JPH01316453A - Film forming equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a film forming apparatus for depositing a thin film on the surface of a workpiece in, for example, a vacuum atmosphere.

(Prior Art) Conventionally, batch-type vapor deposition apparatuses and load-lock-type vapor deposition apparatuses have been known as apparatuses for forming a thin film on the surface of a workpiece in a vacuum atmosphere using a vacuum evaporation method, a sputtering method, a CVD method, or the like. There is.

The batch type vapor deposition apparatus has a vapor deposition chamber 1 as shown in FIG.
Incorporate the holder 102 to which many (usually 100 to 400) works 103 were previously attached, and open this room ^
The chamber is evacuated to evaporate the vapor deposition material 104 provided in the crucible 109, and this thin film is deposited on the surface of the work 103.

This device is equipped with a door 107 in the vapor deposition chamber 1, and the holder is taken out and taken in from this door every time the -th vapor deposition process is completed, and conditions such as the degree of vacuum are set each time. I try to do it.

In addition, 108 in the figure is a vacuum seal provided between this vapor deposition chamber 101 and the door 107 in order to maintain the airtightness of the vapor deposition chamber 1, and +06 is an exhaust gas to create a vacuum atmosphere inside the vapor deposition chamber I1. 105 is an evaporation flow that evaporates from the evaporation material 104.

In addition, as shown in FIG. 6, the load-lock type vapor deposition apparatus has a vapor deposition chamber II+ and a load-lock chamber 129 connected to each other via a gate valve 116, so that the first vapor deposition chamber is always kept in a vacuum atmosphere. This is what I did. That is, load lock chamber 1
A door 118 provided below 29 is opened by an opening/closing mechanism 119, and the holder 112 with a large number of workpieces +14 attached thereto is put into the load lock chamber 129. Next, the door +18 is closed to open the load lock chamber. After evacuation to a high vacuum, open the gate valve 116 and move the holder 112 from the load/lock chamber 129 to the evaporation chamber 111. Then, the evaporation material +15 in the evaporation source 113 is evaporated and this thin film is applied to the surface of the workpiece 114. It is attached. 124 in the diagram
is the evaporation stream evaporating from the deposition material 125.

In addition, in Figure 6, +20 is load lock chamber 1.
An exhaust valve 29 is provided, and 121 is an exhaust valve provided for the deposition chamber II+.

117 is a holder gripping mechanism provided above the load/lock chamber 129 and capable of upward movement; +15 is a holder gripping mechanism provided above the vapor deposition chamber 111.

In all of the conventional vacuum deposition apparatuses described above, the holder is taken out from the deposition chamber and the workpiece attached to the holder is removed every time the deposition is completed. Then, the next new workpiece is attached to the holder from which this workpiece was removed, and after this holder is accommodated in the vapor deposition chamber, vapor deposition is performed in the same manner as above.

(Problem to be solved by the invention) However, conventionally, the above-mentioned work of removing and attaching the workpiece from the holder and the work of taking the holder into and out of the vapor deposition chamber have all been done manually. However, when 100 to 400 workpieces are usually attached to one holder, there is a drawback that a large amount of work in progress is generated between the pre-process and the post-process.

Due to these drawbacks, the following problems arise.

(1) As mentioned above, if a severely damaged work-in-progress occurs between the pre-process and the post-process, a huge amount of cost will be required to manage the work-in-progress.

(2) To take out the workpiece after vapor deposition, the holder is taken out to the outside. At this time, a large amount of unnecessary gas molecules such as 1180 vapor are adsorbed on the holder surface, and the vacuum atmosphere is We must strive to maintain it.

(3) When vapor deposition is performed on both sides of a workpiece, usually after completing the vapor deposition on one side, the -μ holder is taken out from the vapor deposition chamber, the vapor deposition surface of each workpiece is turned over, and then this holder is placed on both sides of the vapor deposition chamber. need to be accommodated. Therefore, if these operations are performed manually, the effort required for each process becomes extremely troublesome, and the labor cost required for this process becomes enormous.

(4), ), in order to solve the problems mentioned above.

- If a large number of workpieces are deposited in one evaporation cycle, the holder becomes larger, and the entire evaporation equipment must also become larger.As a result, evacuation takes a long time, and the evacuation system is One company in the world is needed.

