JPH01302829A - electrical circuit equipment - Google Patents

Abstract

PURPOSE:To enable the number of connection parts at the edge part of electrical circuit parts to be increased, high density and cost reduction to be achieved and, a device which can be easily produced and can be easily managed after production to be obtained by providing at least specific electrical connection members, the electrical circuit parts, and other electrical circuit parts. CONSTITUTION:This device has at least an electrically connected member 125 where a plurality of conductive members 107 are embedded within a retainer 111 consisting of an insulating material and both edges are exposed on both surfaces of the retainer 111, an electrical circuit parts 104 which are one or more electrical circuit parts where at least one edge of a conductive member 107 exposed on the surface of the retainer 111 is connected and where the connection part 105 exists at the edge part of the electrical circuit parts, and an electrical circuit parts 184 which are one or more electrical circuit parts with a connection part 194 where at least one other edge of the conductive members 107 exposed on the surface of the retainer 111 and where the connection part 194 exists at the edge part of that electrical circuit parts.

Description

[Detailed description of the invention] [Industrial application fields] TECHNICAL FIELD The present invention relates to an electric circuit device.

[Prior Art] Conventionally, the following techniques are known as techniques for electrically connecting electric circuit components to each other.

■Wire bonding method Figures 11 and 12 show typical examples of semiconductor devices connected and sealed by the wire bonding method, and the wire bonding method will be explained below based on Figures 11 and 12. .

In this method, the semiconductor element 4 is fixedly supported on the element mounting part 2 using Ag paste 3 or the like, and then the connection part 5 of the semiconductor element 4 and the desired connection part 6 of the lead frame 1 are connected with ultrafine material such as gold. This is a method of electrically connecting using metal wires 7.

After the connection, the semiconductor element 4 and the lead frame 1 are sealed using a thermosetting resin 8 such as epoxy resin by a method such as transfer molding, and then the leads extending outward from the resin-sealed parts are sealed. A semiconductor device 9 is made by cutting unnecessary parts of the frame 1 and bending them into a desired shape.

■T A B (Tape Automated Bo
nding) method (for example, Japanese Patent Application Laid-Open No. 139636-1983)
13 shows a typical example of a semiconductor device connected and sealed by the TAB method.

This method is an automatic bonding method using a tape carrier method. That is, to explain based on FIG. 13, after positioning the carrier film substrate 16 and the semiconductor element 4, the inner lead part 17 of the carrier film substrate 16 and the connecting part 5 of the semiconductor element 4 are connected by thermocompression bonding. This is the way to do it. After the connection, the semiconductor device 9 is sealed with resin 20 and resin 21, which are thermosetting resins such as epoxy resin.

■CCB (Controlled Co11apse
Bonding) law (for example, Special Publication Act 1977
(No. 6, Japanese Unexamined Patent Publication No. 60-57944) FIG. 14 shows a typical example of a semiconductor device connected and sealed by the CCB method. This method will be explained based on FIG. 14. Note that this method is also called a flip chip bonding method.

A solder bump 31 is provided in advance on the connection portion 5 of the semiconductor element 4,
The semiconductor element 4 provided with the solder bumps 31 is mounted on the circuit board 3.
Position and mount it on 2.

Thereafter, the circuit board 32 and the semiconductor element 4 are connected by heating and melting the solder, and after cleaning with flux, the semiconductor device 9 is sealed.

■The method shown in FIGS. 15 and 16, that is, an insulating film 71 made of polyimide or the like is formed on a portion of the first semiconductor element 4 other than the connection portion 5, and a metal material 71 made of Au or the like is formed on the connection portion 5. , and then the exposed surfaces 73 and 72 of the metal material 70 and the insulating film 71 are flattened. On the other hand, an insulating film 71° made of polyimide or the like is formed on a portion other than the connecting portion 5° of the second semiconductor element 4′, a metal material 70′ made of Au or the like is provided on the connecting portion 5°, and then a metal material 70′ made of Au or the like is provided on the connecting portion 5°. exposed surface 73' of the material 70° and the insulating film 71',
Flatten 72'.

After that, as shown in FIG. 16, the first semiconductor element 4 and the second semiconductor element 4' are positioned, and after positioning,
By thermocompression bonding, the connection portion 5 of the first semiconductor element 4 and the connection portion 5' of the second semiconductor element 4' are bonded to the metal material 70.7.
Connect via 0'.

■The method shown in FIG. 17, that is, the first circuit board 75 and the second circuit board 75'
An anisotropic conductive film 78 in which conductive particles 79 are dispersed in an insulating material 77 is interposed between the first circuit board 75 and the second circuit board 75.
After positioning the circuit board at 75°, apply pressure or
By applying pressure and heating, the connecting portion 76 of the first circuit board 75 and the second
This is a method of connecting the connecting portion 76° of the circuit board 75°.

■The method shown in FIG. 18, that is, the first circuit board 75 and the second circuit board 75'
An elastic connector 83 made of an insulating material 81 in which metal wires 82 made of Fe, Cu, etc. are arranged in a certain direction is interposed between them to position the first circuit board 75 and the second circuit board 75°. After applying pressure, the connecting portion 76 of the first circuit board 75 and the connecting portion 76 of the second circuit board 75° are connected.
This is a method of connecting ゛.

[Problems to be Solved by the Invention] The conventional bonding method described above has the following problems.

■Wire bonding method■ When designing the connecting part 5 of the semiconductor element 4 to be placed inside the semiconductor element 4, the ultra-fine metal wire 7 has an extremely small wire diameter, so the outer peripheral edge 10 of the semiconductor element 4 or the lead It becomes easier to contact the outer peripheral edge 11 of the element mounting portion 2 of the frame 1. The ultra-fine metal wire 7 is attached to these outer peripheral edges 10 to 11.
It will short circuit if it comes into contact with. Furthermore, the length of the ultra-fine metal wire 7 has to be increased, and if the length is increased, the ultra-fine metal wire 7 becomes easily deformed during transfer molding.

Therefore, the connecting portion 5 of the semiconductor element 4 needs to be arranged around the semiconductor element 4, which imposes restrictions on circuit design.

■In the wire bonding method, in order to avoid contact between adjacent ultrafine metal wires 7, the pitch dimension of the connecting portions 5 on the semiconductor element 4 (distance between the centers of adjacent connecting portions is 1I).
iIt) It is necessary to maintain a certain amount of distance. Therefore, once the size of the semiconductor element 4 is determined, the maximum number of connection portions 5 is necessarily determined.

However, in the wire bonding method, the pitch dimension is usually as large as about 0.2 mm, so the number of connecting parts 5 must be reduced.

■The height h of the ultrafine metal wire 7 measured from the connection part 5 on the semiconductor element 4 is usually 0.2 to 0.4 mm, but it is 0.2 mm.
Since it is relatively difficult to make the device thinner than below, the device cannot be made thinner.

■Wire bonding takes time. In particular, when the number of connection points increases, bonding time becomes longer and production efficiency deteriorates.

- If the transfer molding condition range is exceeded for some reason, the ultrafine metal wire 7 may be deformed or, in the worst case, may be cut.

Furthermore, in the connection portion 5 on the semiconductor element 4, since AJZ, which is not alloyed with the ultrafine metal wire 7, is exposed, A1 corrosion is likely to occur, resulting in a decrease in reliability.

(2) If the resin 8 is injected at high pressure, the ultrafine metal wire 7 will be deformed or cut, so thermoplastic resins that need to be injected at high pressure cannot be used, and there are restrictions on the resin.

(2) When the semiconductor element 4 becomes defective, it is difficult to replace only the semiconductor element 4.

■TAB method■ If the connecting part 5 of the semiconductor element 4 is designed to be placed inside the semiconductor element 4, the length of the inner lead part 17 of the carrier film substrate 16 becomes long, and the inner lead part 17 becomes easily deformed. The inner lead portion may not be connected to the desired connection portion 5, or the inner lead portion 17 may come into contact with a portion of the semiconductor element 4 other than the connection portion 5.

