JPH0132453B2 - - Google Patents
Info
- Publication number
- JPH0132453B2 JPH0132453B2 JP57195890A JP19589082A JPH0132453B2 JP H0132453 B2 JPH0132453 B2 JP H0132453B2 JP 57195890 A JP57195890 A JP 57195890A JP 19589082 A JP19589082 A JP 19589082A JP H0132453 B2 JPH0132453 B2 JP H0132453B2
- Authority
- JP
- Japan
- Prior art keywords
- vibrator
- vibration mode
- slit
- bending
- bending vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005452 bending Methods 0.000 claims description 21
- 238000000605 extraction Methods 0.000 claims description 3
- 230000010287 polarization Effects 0.000 claims description 3
- 101700004678 SLIT3 Proteins 0.000 description 6
- 102100027339 Slit homolog 3 protein Human genes 0.000 description 6
- 238000003754 machining Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 239000012768 molten material Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、振動物体における弾性振動を検出す
るのに適した共振型振動センサ、特に所定の周波
数について検出感度の優れた共振型振動センサに
関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a resonant vibration sensor suitable for detecting elastic vibrations in a vibrating object, and particularly to a resonant vibration sensor with excellent detection sensitivity for a predetermined frequency. be.
従来例の構成とその問題点
従来、振動物体における弾性振動を検出するセ
ンサとして、振動物体の固有振動数に共振周波数
を合わせた屈曲振動モードの片持ちばり構造の矩
形状バイモルフ圧電振動子が良く知られている。
しかしながら、機械的にあるいは温度変化等によ
り発生する応力により支持部にずれが生じ、安定
な共振周波数が得られないという欠点を有してい
た。そこで貼り合わせ圧電振動子片を、レーザ加
工機等により溶融切断して、所定の周波数で共振
する屈曲振動子を得、該屈曲振動子の周辺を支持
固定することによつて安定な共振周波数を有する
共振型振動センサを得ていた。しかし、レーザ加
工を行なう場合、加工開始点では未貫通によるレ
ーザ補助ガスの乱れによつて、レーザのビーム径
より大きい穴があくことが知られ、加工の終了す
る場合には、レーザビームを遮断するシヤツタの
時間遅れによつてこれもまた大きな穴があくとい
うことが知られている。第1図はこのような従来
の屈曲振動子で、厚さ方向に分極軸を有する円板
状圧電素子2枚を貼り合わせた圧電振動子中に、
レーザ加工によつて屈曲振動モード振動子を局在
させ、振動部分中に加工の開始、終了を位置させ
たときの加工結果を示したものである。同図aは
上面図、同図bは縦断面図、同図cは底面図で、
円板状圧電素子1,2の電極1a′と2a′で電気的
導通が図られるごとく充分薄く、前記円板状圧電
素子1,2を接着して貼り合わせ圧電振動子と
し、該貼り合わせ圧電振動子をレーザ加工機によ
り貫通部分切削(以後部分切削された部分3をス
リツトと称する)を矢印のごとく行ない、上面電
極1aをスリツト3で囲まれた部分と出力電圧取
り出し部分とし、底面電極2aをスリツト3で囲
まれた部分から周縁までの部分とした部分電極か
ら成る構造のものである。前記貼り合わせ圧電振
動子のスリツト3周辺から外周までを被支持部と
すれば、スリツト3で囲まれた部分は屈曲振動モ
ードのいわゆる片持ちはり型振動子として機能す
る。しかしながら、前記屈曲振動子の振動部にレ
ーザ加工の開始、終了点があるためスリツトの幅
より大きな穴があき、振動部分の長さ寸法が変わ
るので共振周波数が変化する。また、加工開始点
では未貫通の状態から加工を始めるのでレーザ加
工機の補助ガス流の乱れによつて溶融物の吹き飛
ばしが不十分で、その為導電性の溶融物が切断面
に相当付着し、振動部電極間の絶縁抵抗を下げる
ことになる。さらに、加工開始、終了部分では熱
ひずみが他の部分に比べて大きいためこれが振動
部に位置すれば長寿命性、信頼性に欠けるという
欠点があつた。Conventional configuration and its problems Conventionally, a rectangular bimorph piezoelectric vibrator with a cantilevered structure in a bending vibration mode, whose resonance frequency is matched to the natural frequency of the vibrating object, has been used as a sensor for detecting elastic vibrations in a vibrating object. Are known.
However, it has had the disadvantage that the supporting portion may shift due to stress generated mechanically or due to temperature changes, etc., making it impossible to obtain a stable resonant frequency. Therefore, the bonded piezoelectric vibrator pieces are melted and cut using a laser processing machine or the like to obtain a bending vibrator that resonates at a predetermined frequency, and by supporting and fixing the periphery of the bending vibrator, a stable resonance frequency can be obtained. A resonant vibration sensor was obtained. However, when performing laser processing, it is known that at the starting point of processing, a hole larger than the laser beam diameter is created due to disturbance of the laser auxiliary gas due to non-penetration, and when processing ends, the laser beam must be shut off. It is known that the time delay of the shutter can also cause large holes. Figure 1 shows such a conventional bending vibrator, in which two disk-shaped piezoelectric elements having polarization axes in the thickness direction are bonded together.
