JPH0134530B2 - - Google Patents
Info
- Publication number
- JPH0134530B2 JPH0134530B2 JP13801885A JP13801885A JPH0134530B2 JP H0134530 B2 JPH0134530 B2 JP H0134530B2 JP 13801885 A JP13801885 A JP 13801885A JP 13801885 A JP13801885 A JP 13801885A JP H0134530 B2 JPH0134530 B2 JP H0134530B2
- Authority
- JP
- Japan
- Prior art keywords
- unsaturated
- epoxy resin
- present
- cresol
- unsaturated alkyd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920000180 alkyd Polymers 0.000 claims description 16
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- 239000007795 chemical reaction product Substances 0.000 claims description 7
- 125000003700 epoxy group Chemical group 0.000 claims description 7
- 150000007519 polyprotic acids Polymers 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 5
- 229930003836 cresol Natural products 0.000 claims description 5
- 150000008064 anhydrides Chemical class 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 229920006337 unsaturated polyester resin Polymers 0.000 description 6
- 238000009835 boiling Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229930185605 Bisphenol Natural products 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- 239000001530 fumaric acid Substances 0.000 description 4
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000032050 esterification Effects 0.000 description 3
- 238000005886 esterification reaction Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920001567 vinyl ester resin Polymers 0.000 description 3
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000002329 infrared spectrum Methods 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229940100630 metacresol Drugs 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- ZDNFTNPFYCKVTB-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,4-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C=C1 ZDNFTNPFYCKVTB-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- -1 methylene-bisphenyl glycidyl Chemical group 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polyesters Or Polycarbonates (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、塗料、接着剤、成型材、FRPなど
各種用途に有用な新規構造を有するラジカル硬化
可能な不飽和アルキツドおよびその製造法に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a radically curable unsaturated alkyd having a novel structure useful for various uses such as paints, adhesives, molding materials, and FRP, and a method for producing the same.
現在、常温で硬化可能なラジカル硬化型の樹脂
としては、不飽和ポリエステル樹脂およびビニル
エステル樹脂が広く用いられている。
Currently, unsaturated polyester resins and vinyl ester resins are widely used as radical-curable resins that can be cured at room temperature.
しかし、樹脂の用途が多岐にわたるようになる
につれて、樹脂に要求される性能も細かく且つ高
度なものになり、既存の樹脂ではその対応に不十
分さを感じるようになることも少くない。例え
ば、FRPの着色、表面保護層として一般的なゲ
ルコートの場合、コストの上昇を伴わずに耐水
性、耐アルカリ性および特定薬品に対する耐食性
をレベルアツプしようとする動きが存在する。 However, as the uses of resins become more diverse, the performance required of the resins becomes more detailed and sophisticated, and it is often felt that existing resins are insufficient to meet these requirements. For example, in the case of gel coat, which is commonly used as a coloring and surface protection layer for FRP, there is a movement to improve water resistance, alkali resistance, and corrosion resistance against specific chemicals without increasing costs.
ビニルエステル樹脂は、極めて優れた耐水、耐
薬品性を有しているため当然この用途も考えられ
るわけであるし、事実耐煮沸性そのものは極めて
良好であるのでゲルコートとして一般に用いられ
ている。しかし、ゲルコートに要求される作業
性、即ちスプレー適性、チクソトロピー付与性、
色分れしないことなどの諸点に於て更に一層の向
上が求められており、その期待に沿つて改良の努
力は続けられているものの現段階では望ましい結
果を得ていない。 Vinyl ester resins have extremely excellent water and chemical resistance, so naturally they can be used for this purpose, and in fact, their boiling resistance itself is extremely good, so they are generally used as gel coats. However, the workability required for gel coats, namely sprayability, thixotropy imparting properties,
There is a need for further improvement in various aspects such as the absence of color separation, and although efforts are being made to improve in line with these expectations, desired results have not been obtained at this stage.
他方、不飽和ポリエステル樹脂については、下
式で示されるビスフエノール型ポリエステルの
スチレン溶液が作業性の良好な点を買われて浴槽
用ゲルコートの主流を形成している。しかし、そ
の耐熱水性がビニルエステル樹脂より劣り、高度
の要求を満足させないという欠陥ある。 On the other hand, for unsaturated polyester resin, the bisphenol type polyester shown by the following formula Styrene solutions have become the mainstream gel coat for bathtubs because of their good workability. However, it has the drawback that its hot water resistance is inferior to that of vinyl ester resins, and it does not meet high demands.