In order to avoid this, it is necessary to bring the connecting portion 5 of the semiconductor element 4 to the periphery of the semiconductor element 4, which is subject to design limitations.

■ In the TAB method as well, the pitch dimension of the connecting parts on the semiconductor element 4 must be set to about 0.09 to 0.15 mm, and therefore, as mentioned in the problem of the wire bonding method (■), the number of connected parts must be increased. Things become difficult.

(2) In order to prevent the inner lead portions 17 of the carrier film substrate 16 from coming into contact with parts other than the connection portions 5 of the semiconductor element 4, a connection shape of the inner lead portions 17 is required for this purpose, which increases costs.

(2) In order to connect the connecting portion 5 of the semiconductor element 4 and the inner lead portion 17, a gold bump must be attached to the connecting portion 5 of the semiconductor element 4 or the connecting portion of the inner lead portion 17, which increases the cost.

■The thermal expansion coefficient of the semiconductor element 4 is between resin 20 and resin 21.
Since the coefficient of thermal expansion is different from that of , when heat is applied to the semiconductor device 9 , thermal stress is generated and the characteristics of the semiconductor element 4 are deteriorated. Furthermore, the semiconductor element 4 or the resin 20 or the resin 2
Cracks occur in 1, reducing the reliability of the device. This phenomenon becomes remarkable when the size of the semiconductor element 4 is large.

(2) When the semiconductor element 4 becomes defective, it is difficult to replace only the semiconductor element 4.

(2) CCB method (2) Solder bumps 31 must be formed at the connection portions 5 of the semiconductor element 4, resulting in high costs.

■If the amount of solder on the bumps is large, a bridge will occur between adjacent solder bumps (a phenomenon in which adjacent solder bumps come into contact with each other), and conversely, if the amount of solder on the bumps is small, the connection between the connection part 5 of the semiconductor element 4 and the board 32 will occur. The portion 33 is no longer connected and electrical continuity is no longer established. In other words, the reliability of the connection becomes low.

Furthermore, the amount of solder and the solder shape of the connection affect the reliability of the connection]
on of ControlledCollapses
e Interconnections”, L, S,
Goldman.

IBM J, RES, DEVELOP, 1969
MAY, pp251-265゜@Re1iabil
property of Controlled Co11aps
e Inter-connections”, K, C
, Norrfs, A.)1. Landzberg.

IBM J, RES, DEVELOP, 1969
JAY, pp266-271゜Brazing Technology Research Group Technical Data, No. 017-''84, Published by Brazing Technology Research Group).

As described above, since the amount of solder bumps 31 affects the reliability of the connection, it is necessary to control the amount of solder bumps 31.

(2) If the solder bumps 31 are present inside the semiconductor element 4, it becomes difficult to visually inspect whether or not the connection has been made well.

■Poor heat dissipation of semiconductor elements (reference material: Electr
onic Packaging'Technology
1987.1゜(Vol, 3. No, 1) P, 6
6-71. NI NI EI MICRODEVI (:E
S1986. May, P, 97-108) Therefore, great efforts are required to improve the heat dissipation characteristics.

■Technique shown in FIGS. 15 and 16■ Flatten the exposed surface 72 of the insulating film 71, the exposed surface 73 of the metal material 70, or the exposed surface 72' of the insulating film 71' and the exposed surface 73° of the metal material 70°. This increases the number of steps required and increases costs.

■ If there is unevenness on the exposed surface 72 of the insulating film 71 and the exposed surface 73 of the metal material 70 or on the exposed surface 72' of the insulating film 71° and the exposed surface 73' of the metal material 70', the metal material 70 and the metal material 70'
connection will be lost, and reliability will decrease.

(2) When semiconductor element 4.4° becomes defective, it is difficult to replace only semiconductor element 4.4°.

■Technology shown in Fig. 17■ After positioning, when applying pressure to connect the connecting portions 76 and 76', it is difficult to apply constant pressure, resulting in variations in the connection state, and as a result, the connecting portions The variation in contact resistance value becomes large. Therefore, the reliability of the connection becomes poor.

In addition, when a large amount of current is passed, phenomena such as heat generation occur, so it is not suitable when a large amount of current is desired to be passed.

■Even if a constant pressure is applied, the anisotropic conductive film 78
Due to the arrangement of the conductive particles 79, variations in the resistance value become large. Therefore, the reliability of the connection becomes poor. Furthermore, it is not suitable for cases where a large amount of current needs to flow.

(2) If the pitch between adjacent connecting portions (distance rMi between the centers of adjacent connecting portions) is narrowed, the resistance value between adjacent connecting portions will decrease, which is not suitable for high-density connections.

■The amount of protrusion at the connection part 76.76° of the circuit board 75, 75° Since the resistance value changes due to variations in h
It is necessary to accurately control the amount of variation.

■Furthermore, when an anisotropic conductive film is used for connecting a semiconductor element and a circuit board, or for connecting a first semiconductor element and a second semiconductor element, in addition to the above-mentioned drawbacks, It is necessary to attach a bump to the connection part of the connector, which has the disadvantage of increasing costs.

(2) When either one of the circuit boards 75 or 75'' becomes defective, it is difficult to replace only that circuit board.

■Technology shown in Figure 18 ■Pressure is required, and a pressure jig is required.

■The contact resistance between the metal wire 82 of the elastic connector 83 and the connection part 76 of the first circuit board 75 and the connection part 76 of the second circuit board 75' changes depending on the pressing force and surface condition, so the connection lack of reliability.

■Since the metal wire 82 of the elastic connector 83 is a rigid body, if the pressing force is large, the elastic connector 83
There is a high possibility that the surfaces of the first circuit board 75 and the second circuit board 75° will be damaged. Moreover, if the pressing force is small, the reliability of the connection will be poor.

■Furthermore, the connection part 76.76' of the circuit board 75.75'
Since the protrusion 'M h 2 of the elastic connector 83, the protrusion amount h3 of the metal wire 82 of the elastic connector 83, and its dispersion affect resistance value change and breakage, it is necessary to devise ways to reduce the dispersion.

(2) Furthermore, when an elastic connector is used to connect a semiconductor element and a circuit board, or to connect a first semiconductor element and a second semiconductor element, the same drawbacks as described in (1) to (2) arise.

The present invention solves all of the above-mentioned problems and proposes a high-density, high-reliability, and low-cost electrical circuit device, which replaces the conventional connection method and sealing method. Of course, it is possible to obtain high-density multi-point connections and improve thermal and other properties.

(The following is a blank space) [Means for Solving the Problems] The first gist of the present invention is to provide a device comprising a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder. , one end of the electrically conductive member is exposed on one surface of the holder, and the other end of the electrically conductive member is exposed on the other surface of the holder. and an electrical connection member; having at least one or more connection parts, in the connection part,
at least one electrical circuit component to which one end of at least one of the electrically conductive members exposed on the surface of the holder is connected, and the connection portion is connected to an end of the electrical circuit component; with an electric circuit component existing in
At least one other electrical circuit component to which the other end of at least one of the electrically conductive members exposed on the surface of the holder is connected, the connection portion being an end of the electrical circuit component. present in an electrical circuit device having at least an electrical circuit component;

The second gist of the present invention is that in the first gist of the present invention,
At least one of the electrical circuit components is connected by metallizing and/or alloying the connection portion and the end of the electrically conductive member, and the other electrical circuit component is connected by metallizing and/or alloying the connection portion and the end of the electrically conductive member.
Or, it exists in an electric circuit device characterized by being connected by means other than alloying.

The third gist of the present invention is that in the first gist of the present invention,
There is an electric circuit device characterized in that all of the electric circuit components are connected by metallizing and/or alloying the connecting portions and the ends of the electrically conductive members.

The fourth gist of the present invention is that in the first gist of the present invention,
There is an electrical circuit device characterized in that all of the electrical circuit components are connected at their connections and at the ends of the electrically conductive members by methods other than metallization and/or alloying.

