin layer are polymerized and integrated, wherein a required thickness is formed between the plate-shaped protective layer and the plate-shaped foamed synthetic resin layer. A composite heat insulating board characterized by having a spacer interposed and bonded to form a void at the interface between an upper layer and a lower layer.
するよう形成されたことを特徴とする請求項（１）、（
２）又は（３）記載の複合断熱板。(4) Claims (1) and (4) characterized in that the void at the interface is formed so as to communicate from one side to the other side and ventilate to the outside.
2) or the composite heat insulating board described in (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12333388A JPH01295960A (en) | 1988-05-20 | 1988-05-20 | Composite adiabatic board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12333388A JPH01295960A (en) | 1988-05-20 | 1988-05-20 | Composite adiabatic board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01295960A true JPH01295960A (en) | 1989-11-29 |
Family
ID=14857964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12333388A Pending JPH01295960A (en) | 1988-05-20 | 1988-05-20 | Composite adiabatic board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01295960A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6033227B2 (en) * | 1980-07-10 | 1985-08-01 | 富士電機株式会社 | Double-sided flat open case |
| JPS61270448A (en) * | 1985-05-23 | 1986-11-29 | 鐘淵化学工業株式会社 | Protective block |
-
1988
- 1988-05-20 JP JP12333388A patent/JPH01295960A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6033227B2 (en) * | 1980-07-10 | 1985-08-01 | 富士電機株式会社 | Double-sided flat open case |
| JPS61270448A (en) * | 1985-05-23 | 1986-11-29 | 鐘淵化学工業株式会社 | Protective block |
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