本発明者らは、これら既存樹脂の諸欠点を改良
すべく鋭意研究した結果、下記の一般式で表わさ
れる新規な構造をもつ不飽和アルキツドが耐水、
耐薬品性において既存のこれら樹脂と少くとも同
等又はそれ以上の性質をもち、作業性の点でも優
れていることを見出し、本発明を完成するに至つ
た。
As a result of intensive research to improve the various drawbacks of these existing resins, the present inventors discovered that an unsaturated alkyd with a new structure represented by the general formula below has excellent water resistance and
The present inventors have discovered that this resin has chemical resistance that is at least equal to or better than these existing resins, and is also superior in terms of workability, leading to the completion of the present invention.
即ち、本発明は一般式
〔但し、R1およびR2はそれぞれ水素またはメチ
ル基を表わし、nは0乃至2であり、mは2〜20
の整数である〕
で表わされる硬化可能な不飽和アルキツドを提供
するにある。
That is, the present invention is based on the general formula [However, R 1 and R 2 each represent hydrogen or a methyl group, n is 0 to 2, and m is 2 to 20
The present invention provides a curable unsaturated alkyd having the following integer:
更に、本発明は一般式
で表わされるエポキシ樹脂に対し、
該エポキシ樹脂中のエポキシ基が消滅する量の
クレゾールを反応させて反応生成物〔〕
を生成させた後、該反応生成物〔〕の中の水酸
基をα−β不飽和多塩基酸またはその無水物でエ
ステル化することを特徴とする、一般式
で表わされる硬化可能な不飽和アルキツドの製造
法を提供するにある〔但し、R1、R2、nおよび
mは前記に同じ〕。 Furthermore, the present invention relates to the general formula The epoxy resin represented by is reacted with cresol in an amount that eliminates the epoxy groups in the epoxy resin to form a reaction product [] is produced, and then the hydroxyl group in the reaction product [] is esterified with an α-β unsaturated polybasic acid or its anhydride. The object of the present invention is to provide a method for producing a curable unsaturated alkyd represented by the formula (where R 1 , R 2 , n and m are the same as above).
本発明の不飽和アルキツドは、前記一般式で表
わされる新規な構造であり、側鎖にメチルフエノ
オキシメチレン基を有しているため嵩高であり、
また分子量当りの二重結合が少くなり、そのため
に樹脂の耐煮沸性及び熱変形温度に良好な影響を
与えるものと推定される。また、本発明の不飽和
アルキツドの主鎖はビスフエノールジグリシジル
エーテルとα−β不飽和多塩基酸とがエステル結
合している繰り返し単位から成つているため、ビ
スフエノール型ポリエステルと同じく、スチレン
溶液として使用したときの作業性に優れたものに
なるものと考えられる。繰返し単位は2〜20であ
り(分子量に換算すると約千乃至一万程度に相当
する)、繰返し単位が2より小さい場合は樹脂の
硬化性が悪るく20より大きいときには本発明の実
施が困難となる。
The unsaturated alkyd of the present invention has a novel structure represented by the above general formula, and has a methylphenooxymethylene group in the side chain, so it is bulky.
Furthermore, the number of double bonds per molecular weight decreases, which is presumed to have a favorable effect on the boiling resistance and heat distortion temperature of the resin. In addition, since the main chain of the unsaturated alkyd of the present invention is composed of repeating units in which bisphenol diglycidyl ether and α-β unsaturated polybasic acid are ester-bonded, it can be dissolved in styrene solution like bisphenol type polyester. It is thought that this product will have excellent workability when used as a tool. The number of repeating units is 2 to 20 (equivalent to about 1,000 to 10,000 when converted to molecular weight); if the number of repeating units is smaller than 2, the curing properties of the resin are poor, and if it is larger than 20, it is difficult to implement the present invention. becomes.
本発明による不飽和アルキツドは、分子内の不
飽和結合と共重合可能な重合性単量体(以下モノ
マーと略称)に溶解し、ラジカル触媒の存在下で
硬化させることにより、塗料、接着剤、成型剤、
FPRなど各種の用途に供することが出来るもの
となる。 The unsaturated alkyd according to the present invention can be used in paints, adhesives, molding agent,
It can be used for various purposes such as FPR.
本発明の不飽和アルキツドを合成する方法とし
ては、ビスフエノールジグリシジルエーテル型の
エポキシ樹脂にクレゾールを反応させ、次いで反
応生成物〔〕中の水酸基をα−β不飽和多塩基
酸またはその無水物でエステル化する方法が挙げ
られる。その流れを代表例にて下記に示す。 The method for synthesizing the unsaturated alkyd of the present invention involves reacting a bisphenol diglycidyl ether type epoxy resin with cresol, and then converting the hydroxyl group in the reaction product into an α-β unsaturated polybasic acid or its anhydride. An example of this method is esterification. The flow is shown below using a typical example.