In addition, a vacuum film forming apparatus that can form a film on a workpiece without taking out the holder holding the workpiece from the vacuum container into the atmosphere is disclosed in Japanese Patent Laid-Open No. 62-253768. be.

This apparatus has a structure for maintaining the vacuum in the vacuum container as described in "-", a zone for exchanging a workpiece that has been subjected to vapor deposition processing with a new workpiece, called a workpiece exchange zone, and a holder (this invention When transferring a rotating transport member (corresponding to a rotating transport member) from a vacuum container to a workpiece exchange zone, this zone is maintained in a vacuum atmosphere, and when a workpiece is exchanged for a new one, this zone is exposed to the atmosphere. The zone is then evacuated again before the holder is transferred into a vacuum vessel.

However, with such a device, it is necessary to change the atmosphere in the workpiece exchange zone each time a workpiece is exchanged, which requires extremely labor-intensive work when processing a large number of workpieces. do.

In order to solve the above-mentioned problems, the inventors of the present invention have developed a method that minimizes the generation of work-in-progress by continuously performing the vapor deposition process on both sides of the workpiece (without removing the holder from the vapor deposition chamber). has already proposed a vacuum film forming apparatus that can simplify manufacturing operations and reduce manufacturing costs.

The present invention relates to such a film forming apparatus. In particular, in the vacuum film forming apparatus as described above, when a workpiece is transferred from the intake chamber of the apparatus into the deposition chamber and the workpiece comes into contact with a transport means having a temperature difference, damage may occur due to thermal shock. There is. For example, if the workpiece obtained in the previous step is a glass lens obtained by press-molding a heat-softened glass material, the temperature is usually 250 to 300°C.
It is removed from the press molding process at a temperature of . When transporting this workpiece into the deposition chamber, if the intake means used for taking the workpiece and the workpiece have a temperature difference of more than a predetermined temperature, the contact between the two will cause the workpiece to exceed the predetermined thermal stress. It will destroy it.

The present invention was developed in view of the above circumstances, and when a workpiece such as a glass lens that is exposed to a certain temperature is introduced into a film forming apparatus, the workpiece is destroyed due to thermal shock. The purpose is to provide a film-forming apparatus that does not require

(Means for Solving the Problems) In order to achieve the above-mentioned problems, the film forming apparatus of the present invention has the following features:
A film forming apparatus for forming a film on the surface of a workpiece includes a workpiece conveyance means for taking the workpiece into or out of the apparatus, and when the workpiece is held in the conveyance means, the workpiece and the workpiece contact part of the conveyance means 6 (Function) In the device configured in this way, the work transported from the n;1 step is taken into the film forming apparatus by the work transport means. or removed from this device. The temperature difference between the contact portion of the workpiece conveying means that comes into contact with the workpiece and the workpiece during this loading or unloading is maintained within a predetermined temperature range. By setting this temperature difference to a temperature difference that does not cause destruction of the workpiece due to thermal shock, it is possible to prevent destruction due to thermal shock when the workpiece is loaded into or taken out from the apparatus from the previous process.

(Example) Hereinafter, an example of the F1 present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of essential parts of one embodiment of the present invention, and FIG.
The workpiece intake part in the vacuum film forming apparatus shown in the figure is shown.

FIG. 2 is a schematic cross-sectional view showing the overall configuration of a vacuum film forming apparatus using the apparatus shown in FIG.

FIG. 3 is a schematic cross-sectional view taken along line A-A in FIG. 2.

4(a) to 4(d) are schematic cross-sectional views of the load lock chamber and its surroundings to explain the operation of transferring a workpiece from the intake port into the deposition chamber.6 FIG. 5 shows an example of application of this embodiment. FIG.

Hereinafter, the vacuum film forming apparatus shown as an embodiment of the film forming apparatus of the present invention is an optical film formed by heating and pressurizing molten glass.
It is configured as an apparatus for depositing a thin film on the surface of a workpiece that has been processed into a child shape.

In this apparatus, as shown in FIG. 2, from the press molding process, which is the 1111th process, to the vapor deposition chamber! Work intake port 22
The workpiece 27 transferred to a is put into the deposition chamber I from the load lock "4.48" provided at this intake port,
After going through a predetermined vapor deposition process.

The workpiece exits from the load lock chamber 4b provided at the workpiece take-out port 22b of the vapor deposition chamber l and is transported to the next location.

First, the area around the workpiece intake port 22a will be described with reference to FIG.