A fifth aspect of the present invention resides in the electric circuit device according to the first to fourth aspects of the present invention, characterized in that at least one of the electric circuit components is detachably connected. .

A sixth aspect of the present invention is that in the second or third aspect of the present invention, at least two or more electric circuit components are connected by metallization and/or alloying, and regarding the electric circuit component that is desired to be attached or detached. The melting point of the metal layer and/or alloy layer formed by metallization and/or alloying is the melting point of the metal layer and/or alloy layer formed by metallization and/or alloying for non-removable electrical circuit components. Present in electrical circuit devices characterized by lower

The constituent elements of the present invention will be individually explained below.

('M, electrical circuit component) As the electric circuit component in the present invention, for example, a circuit board (hereinafter sometimes simply referred to as a circuit board) such as a resin circuit board, a ceramic board, a metal board, a silicon board, a semiconductor element, Examples include lead frames.

Note that only one electric circuit component connected to the electrical connection member may be present on one surface of the holder, or a plurality of electric circuit components may be present on one surface of the holder.

The object of the present invention is a component having a connection part as an electric circuit component. Although the number of connection parts does not matter, the effect of the present invention becomes more pronounced as the number of connection parts increases.

Further, in the present invention, each connection portion of at least two electric circuit components is present at an end of the electric circuit component. At least two electrical circuit components having connecting portions at their ends may be connected on one surface and the other surface of the electrical connection member, or may be connected on the same surface.

Note that the connecting portion is an electrically conductive material.

(Electrical Connection Member) The electrical connection member according to the present invention includes a plurality of electrically conductive members embedded in a holder made of an electrically insulating material. The buried conductive members are electrically insulated from each other.

One end of the electrically conductive member is exposed on one side of the holder, and the other end is exposed on the other side of the holder.

Furthermore, the electrical connection member may be composed of one layer or multiple layers of two or more layers.

(Electrically conductive member) The electrically conductive member may be any material as long as it exhibits electrical conductivity, and is generally a metal material, but may also be a material that exhibits superconductivity in addition to metal materials.

Gold is preferred as the material for the metal member, but any metal or alloy other than the metal fittings may also be used. For example, Ag, Be, Ca, Mg.

Mo, Ni, W, Fe, Ti, In, Ta.

Examples include metals or alloys such as Zn, Cu, All, Sn, and Pb-3n.

In addition, the metal member and the alloy member may include the same type of metal or different types of metal in the same electrical connection member. Furthermore, one plate of the metal member and the alloy member of the electrical connection member may be made of the same kind of metal or alloy, or may be made of different kinds of metal or alloy.

Furthermore, materials other than metals and alloys may be used, as long as they exhibit conductivity, and may include a metal material containing one or both of an organic material and an inorganic material. Further, a combination of an inorganic material and an organic material may be used as long as it exhibits conductivity.

Furthermore, the cross section of the electrically conductive member can be circular, square, or other shapes.

Further, the thickness of the electrically conductive member is not particularly limited. Considering the pitch of the connection parts of electric circuit components, for example, 20 μm
It may be greater than or equal to φ or less than 20 μmφ.

Note that the exposed portion of the electrically conductive member may be on the same surface as the holder, or may protrude from the surface of the holder. This protrusion may be on one side only or on both sides. If it is made to protrude further, it may be made into a bump shape.

Further, the intervals between the electrically conductive members may be the same as the intervals between the connecting parts of the electric circuit components, or may be narrower than the intervals between the connecting parts of the electric circuit components. When narrowly spaced, it becomes possible to connect the electrical circuit component and the electrical connection member without requiring positioning of the electrical circuit component and the electrical connection member.

Further, the electrically conductive member does not need to be arranged vertically in the holder, but may be obliquely arranged from one surface of the holder to the other surface of the holder.

(Holding body) The holder is made of electrically insulating material.

Any electrically insulating material may be used.

Examples of electrically insulating materials include organic materials and inorganic materials. Alternatively, it may be a metal or alloy material that has been treated so that the electrically conductive members are electrically insulated from each other. moreover,
One or more types of inorganic materials, metal materials, and alloy materials having a desired shape such as powder, fibers, plate-like bodies, rod-like bodies, and spherical bodies may be dispersed in the organic material. Furthermore, one or more of organic materials, metal materials, and alloy materials having a desired shape such as powder, fibers, plate-like bodies, rod-like bodies, and spherical bodies may be dispersed in the inorganic material. good.

Further, one or more kinds of inorganic materials and organic materials having a desired shape such as powder, fibers, plate-like bodies, rod-like bodies, and spherical bodies may be dispersed and held in the metal material. In addition, when the holding body is made of a metal material, for example, an electrically insulating material such as resin may be provided between the electrically conductive member and the holding body.

Here, as the organic material, for example, an insulating resin may be used, and the resin may be a thermosetting resin, an ultraviolet curing resin, or a thermoplastic resin. For example, polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin, polystyrene resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzylimidazole resin, polyamideimide resin, polypropylene resin, polyvinyl chloride resin , polystyrene resin, methyl methacrylate resin, polyphenylene oxide resin, phenol resin, melanin resin, epoxy resin, urea resin, methacrylic resin, vinylidene chloride resin, alkyd resin, silicone resin and other resins can be used.

Among these resins, it is more preferable to use a resin with good thermal conductivity because even if the semiconductor element has heat, the heat can be radiated through the resin.
If you select a resin that has the same or similar coefficient of thermal expansion as the circuit board, and if there is at least one hole or multiple bubbles in the organic material, it will be possible to , it becomes possible to further prevent a decline in the reliability of the device.

In addition, specific examples of metal materials and alloy materials include, for example,
Ag, Cu, Au, AJij, Be, Ca.

Mg, Mo, Fe, Ni, St, Co, Mn.

W, Cr, Nb, Zr, Ti, Ta, Zn.

Examples include metals or alloys such as Sn and Pb-5n.

Examples of inorganic materials include 5in2°B203, A
j2203, Na2O, 20°Cab, ZnO,
Bad, PbO, Sb20s.

As, 03. La, O,, ZrO2, Bad.

P20S, TiO2, MgO, SiC, Be
d.

BP, BN, Aj2N, B4 C, Ta
C, Ti B2゜CrBz, TtN, 5t3N4
, ceramics such as Ta206, diamonds, glass,
Examples include carbon, boron, and other inorganic materials.

(Connection) The following three configurations can be considered for the connection between the end of the electrical connection member and the connection of the electrical circuit component.

(2) A configuration in which all electrical circuit components are connected by metallizing and/or alloying their connecting portions and one ends of a plurality of electrically conductive members exposed on one surface of the holder.

■ At least one electric circuit component is connected by metallizing and/or alloying its connecting portion and one end of a plurality of electrically conductive members exposed on one surface of the holder, Others are connected by methods other than metallization and/or alloying.

■ All electrical circuit components are connected at their connecting portions and one end of the plurality of electrically conductive members exposed on one side of the holder by a method other than metallization and/or alloying. configuration.

(Connection by metallization and/or alloying) Next, connection by metallization and/or alloying will be described.

If the electrically conductive member to be connected and the connecting portion are made of the same type of pure metal, the layer formed by metallization will have the same type of crystal structure as the electrically conductive member or the connecting portion.

Note that metallization can be carried out by, for example, bringing an end of the electrically conductive member into contact with a connecting portion corresponding to the end, and then heating the end to an appropriate temperature. In this case, heating causes diffusion of atoms in the vicinity of the contact portion, and the diffusion portion becomes metalized to form a metal layer.

When the electrically conductive member to be connected and the connecting portion are made of different types of pure metals, the connecting layer to be formed is made of an alloy of both metals. In addition, as a method for alloying, for example, after bringing the end of the electrically conductive member into contact with the connecting part corresponding to the end, heating may be performed to an appropriate temperature. Atom diffusion occurs, and an alloy layer made of a solid solution or an intermetallic compound is formed near the contact portion.