本発明で使用されるエポキシ樹脂は、いわゆる
ビスフエノール型と通称されるフエニルグリシジ
ルエーテル型のものである。 The epoxy resin used in the present invention is of the phenyl glycidyl ether type, commonly referred to as the so-called bisphenol type.
例えばビスフエノールAとエプクロロヒドリン
とから合成される次の一般式で示されるタイプ、
nは0から2位の範囲が良く、繰返し単位を多く
する必要はない。 For example, the type shown by the following general formula synthesized from bisphenol A and epchlorohydrin, It is preferable that n be in the range of 0 to 2, and there is no need to increase the number of repeating units.
また、ビスフエノールF型エポキシ樹脂と通称
されるメチレン−ビスフエニルグリシジルエーテ
ル型のエポキシ樹脂も同様に用いることが出来
る。 Furthermore, a methylene-bisphenyl glycidyl ether type epoxy resin commonly referred to as a bisphenol F type epoxy resin can also be used.
エポキシ樹脂と反応させるクレゾールとしては
オルトクレゾール、メタクレゾール及びパラクレ
ゾールがあげられる。 Examples of the cresol to be reacted with the epoxy resin include ortho-cresol, meta-cresol, and para-cresol.
本発明においてはこれらの混合物でも好適に利
用することができる。 In the present invention, mixtures of these can also be suitably used.
エポキシ樹脂とクレゾールとの反応比率は、エ
ポキシ基1当量に対して、フエノール性水酸基1
当量以下0.5当量以上が適当である。 The reaction ratio of epoxy resin and cresol is 1 equivalent of epoxy group to 1 equivalent of phenolic hydroxyl group.
A suitable amount is 0.5 equivalent or less.
0.5当量より少量では、不飽和多塩基酸又はそ
の酸無水物とエステル化する際にゲル化し易いの
で好ましくない。 If it is less than 0.5 equivalent, it is not preferable because it tends to gel when esterified with an unsaturated polybasic acid or its acid anhydride.
反応の際に、1般にエポキシ樹脂の硬化促進剤
として用いられている3級アミン類、例えばベン
ジルジメチルアミン、トリス(ジメチルアミノ)
フエノール、或は第4級アンモニウム塩等を用い
ることは反応を促進する意味からは頗る有数であ
る。 During the reaction, tertiary amines that are generally used as curing accelerators for epoxy resins, such as benzyldimethylamine and tris(dimethylamino), are used.
The use of phenol, quaternary ammonium salt, etc. is highly effective in promoting the reaction.
本発明で使用されるα−β不飽和多塩基酸又は
その酸無水物の例には、無水マレイン酸、マレイ
ン酸、フマル酸があげられる。その際少量の飽和
多塩基酸で変性することも出来る。 Examples of the α-β unsaturated polybasic acid or its acid anhydride used in the present invention include maleic anhydride, maleic acid, and fumaric acid. At that time, it can also be modified with a small amount of saturated polybasic acid.
エステル化は通常の方法、即ち不活性気流中で
180〜220℃程度の温度下で行われる。 Esterification is carried out in the usual manner, i.e. in an inert gas stream.
It is carried out at a temperature of about 180 to 220 degrees Celsius.
エステル化により得られた不飽和アルキツド
は、スチレン、ビニルトルエン、ジアリルフタレ
ート、ジアリルテレフタレート、メタクリル酸エ
ステル類等といつた共重合可能なモノマー類に溶
解し、各種用途に提供することが出来る。 The unsaturated alkyd obtained by esterification can be dissolved in copolymerizable monomers such as styrene, vinyltoluene, diallyl phthalate, diallyl terephthalate, methacrylic acid esters, etc., and can be provided for various uses.
この際、ゲル化を防止するために、通常用いら
れている多価フエノール類、キノン類などの重合
防止剤を少量(0.01〜0.5phr)添加しておく必要
がある。 At this time, in order to prevent gelation, it is necessary to add a small amount (0.01 to 0.5 phr) of commonly used polymerization inhibitors such as polyhydric phenols and quinones.
用途の必要に応じて、充てん剤、補強材、着色
剤、離型剤、ポリマー等を併用できることは勿論
である。 It goes without saying that fillers, reinforcing materials, colorants, mold release agents, polymers, etc. can be used in combination, depending on the needs of the application.
次に本発明の理解を助けるために、以下に実施
例を示す。実施例において部は重量部を示す。
Next, examples will be shown below to help understand the present invention. In the examples, parts indicate parts by weight.