This figure shows the processing results when a bending vibration mode vibrator is localized by laser processing and the start and end of processing are located in the vibrating part. Figure a is a top view, figure b is a longitudinal sectional view, figure c is a bottom view,
The disk-shaped piezoelectric elements 1 and 2 are bonded to form a bonded piezoelectric vibrator, which is sufficiently thin so that the electrodes 1a' and 2a' of the disk-shaped piezoelectric elements 1 and 2 are electrically connected. The vibrator is cut through (the partially cut portion 3 will be referred to as a slit hereinafter) using a laser processing machine as shown in the arrow, and the upper surface electrode 1a is the portion surrounded by the slit 3 and the output voltage extraction portion, and the bottom surface electrode 2a is This structure consists of a partial electrode extending from the part surrounded by the slit 3 to the peripheral edge. If the area from the vicinity of the slit 3 to the outer periphery of the bonded piezoelectric vibrator is the supported portion, the portion surrounded by the slit 3 functions as a so-called cantilever type vibrator in a bending vibration mode. However, since the vibrating part of the bending vibrator has the start and end points of laser processing, a hole larger than the width of the slit is formed, and the length of the vibrating part changes, causing a change in the resonant frequency. In addition, since processing starts from an unpierced state at the starting point, the molten material is not sufficiently blown away due to disturbances in the auxiliary gas flow of the laser processing machine, resulting in a considerable amount of conductive molten material adhering to the cut surface. , the insulation resistance between the vibrating part electrodes is lowered. Furthermore, since thermal strain is greater at the start and end portions of machining than at other portions, there is a drawback that if these are located in the vibrating portion, long life and reliability will be lacking.
発明の目的
本発明は、かかる欠点を解決せんとするもので
あり、レーザ加工による加工開始、終了部分を屈
曲振動子の振動部分から離すことにより、所定周
波数に共振を持つ振動センサの設計、製造が容易
となり長寿命、高信頼性が図れる振動センサを提
供することを目的としている。Purpose of the Invention The present invention aims to solve such drawbacks, and by separating the start and end parts of laser processing from the vibrating part of the bending vibrator, the present invention designs and manufactures a vibration sensor that resonates at a predetermined frequency. The purpose of this invention is to provide a vibration sensor that is easy to operate, has a long life, and has high reliability.
発明の構成
本発明は、厚さ方向に分極軸を有する板状圧電
素子2枚を貼り合わせた圧電振動子に、レーザ加
工等による溶融切断で貫通部分切削を行なつてス
リツトを形成し、スリツトで囲まれた部分を屈曲
振動モード振動子としたもので、貫通部分切削を
行なう始端と終端とを屈曲振動モード振動子部分
から離すようにしたものである。Structure of the Invention The present invention involves forming a slit in a piezoelectric vibrator in which two plate-shaped piezoelectric elements having polarization axes in the thickness direction are bonded together, and cutting a penetrating portion of the piezoelectric vibrator by melt cutting using laser processing or the like. The part surrounded by is a bending vibration mode vibrator, and the starting end and the end of the penetrating part cutting are separated from the bending vibration mode vibrator part.
実施例の説明
第2図は本発明による貼り合わせ圧電振動子中
に、屈曲振動モード振動子を加工する場合、加工
開始、終了部分を振動部分と離した場合を示し、
同図aは上面図、同図bは縦断面図、同図cは底
面図である。前記屈曲振動モード振動子の振動部
真横より加工開始し、矢印のごとくスリツト3を
切削したのち振動部真横で加工終了したものであ
る。スリツト3で囲まれた部分が屈曲振動モード
振動子の振動部分となるので、共振周波数Frは
振動部長さlと振動部厚さ下で決まりFr∝T/l2
と表わされることから、スリツトの加工開始、終
了部分の穴の大きさに関係なく振動部長さを一定
にでき、所定周波数に共振周波数を容易に合わせ
ることができる。また、振動部分と出力取出し用
部分のみを電極1a,2aとすることにより、加
工開始、終了部の切断面に付着する溶融物によつ
て起こる電極間の絶縁抵抗低下を防止できる。さ
らに、加工開始、終了部分では熱ひずみが大きい
が振動部に位置していないため高い信頼性を有し
ている。DESCRIPTION OF EMBODIMENTS FIG. 2 shows a case where a bending vibration mode vibrator is machined into a bonded piezoelectric vibrator according to the present invention, and the machining start and end parts are separated from the vibrating part.