In addition, when Au is used for the metal member of the electrical connection member and Al is used for the connection part of the electric circuit component, 200
A heating temperature of ~350°C is preferred.

When one of the electrically conductive member and the connecting portion to be connected is made of pure metal and the other is made of an alloy, or when both are made of the same or different alloys, the connection interface is made of an alloy layer.

Regarding multiple electrically conductive members in one electrical connection member, if each electrically conductive member is made of the same kind of metal or alloy, if each is made of different kinds of metal or alloy, or in other cases. In addition, a single electrically conductive member may be made of the same kind of metal or alloy, or made of different kinds of metal or alloy, or in other cases, but in any case, the above-mentioned requirements apply. Metallization or alloying takes place. On the other hand, the same applies to the connecting part.

Note that the electrically conductive member or the connecting part may be made of metal or an alloy at the contact part between the two, and the other parts may be, for example, metal mixed with an inorganic material such as glass, or metal mixed with an organic material such as resin. The material may be in a mixed state.

Furthermore, a plating layer made of a metal or alloy that is easily alloyed may be provided on the surface of the portion to be connected.

In addition, as a heating method, in addition to methods such as thermocompression bonding, internal heating methods such as ultrasonic heating method, high frequency dielectric heating method, high frequency dielectric heating method, microwave heating method, and other external heating methods are used. Alternatively, the above heating methods may be used in combination. In either heating method, the connecting portion is directly or indirectly heated to effect connection.

(Connection by means other than metallization and/or alloying) In order to perform the above-mentioned connection other than metallization or alloying, for example, the electric circuit component and the electrically conductive member of the electrical connection member may be connected by pressing. .

Other connection methods include a connection method using a connection adhesive. That is, there is a method of connecting an electric circuit component and an electrically conductive member by adhering them at least in part except for the connecting portion.

(Removable Connection) Among the various connection means described above, for electrical circuit components that require replacement, a means that allows for detachable connection (for example, connection by compression) may be selected.

Even when connections are made by metallization and/or alloying, the melting point of the metal layer or alloy layer for the electrical circuit component that is to be attached or detached is lower than the melting point of the metal layer or alloy layer for the electrical circuit component that is not to be attached or detached. Just do it like this. That is, with this configuration, heating can be performed to a temperature higher than the melting point of the metal layer or alloy layer for the electrical circuit component to be attached or detached, and lower than the melting point of the metal layer or alloy layer for the electrical circuit component that is not to be attached or detached. For example, only the electrical circuit components that are desired to be attached or detached can be removed without causing any adverse effects such as damage to the electrical circuit components/D connections that are not to be attached or detached.

In the present invention, the term "removable connection" includes such a connection.

(Applications) Examples of the electric circuit device of the present invention include thermal printing heads such as thermal heads and bubble heads, functional heads such as liquid crystal panels, and devices for driving functional heads (for example, where driver semiconductor elements are located in close proximity). (driver device), a long device that drives a large number of functional elements, a long device that amplifies a large number of sensors, etc.

(Sealing Material) In the present invention, if there is an electric circuit component that is not desired to be attached or removed, the electric circuit component may be embedded and sealed with a sealant.

Sealing may be performed on only one electrical circuit component or on multiple electrical circuit components.

(Material of Encapsulant) In the present invention, thermoplastic resin can be used as the material of the encapsulant. Examples of thermoplastic resins include polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin, polystyrene resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzylimidazole resin, polyamideimide resin, and polypropylene. resin,
Polyvinyl chloride resin, polystyrene resin, methyl methacrylate resin and other resins can be used.

The sealing material 2 may be the above-mentioned resin, or may be a metal, alloy, or inorganic material of any shape such as powder, fiber, plate-like body, rod-like body, or spherical body in addition to the above-mentioned thermoplastic resin. Alternatively, a mixture of multiple types may be used. The method of dispersion is as follows: powder, ta
What is necessary is to add fibers, plate-shaped bodies, rod-shaped bodies, spherical bodies, etc., and stir the resin. Of course, instead of using this method, powders, fibers, plate-shaped bodies, rod-shaped bodies, spherical bodies, etc. may be dispersed in the resin by any other arbitrary method.

The metal layer (for example, Ag).

Cu, Au, A11. Be, Ca,
Mg, Mo.

Examples include metals or alloys such as Fe, Ni, Si, Co, Mn, and W.

Examples of inorganic materials include 5in2°B203, A
j220s, Na20. 20°Cab, ZnO, B
ad, pbo, 5tj2o3.

As2 o3. La2 o3, ZrO2, Bad.

P,O,,TtO,,Mho,StC,Bed.

B P, BN, AIIN, B4 C, TaC, T
i B2゜CrB2, TiN, Sia N4, T
Examples include ceramics such as A205, diamond, glass, carbon, boron, and other inorganic materials.

The size and shape of the powder, mia, plate-shaped body, rod-shaped body, spherical body, etc. to be dispersed, as well as the dispersed position and quantity in the insulator are arbitrary. Furthermore, the powder, fiber, plate-shaped body, rod-shaped body, spherical body, etc. may or may not be exposed to the outside of the insulator. Furthermore, the powders, fibers, fibers, plate-shaped bodies, rod-shaped bodies, spherical bodies, etc. may or may not be in contact with each other.

(Sealing method) The method for sealing with the sealing material is to place an electrical circuit member (a member consisting of an electrical connection member and the electrical circuit components connected to it) into the cavity of the mold, and then use injection molding. The cavity may be sealed by inserting a sealing material into the cavity. In addition, such injection
The electric circuit member may be sealed by any method such as molding, extrusion molding, medium molding, blow molding, or any other method.

Furthermore, the above sealing material and the plate (the plate is made of a material different from the sealing material'!t)
may be used together. In such a form of sealing, when a plate is bonded to at least a part of the surface of the sealing material, the sealing material prevents the electrical circuit component from connecting with other electrical circuit components connected to the electrical connection member. If at least one plate is embedded in at least a part of the plate that is joined on the opposite side to the electrical connection member, and if the sealant is used to connect the electrical circuit component and the electrical connection member, At least a portion of the plate disposed near one or more side surfaces of the connected electrical circuit components may be embedded.

(Plate) The material of the plate may be any material as long as it is different from the material of the sealing material.

For example, in the case of a stainless steel plate, the plate thickness is 0.05~
0.5 mm is preferred.

When joining, the joining method is not particularly limited. For example, it may be attached using an adhesive or the like, or other methods may be used.

(Cap) In the present invention, the electric circuit component may be sealed with a cap.

Here, the term "cap sealing" refers to wrapping an electric circuit component and sealing the electric circuit component so that a hollow portion exists inside.

The cap may be provided on only one electrical circuit component, or may be provided on multiple electrical circuit components.

In addition, when sealing with a cap, it is preferable to seal so that the electric circuit component is held close to the electrical connection member. For example, the inner surface of the cap may be shaped to correspond to the outer surface shape of the electric circuit component, and the cap may be sealed such that the inner surface of the cap comes into contact with the outer surface of the electric circuit component.

Note that the cap can be attached to electrical circuit components or other caps (electric circuit components on one side of the holder and the other side of the holder) by an adhesive method, a mechanical method, a welding method, or any other method. If both electrical circuit components are capped), it is sufficient to join them.

(Material of Cap Sealing) The material of the cap may be an organic material, an inorganic material, a metal material, or a composite material thereof.

As for the sealing form, one or more electric circuit components may be sealed with the same cap. Further, the cap may be sealed so as to press against the electric circuit component, or may be sealed so as to hold the electric circuit component.

Furthermore, a member may be interposed between the electric circuit component and the cap for sealing. In this case, the effect will be more pronounced if a plurality of electrical circuit components are sealed with the same cap.

Any method may be used to join the cap to the electric circuit components and the like.

(Adjustment member) In the present invention, an adjustment member may be interposed between the cap and the electronic circuit component.

The material for the adjustment member may be any metal, inorganic, or organic material, but is preferably an elastic material. .

