JPH0133156Y2 - - Google Patents
Info
- Publication number
- JPH0133156Y2 JPH0133156Y2 JP6477684U JP6477684U JPH0133156Y2 JP H0133156 Y2 JPH0133156 Y2 JP H0133156Y2 JP 6477684 U JP6477684 U JP 6477684U JP 6477684 U JP6477684 U JP 6477684U JP H0133156 Y2 JPH0133156 Y2 JP H0133156Y2
- Authority
- JP
- Japan
- Prior art keywords
- hanger
- surface treatment
- ultraviolet
- casing
- ray generator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004381 surface treatment Methods 0.000 claims description 23
- 238000004140 cleaning Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 238000011282 treatment Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000011295 pitch Substances 0.000 description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6477684U JPS60177960U (ja) | 1984-05-04 | 1984-05-04 | 表面処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6477684U JPS60177960U (ja) | 1984-05-04 | 1984-05-04 | 表面処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60177960U JPS60177960U (ja) | 1985-11-26 |
| JPH0133156Y2 true JPH0133156Y2 (2) | 1989-10-09 |
Family
ID=30596169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6477684U Granted JPS60177960U (ja) | 1984-05-04 | 1984-05-04 | 表面処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60177960U (2) |
-
1984
- 1984-05-04 JP JP6477684U patent/JPS60177960U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60177960U (ja) | 1985-11-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102741646B1 (ko) | 기판 처리 장치 및 기판 처리 방법 | |
| KR102090838B1 (ko) | 기판 처리 방법 및 기판 처리 장치 | |
| KR100354547B1 (ko) | 레지스트 처리방법 | |
| US5351360A (en) | Cleaning device for a wafer mount plate | |
| JPS62229833A (ja) | 光化学反応方法 | |
| TWI500071B (zh) | A surface treatment method and apparatus for a die, and a pattern forming method | |
| US20140060573A1 (en) | Substrate treatment method and substrate treatment apparatus | |
| CN102791391A (zh) | 处理基片的方法和装置 | |
| JP2013521658A (ja) | フォトレジスト除去プロセッサ及び方法 | |
| CN104916567B (zh) | 晶片处理装置以及晶片的处理方法 | |
| JPH04124827A (ja) | 半導体基板エッチング処理装置 | |
| JPH0133156Y2 (2) | ||
| US6225235B1 (en) | Method and device for cleaning and etching individual wafers using wet chemistry | |
| JP4723285B2 (ja) | 基板処理装置および基板乾燥方法 | |
| US20030164181A1 (en) | Substrate processing apparatus | |
| JP3538114B2 (ja) | 表面付着汚染物質の除去方法及び除去装置 | |
| JPH0656833B2 (ja) | 基板のレジスト除去洗浄方法及びその装置 | |
| JPH0410689Y2 (2) | ||
| JP2004349470A (ja) | 基板処理装置およびその方法 | |
| JP2006303051A (ja) | ウエーハの研削方法および研削装置 | |
| JP3360993B2 (ja) | 基板処理装置 | |
| CN107665838A (zh) | 基板处理装置 | |
| JP2628070B2 (ja) | アッシング装置 | |
| KR20110123175A (ko) | 건식 기판 세정 시스템 | |
| JP4085158B2 (ja) | 光照射による基材表面処理方法及びその装置 |