The workpiece intake port 22a constitutes a conveyance path that is continuously formed from the previous process, is partitioned by an intake wall 83, and is placed in a normal pressure atmosphere 81. This intake wall 831 and one partition wall 84 constitute the bottom of the vapor deposition chamber 1 shown in FIG. A vacuum atmosphere 82 is maintained inside.

Interval W! A load rotor chamber 4a is provided above the opening 84. Inside this load rotor chamber 4a is a transport table 6 which is raised and lowered by a vertical mechanism 7a provided below.
A is provided. Conveyance table 6a and vertical mechanism 78
is a bracket ψI to 8 that constitutes a part of the conveyance table 6a.
6 is connected by a rod 80 via a joint 79 connected to the rod 80 .

The transport daple 6a is slidably mounted on a bearing 73 provided on the floor of the intake 1122a, and is moved up and down by the drive of the L lower machine side 78. A cooling jacket 72 is provided inside the transport daple 6a. A cooling medium can be supplied into the transport table 6a from the outside via a refrigerant inlet/output joint 78 connected to the bracket 86. Further, a heater 8a connected to a heat transfer body 74 provided at the L portion of the transport table is provided inside the transport table 6a, and this heater is connected to a power control (not shown) via a heater power terminal wire 77. The E2 heat transfer body 74 is connected to a heat exchanger and heated to a predetermined temperature. Further, a workpiece a placement table 87 is provided at the end of the transport table 6a-L, and the workpiece 27 can be placed on this ai placement table. This work Jl
The uia mounting table 87 is heated to a predetermined temperature by the heater 8a via the heat transfer body 74.

A lower cover 20a is attached to the position corresponding to the intake port 22a of the transport table 6a, and the lower opening of the load lock chamber 4a can be opened and closed in accordance with the upward movement of the transport table 6a. . That is, the transport table 6a
When the lower cover 208 comes into contact with the partition wall 84 of the vapor deposition chamber 1, the lower opening of the load rotor chamber 4a is closed. Reference numeral 41 denotes a vacuum seal for maintaining airtightness of the lower opening of the load lock chamber 4a during this closure.

Above the upper opening of the load lock chamber 4a.

Upper F mechanism 5a (second
An E-side cover 38 is provided, which is connected to the E-side cover (as shown in the figure). This cover 3a can be moved up and down by the lower mechanism 5a to open and close the upper part of the load lock chamber 4a. 40 is the load lock chamber 4 at the time of this blockage.
This is a vacuum seal to maintain the airtightness of the upper opening of a.

An exhaust port 85 is connected to the side of the load lock chamber 4a as shown in FIG. 2, and an exhaust valve 16a as shown in FIG. A connected leak system is provided to exhaust the interior of the load lock chamber and restore normal pressure.

In the above configuration, the workpiece mounting table 87 is heated by energizing the heater 8a. And work i$il! The mounting table 87 is maintained at a predetermined temperature by heating with the heater 8a and cooling with the cooling jacket 72. The temperature of this mounting table is determined in relation to the temperature of the workpiece 27 placed ai on the a placement table. That is, when the workpiece is made of a glass material, the mounting table 84 and the workpiece 2 are placed within a temperature range that can withstand thermal shock inherent to various glass materials.
Try to take the temperature difference from 7. Preferably work 27
and the a-mounting stand 84 are made to have the same temperature.

As a result, when the workpiece 27 is transferred from the intake port 22a into the vapor deposition chamber l, the workpiece 27 is not destroyed by thermal shock as described above, and is transferred in a preferable state to the vapor deposition process shown below. Ru.

In addition, when the pre-process is a process of heating and press-molding a glass material to process a lens of a predetermined shape, the glass lens obtained through the molding process usually has a temperature of about 250 to 30[theta]C. Also, since vapor deposition is normally carried out at 200 to 300°C, the temperature of the workpiece mounting table 87 should be adjusted to this level.
i! It is preferable to adjust the temperature so that the workpiece 27 on the apparatus is kept within the vapor deposition temperature range L.

In addition, the transport system provided in the above-mentioned configuration [122a] is also provided with a similar configuration in the take-out port 22b, and the workpiece 27 that has been vapor-deposited in the vapor deposition chamber 1 is taken out [122b
It can be taken out and transported to the next process.