Figure a is a top view, figure b is a longitudinal sectional view, and figure c is a bottom view. Machining was started right next to the vibrating part of the bending vibration mode vibrator, and after cutting the slit 3 as shown by the arrow, the machining was completed right next to the vibrating part. Since the part surrounded by the slit 3 becomes the vibration part of the bending vibration mode vibrator, the resonance frequency Fr is determined by the vibration part length l and the vibration part thickness, Fr∝T/l 2
Therefore, the length of the vibrating section can be made constant regardless of the size of the hole at the start and end portions of slit processing, and the resonance frequency can be easily adjusted to a predetermined frequency. Further, by using only the vibrating portion and the output extraction portion as the electrodes 1a and 2a, it is possible to prevent a decrease in insulation resistance between the electrodes caused by molten matter adhering to the cut surfaces at the start and end portions of machining. Furthermore, although the thermal strain is large at the start and end portions of machining, it is not located in the vibrating section, so it has high reliability.
また、複数個の屈曲振動モード振動子を同一の
貼合わせ圧電振動子に加工できるので、個々の屈
曲振動モード振動子を同一あるいは異ならせるこ
とにより所定周波数での検出感度の増大、あるい
は相関等が優れたものとなる。 In addition, multiple bending vibration mode vibrators can be processed into the same bonded piezoelectric vibrator, so by making the individual bending vibration mode vibrators the same or different, detection sensitivity at a predetermined frequency can be increased or correlation can be improved. It will be excellent.
発明の効果
以上の説明からも明らかなように、本発明によ
れば、屈曲振動モード振動子の振動部長さを一定
にできるので所定周波数に共振周波数を容易に合
わせられ、電極間の絶縁抵抗低下を防げ、高い信
頼性を得られるという特徴を有する。また、複数
個の屈曲振動モード振動子を同一貼り合わせ圧電
振動子に局在できるため、複数個の共振周波数の
等しい素子もしくは互いに異なる共振周波数を選
択できるという特徴も有する。Effects of the Invention As is clear from the above description, according to the present invention, the length of the vibration section of the flexural vibration mode vibrator can be made constant, so the resonance frequency can be easily matched to a predetermined frequency, and the insulation resistance between the electrodes can be reduced. It has the characteristics of preventing this and achieving high reliability. Furthermore, since a plurality of bending vibration mode vibrators can be localized in the same bonded piezoelectric vibrator, it is possible to select a plurality of elements having the same resonance frequency or mutually different resonance frequencies.
第1図は貼り合わせた圧電振動子中に、レーザ
加工によつて屈曲振動モード振動子を局在させた
従来例を示す図で、aは上面図、bは縦断面図、
cは底面図、第2図は本発明による一実施例を示
し、屈曲振動モード振動子の加工開始、終了部分
を振動部と離した場合の図で、aは上面図、bは
縦断面図、cは底面図である。
1,2……円板状圧電素子、3……貫通切削し
たスリツト、1a,2a……電極。
Figure 1 shows a conventional example in which a bending vibration mode vibrator is localized by laser processing in a bonded piezoelectric vibrator, in which a is a top view, b is a longitudinal cross-sectional view,
c is a bottom view, FIG. 2 is a diagram showing one embodiment of the present invention, when the processing start and end parts of the bending vibration mode vibrator are separated from the vibrating part, a is a top view, and b is a vertical cross-sectional view. , c is a bottom view. 1, 2... Disc-shaped piezoelectric element, 3... Slit cut through, 1a, 2a... Electrode.
Claims (1)
を貼り合わせた圧電振動子中に、スリツトを形成
することにより所定周波数で共振する屈曲振動モ
ード振動子を局在させた振動センサにおいて、前
記屈曲振動モード振動子を形成するためのスリツ
トの始端と終端とを振動部分と離したことを特徴
とする振動センサ。 2 前記屈曲振動モード振動子の対向電極を、振
動部分と出力電圧取り出し部分のみに設けたこと
を特徴とする特許請求範囲第1項記載の振動セン
サ。 3 前記屈曲振動モード振動子を、複数個前記貼
り合わせ、圧電振動子中に局在させたことを特徴
とする特許請求範囲第1項又は第2項記載の振動
センサ。[Claims] 1. A flexural vibration mode vibrator that resonates at a predetermined frequency is localized by forming a slit in a piezoelectric vibrator made by bonding two plate-like piezoelectric elements having polarization axes in the thickness direction. A vibration sensor characterized in that a starting end and a terminal end of the slit for forming the bending vibration mode vibrator are separated from a vibrating part. 2. The vibration sensor according to claim 1, wherein the opposing electrodes of the bending vibration mode vibrator are provided only in the vibrating part and the output voltage extraction part. 3. The vibration sensor according to claim 1 or 2, characterized in that a plurality of the bending vibration mode vibrators are localized in the bonded piezoelectric vibrator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57195890A JPS5985916A (en) | 1982-11-10 | 1982-11-10 | vibration sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57195890A JPS5985916A (en) | 1982-11-10 | 1982-11-10 | vibration sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5985916A JPS5985916A (en) | 1984-05-18 |
| JPH0132453B2 true JPH0132453B2 (en) | 1989-06-30 |
Family
ID=16348683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57195890A Granted JPS5985916A (en) | 1982-11-10 | 1982-11-10 | vibration sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5985916A (en) |
-
1982
- 1982-11-10 JP JP57195890A patent/JPS5985916A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5985916A (en) | 1984-05-18 |
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