Further, the shape may be any shape as long as the dimension in the height direction of the electric circuit component can be adjusted.

[Function] (Claims 1 to 6) In the present invention, since the electrical connection member described above is used to connect an electrical circuit component to another electrical circuit component, the connecting portion of the electrical circuit component can be It is possible to have it present in high density at the end, increasing the number of connections at the end,
As a result, higher density becomes possible.

Further, it is possible to make the electrical connection member thinner, and from this point of view as well, it is possible to make the electrical circuit member thinner.

Furthermore, since the amount of metal members used for the electrical connection member is small, costs can be reduced even if expensive gold is used as the metal member.

(Claim 2, Claim 3) In the present invention, when the electric circuit components are connected by metallization and/or alloying via the electric connection member,
Since the electrical circuit components are connected firmly (strong in terms of strength) and reliably, the connection resistance value is small and the variation thereof is small, and it is possible to obtain an electrical circuit device that is mechanically strong and has an extremely low defect rate. .

In addition, if the electrical circuit components are connected by metallization and/or alloying via electrical connection members, the electrical circuit components may be There is no need to maintain the electrical circuit device, and the creation and post-production management of the electric circuit device is easy.

(Claim 3) When all of the electrical circuit components are connected by metallization and/or alloying through electrical connection members, the contact resistance between the electrical circuit components connects only one electrical circuit component. It will be smaller than if you did.

(Claim 4) On the other hand, if all electrical circuit components are connected by connections other than metallization and/or alloying, it is possible to prevent electrical circuit components from deteriorating due to heat that occurs during metallization and/or alloying. can.

(Claim 5) By connecting the electrical circuit components detachably, even if various defects occur in the electrical circuit components, they can be easily replaced with other electrical circuit components, thereby reducing costs such as manufacturing costs. I can do it.

(Claim 6) If an electrical circuit component that is likely to cause defects is known in advance, the melting point of the metal layer or alloy layer formed by metallization and/or alloying of the electrical circuit component may be determined by other means. If the melting point of the electrical circuit components is lower than that of the electrical circuit components, the electrical circuit components will be strong (
Since the connection is strong) and reliable, the connection resistance value is small and its variation is small, and a mechanically strong electrical circuit device can be obtained, and once a defect occurs, it will not occur. Only the electrical circuit components that have been replaced can be replaced, and costs such as manufacturing costs can also be reduced.

In addition, in the present invention, when sealing is performed using a sealing material,
Since the electrical connection member is configured with an electrically conductive member embedded in the holder, it is less affected by the sealing pressure, sealing speed, etc. when the sealing material is injected. Any sealing method can be used. In other words, it has become possible to seal with materials that require extremely high-pressure injection, such as thermoplastic resins, which were previously impossible.

In addition, in the present invention, when a plate is bonded to at least a part of the surface of the sealing material, at least the electrical circuit component electrically connected to the electrical circuit component and the χ5,2 member by the sealing material. When at least part of one plate is embedded in at least a part of the plate that is joined on the opposite side to the electrical connection member, or the electrical circuit component and the electrical connection member are connected by a sealing material. If at least a part of the plate placed near one or more sides of the electrical circuit components is embedded, internal stress may occur in the device or external force may be applied to the device. However, stress concentration can be alleviated, and cracks, etc. that may occur due to stress concentration can be prevented. This plate also has the effect of lengthening the path from the outside world to the electrical circuit components, making it difficult for water or the like to enter the electrical circuit components from the outside. Therefore, the reliability of the device can be improved.

In addition, if the material of the plate is metal such as stainless steel, ceramic with good thermal conductivity, carbon, diamond, etc., the heat generated from the electric circuit components can be quickly radiated to the outside world, so the heat radiation characteristics An excellent electric circuit device can be obtained. Furthermore, if the material of the plate is metal, it can block out noise from the outside world and is less susceptible to the influence of noise U.
Furthermore, it is possible to block electromagnetic noise generated from electric circuit components, and to obtain an electric circuit device with good characteristics and less noise generation.

Further, when sealing with a cap in the present invention, since the electric circuit device is hollow, there is little thermal stress generated even when heat is applied, and a highly reliable electric circuit device can be obtained. In addition, if the cap and electrical circuit components are in contact and the cap is made of a material with good thermal conductivity, the heat generated from the electrical circuit components will be quickly conducted to the outside through the cap, resulting in better heat dissipation characteristics. You can get electrical circuit equipment. Furthermore, if the cap is made of a material with good noise shielding properties, particularly metal such as iron, an electric circuit device with even better shielding effect can be obtained. Further, when an adjustment member is interposed between the cap and the electric circuit component, it is possible to assemble the electric circuit component efficiently even when the height of the electric circuit component varies.

In addition, in the present invention, when a material with good thermal conductivity is used for the insulator of the electrically conductive member, powder, fiber, plate-shaped body, rod-shaped body, spherical body, etc. with good thermal conductivity is used as the sealing material. When the heat is dispersed, the heat generated from the electric circuit components escapes to the outside world more quickly, and an electric circuit device with good heat dissipation properties can be obtained. In addition, when the insulator of the electrically conductive member is made of a material with a thermal expansion coefficient close to that of the electric circuit component, the sealing material may be a powder, fiber, plate-shaped body, rod-shaped body, etc. whose thermal expansion coefficient is close to that of the electric circuit component. If one or both of the spherical bodies etc. are dispersed, the coefficient of thermal expansion approaches that of the electrical circuit components, which may cause cracks in the encapsulant or electrical circuit components, which may occur when heat is applied. A phenomenon that impairs the reliability of an electric circuit device, such as a change in characteristics of electric circuit components, can be prevented, and a highly reliable electric circuit device can be obtained.

Furthermore, by selecting a material with a high shielding effect as an insulator, it is possible to reduce electromagnetic noise that exits from the electric circuit components to the outside world, and it is also possible to reduce noise that enters the electric circuit components from the outside world.

[Example 1 (Example 1) Example 1 of the present invention will be described based on FIGS. 1 and 2.

This embodiment has a holder 111 made of an organic material and a plurality of metal members 107 that are electrically conductive members embedded in the holder 11. One end of the metal member 107 is located at one end of the holder 111. and an electrical connection member 125 whose other end of the metal member 107 is exposed on the other surface of the holder 111 ; 1
One circuit board is connected to one end of a metal member 107 exposed on one side of the circuit board 104, and the connection part 105 is connected to one end of the metal member 107 that is exposed on one side of the circuit board 104.
and; has a connecting portion 194, and at the connecting portion 194, the holding body 1
One circuit board connected to the other end of the metal member 107 exposed on the other surface of the circuit board 184, the connecting portion 194 of which is connected to the other end of the metal member 107 that is exposed on the other surface of the circuit board 184.
An electric circuit device having at least the following: and;

Note that in this example, a plurality of semiconductor elements 1 are mounted on the circuit board 104.
01 is connected.

Further, the electric circuit device of this example is a thermal printing device, and the circuit board 184 has a heating element 400.

This example will be explained in more detail below.

First, the electrical connection member 125 will be explained while explaining one manufacturing example of the electrical connection member 125.

FIG. 2 shows one manufacturing example.

First, as shown in FIG. 2(a), metal wires 121 made of a metal such as gold or an alloy with a diameter of 20 μm are arranged at a pitch of 4.
The metal wire 121 is wound around a rod 122 with a thickness of 0 μm, and after wrapping, the metal wire 121 is embedded in a resin 123 such as polyimide.

After embedding, the resin 123 is cured. The cured resin 123 becomes an insulator. Thereafter, it is sliced at the dotted line 124 to create an electrical connection member 125. The electrical connection member 125 created in this way is shown in FIG.
Shown in b) and (c).

In the electrical connection member 125 created in this way,
The metal wire 121 constitutes the metal member 107, and the resin 123 constitutes the holder (insulator) 111.