Here, the operation of transferring the workpiece 27 transported to the intake port 22a into the vapor deposition chamber 1 with the above-described configuration will be explained with reference to FIGS. 4(a) to 4(d).

When the transport table 6a is at the F-most lowering position, the cover 3a
The seventh side opening of the load rotor chamber 4a is in a closed state. At this time, the leak valve 18a is opened and the exhaust valve 16a is closed. At this time, when the workpiece 27 transported from the previous step to the intake port 22a is transferred to the table 6al2 by an automatic hand, the inside of the load rotor chamber 4a is at the same atmospheric pressure as the intake port 22a. . (Fig. 4(a)) Next, the leak valve 18a is closed, and the exhaust valve 1 is closed.
6a is also kept closed, and the transport table 6a is moved to the highest position. At this time, the cover 20a closes the door side opening of the load lock chamber 4d, and both the upper and lower openings of the load lock chamber are closed. (4th
Figure (b)) Therefore, the leak valve +8a remains closed, and the exhaust valve 16a is opened to evacuate the inside of the load lock chamber 4a to a predetermined vacuum state of about 10-" to l O-" Torr. . (Figure 4 (C)) After that,
Leak valve +8a remains closed, exhaust valve 1
6a is also closed, and the upper blade cover 3a of the load-lock chamber 4a is moved upwardly to open the load-lock chamber to the vapor deposition chamber 1. (FIG. 4(d)) By such an operation, the workpiece 27 is transferred into the vapor deposition chamber 1 without breaking the vacuum atmosphere inside the vapor deposition chamber l.

Next, the configuration inside the vapor deposition chamber 1 will be explained with reference to FIGS. 2 and 3.

The deposition chamber 1 is evacuated to a high vacuum by an exhaust valve 30 and an exhaust system connected thereto, and the inside of the deposition chamber 1 is approximately 10-'
A vacuum atmosphere of T' orr is maintained.

A transfer arm mechanism 13 is provided within the steam chamber 1 and is rotated by a motor connected to a control device (not shown). The transfer arm mechanism 13 has a transfer arm 13a that extends, for example, in four radial directions around the rotation axis of the transfer arm mechanism, and has a notch hole 13b at its tip.

Also, pushers 12a and +2b having position indexing mechanisms are installed directly in the notch hole 13b at the tip of the transfer arm mechanism 13 and on the workpiece intake port 22a side and the workpiece removal port 22b side, respectively. It is arranged θ so as to be able to move up and down so as to be able to pass through the notch hole 13b at the tip.

The holder 10 usually has a cutout hole 1 in the transfer arm +3a.
It is placed on 3b. For example, about 10 works 27 are arranged in this holder, and workpiece mounting holes 10a are arranged at equal intervals on a concentric circle of the holder so that one side of each work is exposed.

Transfer arm 1 of transfer arm mechanism 13: 3a
Button shear 12a arranged on the intake 022a side
, h, the transfer arm mechanism comes to a stop and then when the bushing 12a moves up inside the notch hole 13b at the tip of the transfer arm 13a, the holder 10 placed a in the notch hole F moves to the bushing. By being pushed up by -, it becomes held by the button.

As described above, the indexing mechanism of the busher 12a operates to sequentially rotate and move the holder held by the busher 12a by the distance between adjacent workpiece mounting holes 10a.

A human mechanism 1 is provided on the L side of each of the bushings 12a and 12b.
A holder cover 11 is provided which is lowered by 4b and holds each workpiece 27 placed on the holder 10. After the holder cover has been lowered and placed on the holder cover, it is removed from the -E mechanism +4b.

A workpiece transfer machine 19a is provided between the transfer arm mechanism 13 and the load lock chamber 4a described above, and is equipped with a hanging hand for gripping the workpiece 27 at its tip.

Here, with the configuration as described in 1- below, the transport table 6a
The operation of transferring the workpiece 27 placed above to the holder 10 of the transfer arm mechanism 130 will be described.

First, the transport table 6a is moved to the highest position in the load lock chamber 4a by the hand of the workpiece transport mechanism 9a.
The upper workpiece 27 is held.

Next, the workpiece transport mechanism 9a is rotated onto the pusher 12a.

