JPH0134316Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a covered wire soldering machine that solders the stripped end of a cut covered wire.

(Prior art) Conventionally, a covered wire soldering machine has an inverted J-shaped movement path from a molten solder tank, and rotates an impeller to draw up molten solder from the molten solder tank and let it flow down from the top to strip the coating. The attached end was exposed to the flowing melt for a predetermined period of time and soldered.

(Problems that the invention aims to solve) Since the impeller is rotated to constantly pump up the molten solder liquid, the cost of the drive unit and operating costs are high, and the bearings and rotating shaft used for the drive wear out quickly. Maintenance and inspection became troublesome and expensive.

(Means for solving the problem) A liquid level cleaning plate is fixed to the tip of an arm with a long hole that is pivoted on a vertical axis at the rear of the solder liquid tank, so that the liquid level swings, and a slit is formed in the bottom. The provided container is fixed to the tip of an arm that swings up and down about a horizontal axis at the rear of the solder liquid tank, and a tilted rod that engages with the long hole of the arm of the liquid level cleaning plate is fixed to the arm of the container, A mechanism for swinging the arm of the container is provided, and the container swings from the solder liquid into the air, causing the solder liquid to flow down from the slit in the container, and at the same time, the liquid level cleaning plate swings the liquid surface to clean the oxide film of the solder. was removed, and the peeled portion of the coated wire was moved into the solder liquid flowing down below the container slit for a predetermined period of time.

(Function) Because it is driven intermittently to pump up the molten solder liquid, and because the pumping of the molten solder liquid and the liquid surface cleaning are performed using one drive source, the operating cost is low and the liquid level can be cleaned every time it is driven. Since the liquid surface is cleaned with a plate, the oxide film on the liquid surface is removed and a clear solder liquid can be used.

(Example) An example shown in the drawings will be described below. For convenience of explanation, the direction of arrow A and the direction opposite to arrow A in FIG.

Reference numeral 1 denotes a pedestal, and the right side of the upper part is a machine stand 2, and the upper left side is a higher machine stand 3. 4 is a wire supply reel installed at the rear of the machine 2;
Reference numeral 5 denotes a pair of wire feeding conveyors provided on the machine stand 2, which are configured to feed the wire 6 in the direction of arrow A while measuring its length intermittently by driving a control motor (not shown).

Reference numeral 7 denotes a wire rod transfer means, and wire rod guides 7a, 7 are provided at the front and rear.
b, and is equipped with an openable and closable wire gripping device (not shown) inside, and is configured to grip the wire and rotate and transfer it by the arm 7c. Further, the wire transfer means 7 is configured to move back and forth by a cam mechanism (not shown).

Reference numeral 8 designates a cutting blade group consisting of three sets: a set of two opposing core wire cutting blades, and a set of two coating cutting and stripping blades arranged parallel to each other on both sides.

Reference numeral 9 denotes a gripper, which is provided with gripping claws 9a on brackets arranged radially, and is capable of rotating intermittently in the direction of arrow C by the angle between adjacent gripping claws 9a and 9b, and also moving back and forth. .

Reference numeral 10 denotes a terminal punching section, which is configured to crimp the terminal T fed from the terminal supply reel 10a to the stripped end of the wire rotatably transferred by the wire transfer means 7.

Reference numeral 11 denotes a flux coating device installed on the machine base 3, which circulates the flux by jetting it with an impeller through a sponge provided in the window 11a.

12 is a soldering tank installed to the left of the flux applicator on the machine stand 3, and has open windows 12a and 12 on the front and top surfaces.
b is provided, and the rear upper part is open.

Reference numeral 13 denotes an arm with an elongated hole, which is pivotally supported by a vertical shaft 14 on the rear left side of the solder liquid tank, and a liquid level cleaning plate 15 is fixed to the tip so as to swing on the liquid level.

16 is a container with a slit in the bottom, which is the solder liquid tank 1.
Bracket 1 attached to the rear wall of 2
7 is fixed to the tip of an arm 19 that swings about a horizontal axis 18. The arm 19 has a circular arc shape centered on the shaft 18 at the middle portion, and the circular arc portion 19a passes through the window 12b on the upper surface.

Reference numeral 20 denotes an arm integrated with the arm 19, and a cylinder 21 is connected to the tip thereof. As the cylinder 21 expands and contracts, the arm 19 swings, and the container 16 moves up and down. Arm 20, cylinder 21
constitutes a mechanism for swinging the arm 19.

Reference numeral 22 denotes an inclined rod which is designed to engage with the elongated hole of the arm 13 with an elongated hole. It is fixed to the arm 19 by an arm 23 . 24 is a reinforcing material.

The molten solder liquid S in the soldering tank 12 is heated and maintained at a predetermined temperature by a solder heating melter 12c equipped with a thermostat.

25 is a wire receiving tray.

Therefore, by driving the wire feeding conveyor 5,
The wire rod 6 is fed from the wire rod supply reel 4 while passing through the wire rod guides 7a and 7b of the wire rod transfer means 7 while being measured. is gripped, and the tip of the wire 6 is stripped off by the coating cutting and stripping blade 8.