In this electrical connection member 125, metal wires 121 serving as metal members are electrically insulated from each other by resin 123. Further, one end of the metal wire 121 is exposed on the circuit board 1o4 side, and the other end is exposed on the circuit board 184 side. These exposed portions become connection portions 105 and 194 to the circuit board 104 and circuit board 184, respectively.

Next, as shown in FIGS. 1(a) and (c), the circuit board 1
04. Prepare the electrical connection member 125 and the circuit board 184. The circuit board 104 and circuit board 184 used in this example have a large number of connection parts 105 and 194 at their ends.

Note that the connection portion 105 of the circuit board 104 is connected to the circuit board 18.
4 connection part 194 and electrical connection member! 25 connection part 1
Metal is exposed at positions corresponding to 08 and 109.

Connection portion 105 of circuit board 104 and electrical connection member 125
The connecting portion 108 of the circuit board 184 or the connecting portion 1 of the circuit board 184
94 and the connection portion 109 of the electrical connection member 125 are aligned, and after positioning, the circuit board 10
The Au of the connection part 105 of No. 4 and the Au of the connection part 108 of the electrical connection member 125 are further connected to the connection part 19 of the circuit board 184.
4 and Au of the connection part 109 of the electrical connection member 125
(Fig. 1(b)).

(d)).

In this example, the suppression connection was performed by pressing, but the connection may be made by metallizing and/or alloying both or one side of the electrical connection member. Of course, they may be connected using adhesive.

Note that there are the following three methods for connecting the circuit board 104, the electrical connection member 125, and the circuit board 184 by metallization and/or alloying, and any of these methods may be used.

■Circuit board 104, electrical connection member 125, circuit board 1
After positioning 84, connect portion 105 of circuit board 104
and the connecting portion 108 of the electrical connecting member 125, and the connecting portion 194 of the circuit board 184 and the connecting portion 109 of the electrical connecting member 125 are simultaneously metallized and/or alloyed.

■ Position the circuit board 104 and the electrical connection member 125, and position the connection part 105 of the circuit board 104 and the electrical connection member 1.
After metallizing and/or alloying and connecting the IIk connection part 108 of 25, the circuit board 184 is positioned, and the connection part 109 of the electrical connection member 125 and the connection part 1 of the circuit board 184 are connected.
A method of connecting by metallizing and/or alloying 94.

■ Position the circuit board 184 and the electrical connection member 125, and connect the connection part 194 of the circuit board 184 and the electrical connection member 1.
After metallizing and/or alloying and connecting the connecting portion 109 of the electrical connection member 125 and the connecting portion 109 of the circuit board 104, the circuit board 104 is positioned, and the connecting portion 108 of the electrical connecting member 125 and the connecting portion 10 of the circuit board 104 are connected.
A method of connecting by metallizing and/or alloying 5.

In this case, if the melting points of the alloy layer in the connection part 108 and the alloy layer in the connection part 109 are made different, the one having a lower melting point can be attached and detached as necessary. For example, the connection portion 108 has a Sn:Pb weight ratio of 61.9%:38.
．． Using solder with a eutectic composition of 1%, the connection portion 109 is made of Sn.
: It is sufficient to use a solder in which the weight ratio of Pb is 5%=95%.

When the connectivity of the connection portions of the electrical circuit device produced as described above was examined, it was found that the connections were highly reliable.

Furthermore, the reliability of various characteristics was also excellent.

(Example 2) Example 2 is shown in FIG.

In this example, the electric circuit device is a bubble shed print head, and the circuit board 184 has an ink chamber 401. Also, the connection part 105.19 of the circuit board 104.184
The pitch of No. 4 is 63.5 μm.

Further, the configuration of the electrical connection member 125 is different from that in the first embodiment as described below.

That is, in the electrical connection member 125 of this example, the pitch between the metal members is narrower than that shown in the first embodiment. That is, in this example, the circuit board 104,1
The pitch between the metal members 107 is set to be narrower than the interval between the connecting portions 105 and 194 of 84.

In other words, a working example! Now, the circuit board 104 and the circuit board 18
Since the connection position of the electrical connection member 125 was arranged at the connection position with the circuit board 104 and the circuit board 184, it was necessary to position the electrical connection member 125.
Although positioning with the electrical connection member 125 is necessary, positioning with the electrical connection member 125 is not necessary. Therefore, by selecting appropriate values for the connection dimension (dt1.plt) between the circuit board 104 and the circuit board 184 and the connection dimension (dt2.PI3) of the electrical connection member, it is also possible to connect without positioning.

When the connectivity of the connection portions of the electrical circuit device produced as described above was examined, it was found that the connections were highly reliable.

Furthermore, the reliability of various characteristics was also excellent.

(Example 3) In this example, those shown in FIGS. 4 and 5 were used as electrical connection members.

That is, in the electrical connection member 125 shown in FIG. 4, the exposed portion of the metal member 107 protrudes from the surface of the holder (resin insulator) 111. Such electrical connection member 125 may be created, for example, by the following method.

First, by the method described in Example 1, Fig. 2(b), (
Prepare the electrical connection member shown in C) Next, the metal wire 121 is connected to the polyimide resin 1 on both sides of the electrical connection member.
Etching may be performed until it protrudes from 23 by about 10 μm.

Note that in this embodiment, the amount of protrusion of the metal wire 121 was set to 10 μm, but any amount may be used.

Furthermore, the method for making the metal wire 121 protrude is not limited to etching, and other chemical or mechanical methods may be used.

Other points are the same as in Example 1.

Note that the protrusion is an electrical connection member! 25 to metal wire 121
A bump 150 as shown in FIG. 5 may be formed by inserting the metal wire 121 into a mold having a recess at the position and crushing the protrusion 126 of the metal wire 121. In this case, the metal wire 121 becomes difficult to fall off from the insulator 111.

Note that in this example as well, the metal wire 121 constitutes the metal member 107, and furthermore, the resin 123 constitutes the insulator 111.

Note that the bumps may be created by melting the protrusions with heat, or any other method may be used.

Connections in this example were made as described below. That is, an adhesive is applied to at least a portion of either one of the circuit boards 104 and 184, and the adhesive is pasted to the electrical connection member and the circuit board, and excess adhesive present in the connection portion and the holder 111 is removed by applying force. Protruding electrical connection member 125
Connection part 1 between metal member 107 and circuit board 104, 184
05.194 was connected and the adhesive was cured.

(Example 4) Example 4 is shown in FIG.

In this example, the circuit boards 104 and 184 are connected using two electrical connection members 125.

The circuit boards 104 and 184 used in this example have a large number of wiring patterns (connections) 105 and 194 at their ends. In this example, the electrical connection member 125 is bridged to the circuit board 104.184.
5, the circuit boards 104 and 184 are connected to each other on the upper and lower surfaces of the drawing, and another circuit board 187 is connected to the upper surface of the electrical connection member in the drawing to connect the circuit board 104 and the circuit board 1.
Electrical connection was made with 84.

The other points are the same as in the second embodiment.

(Example 5) Example 5 is shown in FIG.

In this example, in Example 4, the electrical connection member 125 is one piece, and the circuit board 187 is replaced with a plurality of semiconductor elements 201, 202, 203° 204. That is, in this example, the semiconductor devices 201, 202, 203, 20
4 has an electrical connection function as well as a semiconductor element function.

In this example, if the input electrical signal is taken from the circuit board 104, the number of wiring patterns on the circuit board 104 can be reduced. Therefore, there is an advantage that the circuit board can be made inexpensive and that connections can be made without accurate positioning.

(Example 6) Example 6 is shown in FIG.

In this example, semiconductor elements 201, 202, 203 are connected to the circuit board 104 through electrical connection members 125, and semiconductor elements 204, 205 are connected to the circuit board 184 through electrical connection members 125, 128. There is.

circuit board 104, semiconductor elements 201, 202° 203,
The circuit board 184 and the semiconductor element 204 are connected to each other by metallization or alloying using solder. The melting points of the metallized layer and the alloyed layer are made to be different.