On the other hand, the holder 10 placed on the transfer arm 13a'2 of the transfer arm mechanism 13 is moved to the pusher 12al by the rotation of the transfer arm mechanism.Next, this holder 10 is held by the rise of the pusher +2a. Then, the button shear position indexing mechanism is activated to move the workpiece mounting hole 10a of the holder 10 directly into the workpiece 27 transferred by the workpiece transfer mechanism 94. Thereafter, the workpiece 27 is removed from the workpiece transport mechanism 9a and placed on the workpiece placement hole +Oa of the holder 10.

Furthermore, after rotating the button shear 12a and performing the above-described operation for each mounting hole 10a of the holder 10, the holder cover 11 is held from above the holder 10, and the holder cover is moved to the L lower mechanism 14a. At the same time, the button shear 12a is lowered.

In this way, the holder 10, which has finished holding the workpiece 27, is transferred to the transfer arm 1:3a,h! When placed,
The transfer arm mechanism 13 transfers the workpiece 27 to the next empty holder 10.
When the holder IQ is rotated by -4 minutes to hold the workpiece 27, the holder IQ, which already holds the workpiece 27, is transferred to a vapor deposition area which will be described later.

Next, using FIG. 3, the vapor deposition source 2 and the holder gripping mechanism 17 are
and the holder exchange mechanism 51 will be explained.

”- Centering on the transfer arm mechanism 13 ”, the transfer arm mechanism 13
A vapor deposition source 2 is provided on one side substantially perpendicular to +2a, and a holder exchange mechanism 51 is provided on the other side.Furthermore, on the vapor deposition source 2 side, one side of the workpiece 27 deposited by the vapor deposition source is used for vapor deposition. A holder reversing mechanism 17 for reversing the entire holder 10 is provided.

A vapor deposition material 44 is stored in the vapor deposition source 2, and the vapor deposition material 44 is evaporated and scattered above the vapor deposition source 2 (hereinafter, this area will be referred to as a vapor deposition area). An automatic replenishment device (not shown) is provided for replenishing.

Adhesion prevention covers 52a and 52b are provided on the upper outer periphery of the vapor deposition source 2 and on the F side of the column to prevent the vapor deposition material 44 from scattering outside the vapor deposition area.

The holder gripping mechanism 17 includes holder fingers 17 a
lj! - It is provided so that the holder 10 and the holder cover 11 can be held and rotated together from the side of the vapor deposition chamber l. When the transfer arm mechanism 13 rotates and the holder 10 reaches the first vapor deposition area, the transfer arm mechanism 13
stops at the deposition position.

At this time, the holder gripping mechanism 17 grips the inner side of the holder 10 together with the holder cover 11. Next, after the transfer arm mechanism 13 is rotated to avoid the deposition position, a thin film of a predetermined thickness is deposited on the upper side of the workpiece held in the holder 10. Further, when the vapor deposition on one side of the workpiece 27 is completed, the holder gripping mechanism 17 is rotated 180 degrees to perform vapor deposition on the opposite side, thus completing the thin film formation on both sides of the workpiece 27.

The holder exchange mechanism 51 is used when the holder 10 becomes heavily soiled due to repeated vapor deposition as described above, or when the holder needs to be exchanged, such as when changing the shape of the workpiece. This holder exchange mechanism 51 is configured to take out an old holder into a holder cassette 54 provided outside the vapor deposition chamber 1, and place a new holder stored in a cassette 51 on the transfer arm mechanism 13 in the vapor deposition neck. It is what was done. When replacing the old and new holders, the interior of the holder cassette 54 is maintained in a vacuum atmosphere, so the vacuum atmosphere in the vapor deposition chamber 1 is maintained even when the holders are replaced.

Next, the means for taking out the workpiece after vapor deposition will be explained.

The holder 10, which has been subjected to vapor deposition, is moved from the above-mentioned vapor deposition area to the pusher 12b disposed on the extraction port 22b side by the rotational movement of the transfer arm mechanism 13.

A work pushing mechanism 3 is provided near the bushing 12b for pushing upward the work 27 in the holder 10 transferred to the bushing. To operate this work pushing mechanism, first press the button shear 12.
The holder cover 11 provided above b is raised by the upper F mechanism 14b.

After that.

The work pushing mechanism 31 is operated to push up the work 27 placed a on the holder 10. This pushed up workpiece is gripped by a transport mechanism 9b equipped with a gripping function,
Due to the rotational movement of the transport mechanism, the material is transported toward the load lock chamber 4b provided on the unloading U side.