Next, the wire transfer means 7 rotates while holding the wire 6, transfers the stripped end of the wire 6 to the terminal pressing section 10, and crimps the terminal T.

After the terminal crimping is completed, the wire transport means 7 rotates to its original position, the internal gripping section opens, and the wire feeding conveyor 5 is driven again to feed the wire 6 while measuring its length, and grip the wire 6. The wire is gripped by the gripping claws 9a of the device 9, and the wire is cut by the sheathing cutting and stripping blade 8, and the sheathing from both ends of the cut portion is peeled off. The wire rod 6 on the wire rod supply reel 4 side is terminal crimped in the same manner as described above, and the cut wire 6' gripped by the gripper 9 is inserted into the window 11a of the flux coating device 11 by intermittent rotation of the gripper 9.
Flux is applied to the stripped end.

The gripper 9 moves backward, and after a certain period of time, flux application is completed, the gripper 9 moves forward, the cut wire 6' is removed from the flux application device, and the gripper 9 is removed.
rotates by a predetermined angle in the direction of arrow C and stops in front of the soldering tank 12 (see FIG. 3).

The cylinder 21 immediately before this is shortened, and the arm 20,
The arm 19 swings, and the container 16 at the tip of the arm 19 draws up the solder liquid from the molten solder liquid and swings upward. The pumped solder liquid is placed in container 1.
At this time, when the gripper 9 moves backward, the stripped end of the cut wire 6' enters the solder tank 12 through the opening window 12a, and is fed into the flowing solder liquid and soldered. (See Figure 2).

At this time, the cut wire 6' held by the next holding claw 9a is coated with flux in the flux coating device 11.

After a certain period of time has elapsed, the gripper 9 moves forward, disengages the cut wire 6' from the soldering tank 12 and the flux applicator 11, and rotates through a predetermined angle in the direction of arrow C, whereupon it is gripped by the next gripping claw 9a. The cut electric wire 6' stops at the front of the soldering bath 12, and the next cut electric wire 6' gripped by the next gripping claw 9a stops at the front of the flux coating device 11.

During this time, when the cylinder 21 is extended, the arm 1
9 and 20 swing and the container 1 is fixed to the tip thereof.
6 swings into the solder liquid. At this time, the tilting rod 22 swings together with the arm 19, so that the tilting rod 22
The engagement position between the elongated hole arm 13 and the elongated hole arm 13 moves rearward, and the elongated hole arm 13 swings in the horizontal direction to clean the liquid surface.

When the cylinder 21 is retracted, the arm 20 and the arm 19 swing, and the container 16 at the tip of the arm 19 is moved.
pumps up clear molten solder liquid from the molten solder liquid and swings upward. The pumped up solder liquid flows down from the slit 16a of the container 16.

When the gripper 9 moves backward, each cut wire is soldered and fluxed in the same manner as described above.

Similarly to the above, after a certain period of time has elapsed, when the gripper 9 moves forward and then rotates by a predetermined angle in the direction of arrow c, the gripping claws 9a of the previously soldered cut wire 6' are opened, and the cut wire 6' is placed in the wire receiving tray. Fall to 25.

The soldering of the cut wires 6' is sequentially performed by the same process.

(Effects of the invention) As described above, the present invention has a simple structure and operates intermittently to pump up the molten solder liquid, resulting in low operating costs, as well as improved durability as the bearings and shafts do not wear out. Each time the liquid is pumped up, the liquid surface cleaning plate is oscillated by the same power to remove the oxide film on the liquid surface and to draw up the molten solder liquid and allow it to flow down, making it possible to use a clear solder liquid.

[Brief explanation of the drawing]

The drawings all show an embodiment of the present invention, with Fig. 1 being a perspective view, Fig. 2 being a sectional view taken from - in Fig. 1, and Fig. 3 being a sectional view similar to Fig. 2 showing the operation. ,
FIG. 4 is a sectional view taken from - in FIG. 2, and FIG. 5 is a sectional view taken from - in FIG. 3B. 6...Wire rod, 11...Flux coating device, 1
2... Soldering tank, 13... Arm with long hole, 15...
...Liquid level cleaning plate, 16... Container, 22... Inclined rod.

Claims (1)

[Scope of utility model registration request] A liquid level cleaning plate is fixed to the tip of an arm with a long hole that is pivoted on a vertical axis at the rear of the solder liquid tank so that the liquid level swings, and a container with a slit in the bottom is placed horizontally at the rear of the solder liquid tank. A mechanism for swinging the arm of the container is provided, in which a tilted rod is fixed to the tip of an arm that swings up and down about a shaft and that engages with a long hole in the arm of the liquid level cleaning plate, and is fixed to the arm of the container. The container swings from the solder solution into the air, causing the solder solution to flow down from the slit in the container, and at the same time, the liquid surface cleaning plate swings the liquid surface to remove the oxide film of the solder, and the solder solution flows down below the container slit. A sheathed wire soldering machine that moves the sheathed part of the sheathed wire into the solder liquid and holds it there for a predetermined period of time.