Such an electrical connection member 125 is shown in FIGS. 2(b) and 2(c).
) Attach solder to both sides of the electrical connection member shown in () using plating. One side of the electrical connection member is coated with eutectic solder (Sn:P
b=61.9wt%:38.1wt%), and the other side is plated with solder at Sn:Pb=5%wt%:95wt%. In this example, the latter is the circuit board 10.
I put it on the 4th side. To remove the semiconductor element, it is sufficient to heat it to a temperature between the melting points of both.

Note that the semiconductor element 205 is connected by compression, and can be attached and detached without heating.

Furthermore, the semiconductor element 204 to which the circuit board 184 is attached is sealed with a sealing material 170.

When the connectivity of the connection portions of the electrical circuit device produced as described above was examined, it was found that the connections were highly reliable.

Furthermore, the reliability of various characteristics was also excellent.

(Example 7) FIG. 9 shows an electrical connection member used in Example 7.

FIG. 9(a) is a perspective view of the electrical connection member, FIG. 9(b)
FIG. 2 is a sectional view of the electrical connection member.

An example of making such an electrical connection member will be described below.

First, by the manufacturing method shown in Example 1, S was added to the resin 123.
An electrical connection member containing powder made of i02 is produced, and such electrical connection member 128, 129, 130
Prepare 3 sheets.

The position of the metal wire 121 in the first sheet 128 is m row and n column.
It is displaced from the center by a and nb.

The position of the metal wire 121 in the second sheet 129 is ma at row m and column n.
It is displaced from the center by c and nbc.

The position of the metal wire 121 in the third sheet 130 is mad in m rows and n columns.
, nbd from the center. a.

The values of b, c, and d are such that the upper and lower metals 121 are electrically conductive, but the left and right sides are not electrically conductive with each other. Three electrical connection members are positioned and laminated using an ultrasonic thermocompression heating method to create an electrical connection member 125.

In addition, in this example, the positions of the metals of the electrical connection members were selected according to rules such as m rows and n columns, but the metals on the top and bottom were conductive, and the left and right sides were not electrically conductive with each other. It can be random if you do.

In addition, although this example describes the case where three layers are laminated, two
Any number of sheets may be used as long as it is more than one sheet. Furthermore, although it has been described that the layers are laminated using a thermocompression heating method combined with ultrasonic waves, methods such as compression bonding and adhesion may also be used. Furthermore, the electrical connection member of this example may be processed to provide a protrusion as shown in FIG.
Bumps 150 may be provided as shown.

Other points are the same as in Example 1. 5 In this example as well, the connections were connected with high reliability.

Furthermore, the reliability of various characteristics was also excellent.

(Example 8) FIG. 10 shows an electrical connection member used in Example 8.

FIG. 10(a) is a cross-sectional view of the electrical connection member in the middle of manufacturing;
FIG. 10(b) is a perspective view of the electrical connection member;
Figure (e) is the above sectional view.

In advance, 20
1. A hole 142 with a diameter larger than Lmφ is made. A metal wire 121 of 20 μmφ made of a metal such as Au or an alloy is passed through the hole 142, and a resin 123 is inserted between the holder 126 and the metal wire 121. 123 is cured.

The hardened resin 123 becomes an inclusion. After that, metal wire 1
21 is sliced at the dotted line 124 to create an electrical connection member 125. The electrical connection member 125 created in this way is shown in FIGS. 10(b) and 10(c).

Further, the electrical connection member of this example may be processed to provide a protrusion as shown in FIG. 4, or a bump 150 as shown in FIG. 5.

The other points are the same as in Example 1. In this example as well, the connections were connected with high reliability.

Furthermore, the reliability of various characteristics was also excellent.

(The following is a blank space) [Effects of the Invention] Since the present invention is configured as described above, the following numerous effects can be obtained.

1. (Claims 1 to 6) Highly reliable connections can be obtained with respect to connections between semiconductor elements and electrical circuit components such as circuit boards and lead frames. Therefore, the conventionally used wire bonding method, TAB
method, it becomes possible to replace it with the CCB method.

2゜ (Claims 1 to 6) According to the present invention, the connection parts of electric circuit components can be arranged at high density at the ends, so that more multi-point connections are possible than with the wire bonding method or the TAB method. , this method is suitable for connection with a large number of bins. Furthermore, since an insulating material exists between adjacent metals of the electrical connection member, electrical conduction between adjacent metals does not occur even if the adjacent pitch is narrowed, making it possible to connect more points than the CCB method. .

3. (Claims 1 to 6) Since the amount of metal members used in the electrical connection member is small compared to conventional ones, even if expensive metals such as gold are used for the metal members, it will be cheaper than conventional ones. becomes.

4. (Claims 1 to 6) A high-density electrical circuit device is obtained.

5. (Claim 2, Claim 3) In the present invention, the electric circuit components are connected to each other by metallization and/or alloying through the electrical connection member, so that the electric circuit components are strong (in terms of strength). Since the connection is strong) and reliable, it is possible to obtain an electrical circuit device that has a low connection resistance value and small variation, is mechanically strong, and has an extremely low defective rate.

In addition, if the electrical circuit components are connected by metallization and/or alloying via electrical connection members, the electrical circuit components may be There is no need to maintain the electrical circuit device, and the creation and post-production management of the electric circuit device is easy.

6. (Claim 3) All of the electrical circuit components are connected by metallization and/or alloying through electrical connection members, so that the electrical circuit components are strong (strong in terms of strength) and reliably connected to each other. An electrical circuit device that is connected, mechanically strong, and has an extremely low defective rate can be obtained.

In addition, all of the electrical circuit components are connected by metallization and/or alloying via electrical connection members, so
The contact resistance between the electric circuit components becomes smaller than when only one electric circuit component is connected.

9. (Claim 4) All of the electric circuit components are connected by connections other than metallization and/or alloying, so metallization and/or alloying is not required.
Alternatively, it is possible to prevent deterioration of electric circuit components due to heat that occurs during alloying.

1O1 (Claim 5) Since the electrical circuit components are detachably connected, even if various defects occur in the electrical circuit components, they can be easily replaced with other electrical circuit components, reducing manufacturing costs and other costs. be able to.

11. (Claim 6) Since the melting point of the gold pA layer or alloy layer formed by metallization and/or alloying for the electrical circuit component to be attached and detached is lower than the melting point of other electrical circuit components, When using a circuit device, electrical circuit components are connected firmly (strong in terms of strength) and reliably, with low connection resistance.
It is possible to obtain a mechanically strong electrical circuit device with small variations, and in the event that a defect occurs, at least the temperature of the connection layer of the defective electric circuit component is kept at or above the melting point of the connection layer. By raising the temperature to a temperature lower than the melting point of the connecting layer of the electrical circuit component that is not detachable, it is possible to replace only the defective electrical circuit component, thereby reducing costs such as manufacturing costs.

Note that the following effects can be obtained with the embodiments of the invention described in the claims.

1. When sealing with resin, the sealing material can be injected at high pressure, so not only thermosetting resin for constant pressure transfer but also thermoplastic resin that needs to be injected at high pressure can be used for sealing.

2. When one or both of powders or fibers of metals, alloys, and ceramics are dispersed in the encapsulant, the coefficient of thermal expansion of the encapsulant approaches that of the electric circuit component. Therefore, even when heat is applied, there is little occurrence of thermal stress, and a highly reliable electric circuit device and, by extension, a semiconductor device can be obtained.

In addition, if one or more materials with good thermal conductivity are selected from metals and alloy ceramics as the material to be dispersed in the encapsulant, the heat generated from electrical circuit components will be dissipated quickly, and electrical circuits with good heat dissipation properties will be produced. A circuit device and eventually a semiconductor device can be obtained.