Upper cover 3b, lower cover 2ob, l:, side cover 3 around the load lock chamber 4b on the extraction port 22b side
1- of b, F mechanism 5b, upper and lower machine t of F side cover 20b
117b and the like have the same configuration and operation as those on the intake port 22a side. Therefore, the workpiece 27 can be taken out from the load lock chamber 4b on the side of the takeout port 22b by an operation opposite to the operation in the loadlock chamber 4a provided on the side of the workpiece intake port 22a.
The vacuum atmosphere within the vapor deposition chamber 1 is maintained even when the workpiece is taken out from the load lock chamber 4b.

In addition, the heater 8b provided in the load lock chamber 4h
As a result, the temperature of the workpiece 27 on the transfer table 6b becomes 1
The temperature is adjusted to be maintained in a temperature range of 50 to 200°C.

As shown in FIG. 5, the vacuum film forming apparatus described above is used after a press molding process in which molten glass is heated and pressurized to form an optical element such as a camera lens. A thin film can be deposited on the surface of the workpiece 27 formed into an r-shape.

In Figure 5, 61 indicates molten glass! Press-forming the molten glass into a preformed product having a shape similar to that of the final molded product;
Reference numeral 63 indicates a step of press-molding this Y-prepared molded product into a high-precision optical element, and reference numeral 64 indicates a vacuum film forming apparatus of this embodiment. As shown in the figure, the molten glass supplied from the melting process 61 passes through the press 1 stages 62 and 63 one by one and is formed into an optical element of a desired shape, and is then conveyed into the apparatus to form a predetermined shape. After the film-forming process is performed, it is carried out from the take-out port, and then transferred to the primary process. As can be understood from this figure, the vacuum film forming apparatus of this embodiment is suitable for the film forming process of continuously formed culms of optical fibers.

Note that the film forming apparatus of the present invention does not need to be limited to a specific film forming means, and can be used as a vacuum evaporation apparatus a having an evaporation source for multilayer film formation, a sputtering apparatus θ, or a CVD apparatus. can do.

(Effects of the Invention) In the film forming apparatus of the present invention described above, when a workpiece is transported from the intake chamber of the apparatus into the deposition chamber, the temperature difference between the workpiece and the contact part of the workpiece transport means that comes into contact with the workpiece is reduced. By keeping the temperature within the specified temperature range.

No damage to the workpiece due to thermal shock occurs.

For example, a highly accurate optical lens obtained in the previous process can be transported to the vapor deposition process with its viscosity unchanged.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of essential parts of one embodiment of the present invention, and FIG.
The workpiece intake part in the vacuum film forming apparatus shown in the figure is shown. Is Figure 2 the device shown in Figure 1? 1 is a schematic cross-sectional view showing the overall configuration of a vacuum film forming apparatus using a vacuum film forming apparatus. FIG. 3 is a schematic sectional view taken along line Δ-A in FIG. 2. FIGS. 4(a) to 4(d) are schematic sectional views of the vicinity of the load lock chamber, illustrating the operation of transferring a workpiece from the intake port into the deposition chamber. FIG. 5 is a diagram showing an example of application of the present invention. 6 and 7 show conventional apparatuses, FIG. 6 is a schematic cross-sectional view of a batch type vapor deposition apparatus, and FIG. 7 is a schematic cross-sectional view of a load-lock type vapor deposition apparatus 6. l... Vapor deposition chamber 2... Vapor deposition source 3a, :lb...G side cover 4F], 4b... Load lock chamber 621.6b... Transport table 8a... Heater 10... Holder 11... Holder cover +2a, +2b... Button 13... Transfer arm mechanism 17... Holder rotation mechanism 20a... Upper cover 22a... Intake port 22b... Outlet port 27... - Workpiece 44... Vapor deposition material 51... Holder exchange mechanism 72... Cooling jacket 87... Mounting table 85... Exhaust [1 Agent Patent attorney +11'F Johei

Claims (2)

[Claims] (1) A film forming apparatus for forming a film on the surface of a workpiece, which includes a workpiece conveying means for taking the workpiece into or taking it out from the apparatus, and when holding the workpiece in the conveying means, the workpiece and the workpiece of the conveying means are A film forming apparatus characterized by keeping the temperature difference between the contact part and the contact part within a predetermined temperature. (2) The film forming apparatus according to claim 1, further comprising preheating means for preheating the workpiece contact portion.