3. When cap-sealing according to the present invention, since the electric circuit device is hollow, thermal stress is less generated even when heat is applied, and a highly reliable electric circuit device can be obtained. Also,
When the cap and electrical circuit components are in contact and the cap is made of a material with good thermal conductivity, the heat generated from the electrical circuit components is quickly conducted to the outside through the cap, resulting in an electrical circuit with better heat dissipation characteristics. You can get the equipment. Furthermore, if the cap is made of a material with good noise shielding properties, particularly metal such as iron, an electric circuit device with even better shielding effect can be obtained.

4. When an adjustment member is interposed between the cap and the electric circuit component, it is possible to efficiently assemble the electric circuit component even if the height of the electric circuit component varies.

5. When a plate is bonded to at least a part of the surface of the encapsulant, when the plate is bonded to an electric circuit component and at least a portion of at least one of the plates is embedded in the encapsulant; ,
If at least a portion of the board placed near the electrical circuit components is embedded, stress concentration can be alleviated even if internal stress occurs in the device or force is applied from the outside. It is possible to prevent cracks, etc. that may occur from. This plate also has the effect of lengthening the path from the outside world to the electrical circuit components, making it difficult for water or the like to enter the electrical circuit components from the outside. Therefore, the reliability of the device can be improved.

6. If the material of the plate is metal such as stainless steel, ceramic with good thermal conductivity, carbon, diamond, etc.
Since the heat generated from the electric circuit components can be quickly radiated to the outside world, an electric circuit device with excellent heat radiation characteristics can be obtained. Furthermore, if the material of the board is metal, it can block out noise from the outside world and is less susceptible to noise influence.
Furthermore, it is possible to block out magnetic noise generated from electric circuit components, thereby obtaining an electric circuit device with good characteristics and less noise generation.

7. When the insulating material of the holder of the electrical connection member contains one or more types of metal material powder or textile fibers, an electrical circuit device with a high shielding effect can be obtained.

8. The holder of the electrical connection member is a holder made of an insulator dispersed with one or both of powders and fibers made of one or more of metal materials and inorganic materials with good thermal conductivity. Alternatively, in the case of using a holder made of a metal material insulated in an insulating material so that electrically conductive members are insulated, the heat generated from the electrical circuit components is transferred to the electrical circuit members and even other electrical circuits. Since heat can be radiated to the outside through the components, an electric circuit device with good heat dissipation properties can be obtained.

9. When one or both of powders or fibers of one or more kinds of metal materials and inorganic materials having a coefficient of thermal expansion relatively close to that of the electric circuit components is dispersed in the insulator of the electrical connection member. Since the coefficient of thermal expansion approaches that of the electric circuit component, less thermal stress is generated even when heat is applied, and a highly reliable electric circuit device, and by extension, a semiconductor device, can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing the embodiment; FIG. 1(a) shows the state before connection, FIG. 1(b) shows the state after connection, and FIG.
C) and (d) show the thermal printing head, with FIG. 1(C) being a perspective view and FIG. 1(d) being a front view. FIG. 2 is a diagram for explaining an example of a manufacturing method of an electrical connection member used in the example, in which FIG. 2(a) is a cross-sectional view, FIG. 2(b) is a plan view, FIG. 2(c) is a sectional view. 3 shows Example 2, FIG. 3(a) is a sectional view, FIG. 3(b) is a sectional view, FIG. 3(C) is a perspective view, and FIG.
d) is a front view. 4 and 5 are cross-sectional views of the electrical connection member used in Example 3. FIG. FIG. 6 shows Example 4, FIG. 6(a) is a perspective view, and FIG.
Figure (b) is a front view. FIG. 7 shows Example 5, FIG. 7(a) is a perspective view, and FIG.
Figure (b) is a front view. FIG. 8 is a sectional view showing the sixth embodiment. FIG. 9 shows Example 7, FIG. 9(a) is a perspective view,
FIG. 9(b) is a sectional view. FIG. 10 shows Example 8, FIGS. 10(a) and 10(e) are sectional views, and FIG. 10(b) is a perspective view. 11 to 18 show conventional examples, except for FIG. 12, which is a sectional view, and FIG. 12 is a plan perspective view. (Explanation of symbols) 1...Lead frame, 2...Element mounting part of lead frame, 3...Silver paste, 4.4゛...Semiconductor element, 5,5°...Semiconductor element Connection part, 6... Connection part of lead frame, 7... Ultrafine metal wire, 8...
Resin, 9... Semiconductor device, 10... Outer periphery of semiconductor element, 11... Outer periphery of element mounting portion of lead frame, 16... Carrier film substrate, 17... Carrier film substrate Inner lead part, 20...resin, 21...resin, 31...solder bump, 32...
- Substrate, 33... Connection part of the board, 51... Circuit board, 52... Connection part of the circuit board, 54... Connection part of the electrical connection member, 55... Lead frame, 70, 70
°...Metal material, 71.71'...Insulating film, 72.7
2'...Exposed surface of insulating film, 73.73°...Exposed surface of metal material, 5,75°...Circuit board, 76.76°
... Connecting portion of circuit board, 77 ... Insulating material of anisotropic conductive film, 78 ... Anisotropic conductive film, 79 ... Conductive particles, 81 ... Insulating material of elastic connector, 82・
...Metal wire of elastic connector, 83...Elastic connector, 101...Semiconductor element, 103...
- Insulating film, 106... Insulating film, 104... Electric circuit component (circuit board), 105... Connection part, 107...
Electrically conductive member (metal member), 108... Connection portion, 1
09... Connection portion, 111... Holder (insulator), 1
21... Metal wire, 122... Rod, 123... Resin, 124... Dotted line, 125... Electrical connection member, 1
28,129°130... electrical connection member, 142.
... Hole, 131° 132 ... Metal wire guide plate, 150.
...Bamb, 170...Sealing material, 184,187...
・Electrical circuit components (circuit board), 194, 197... Connection part, 201° 202. 203, 204... Semiconductor element, 206° 207. 208, 209, 210... Connection part, 400... Heating element, 401... Ink chamber. Figure 1 (a) Figure 1 (C) Figure 1 (d) Figure 2 (a) lll IIJ Figure 3 (a) 3L doorway' (b Figure 3 (C) Figure 3 (d) ) Figure 6 (b) Figure 7 (b) Figure 9 (a) Figure 9 (b) Figure 1O (a) Figure 10 (c) Figure 11 Figure 12 Figure 13 Figure 15

Claims (6)

[Claims] (1) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and at least one or more electrical connection member, the other end of the electrically conductive member being exposed on the other surface of the holder; and at least one or more connection part; , at least one or more electrical circuit components to which one end of at least one of the electrically conductive members exposed on the surface of the holder is connected, and the connection portion is connected to an end of the electrical circuit component. with an electric circuit component existing in
At least one other electrical circuit component to which the other end of at least one of the electrically conductive members exposed on the surface of the holder is connected, the connection portion being an end of the electrical circuit component. An electrical circuit device having at least: an electrical circuit component present in the part; (2) In the electric circuit device according to claim 1, at least one of the electric circuit components is connected by metallizing and/or alloying the connecting portion and the end of the electrically conductive member, and the other An electric circuit device characterized in that the electric circuit components of are connected by means other than metallization and/or alloying. (3) The electric circuit device according to claim 1, characterized in that all of the electric circuit components are connected by metallizing and/or alloying the connecting portion and the end of the electrically conductive member. Electric circuit equipment. (4) The electric circuit device according to claim 1, characterized in that all of the electric circuit components are connected at their connecting portions and the ends of the electrically conductive members by a method other than metallization and/or alloying. electrical circuit equipment. (5) In the electric circuit device according to claims 1 to 4,
An electric circuit component characterized in that at least one of the electric circuit components is detachably connected. (6) In the electric circuit device according to claim 2 or claim 3,
At least two or more electric circuit components are connected by metallization and/or alloying, and the melting point of the metal layer and/or alloy layer formed by metallization and/or alloying for the electric circuit component to be attached or detached is An electric circuit device characterized in that the melting point thereof is lower than the melting point of a metal layer and/or an alloy layer formed by metallization and/or alloying of an electric circuit component that is not attached or detached.