実施例 1
撹拌機、分溜コンデンサー、温度計、ガス導入
管を付した1セパラブルフラスコに、エポキシ
樹脂として、油化シエル社のエピコート827を370
g、パラクレゾール195g(エポキシ基とフエノ
ール性水酸基の比率は1対0.9)、ベンジルジメチ
ルアミン1.5gを仕込み、加熱すると、110℃を越
えた段階で急速に発熱するので冷却し、160℃以
上になることを防止した。Example 1 Into a separable flask equipped with a stirrer, a fractionating condenser, a thermometer, and a gas inlet tube, 370% of Epicoat 827 from Yuka Ciel Co., Ltd. was added as an epoxy resin.
g, para-cresol 195g (ratio of epoxy group to phenolic hydroxyl group is 1:0.9), and benzyldimethylamine 1.5g, and when heated, it rapidly generates heat when the temperature exceeds 110℃, so cool it and raise it to 160℃ or higher. I prevented it from happening.
次で150〜160℃で5時間反応すると、赤外分析
の結果、遊離のエポキシ基は完全に消失したこと
が認められた(第1図参照)。 The reaction was then carried out at 150-160°C for 5 hours, and as a result of infrared analysis, it was confirmed that the free epoxy groups had completely disappeared (see Figure 1).
次でフマル酸110gを加え、不活性気流中200〜
210℃に6時間加熱すると、酸価は19.6となつた
ので、ハイドロキノン0.13g加え、金属バツト中
に注入、固化させた。黄褐色、融点約110〜115℃
の不飽和アルキツドAが得られた。その赤外吸収
スペクトルを第2図に示す。平均分子量は約3200
であつた。 Next, add 110 g of fumaric acid and add 200 g of fumaric acid to
After heating to 210°C for 6 hours, the acid value became 19.6, so 0.13g of hydroquinone was added and poured into a metal vat to solidify. Yellowish brown, melting point approximately 110-115℃
of unsaturated alkyd A was obtained. The infrared absorption spectrum is shown in FIG. Average molecular weight is approximately 3200
It was hot.
不飽和アルキツドA100部を粉砕し、それにス
チレン100部加え、60〜70℃に加温撹拌して不飽
和ポリエステル樹脂Bが、ガードナー色数2〜
3、粘度9.6ポイズで得られた。 Grind 100 parts of unsaturated alkyd A, add 100 parts of styrene to it, and heat and stir at 60 to 70°C to obtain unsaturated polyester resin B with a Gardner color number of 2 to 2.
3. Obtained with a viscosity of 9.6 poise.
不飽和ポリエステル樹脂B100部に、メチルエ
チルケトンパーオキシド2部、ナフテン酸コバル
ト2部加えた系は、49分でゲル化し、ゆるやかに
発熱しながら最高温度139℃に達した。注型品の
熱変形温度は108℃であつた。 A system in which 2 parts of methyl ethyl ketone peroxide and 2 parts of cobalt naphthenate were added to 100 parts of unsaturated polyester resin B gelled in 49 minutes and reached a maximum temperature of 139° C. while slowly generating heat. The heat distortion temperature of the cast product was 108°C.
5cm×5cm、厚さ3mmの注型板について連続煮
沸テストを行つた結果では、2000時間煮沸後も外
観異常が認められず、頗る優れた耐水性を示し
た。 A continuous boiling test was conducted on a casting plate measuring 5 cm x 5 cm and 3 mm thick, and no abnormality was observed in the appearance even after 2000 hours of boiling, indicating excellent water resistance.
また10%苛性ソーダ水溶液による連続煮沸テス
トでも500時間迄異常がなく、同様に極めて良好
な耐アルカリ性を示した。 In addition, there were no abnormalities in a continuous boiling test with a 10% caustic soda aqueous solution for up to 500 hours, and it also showed extremely good alkali resistance.
実施例 2
撹拌機、分溜コンデンサー、ガス導入管、温度
計を付した1セパラブルフラスコに、ビスフエ
ノールF型エポキシ樹脂として、油化シエル社の
エピコート807を340g、メタクレゾール173g
(エポキシ基とフエノール性水酸基の比率は1対
0.8)、トリメチルベンジルアンモニウムクロライ
ド1.5gを仕込み、加熱すると110℃をすぎる当り
から急速に発熱を開始するので、冷却して160℃
以下に保つた。150〜160℃に5時間保持すると、
赤外分析の結果、遊離のエポキシ基は完全に消失
した。Example 2 In a separable flask equipped with a stirrer, a fractionating condenser, a gas inlet tube, and a thermometer, 340 g of Epicote 807 from Yuka Ciel Co., Ltd. and 173 g of metacresol were added as bisphenol F-type epoxy resin.
(The ratio of epoxy groups and phenolic hydroxyl groups is 1:1.
0.8) When 1.5g of trimethylbenzylammonium chloride is charged and heated, it starts to generate heat rapidly after reaching 110℃, so it is cooled to 160℃.
I kept it below. When kept at 150-160℃ for 5 hours,
As a result of infrared analysis, free epoxy groups completely disappeared.
次で無水マレイン酸98gを加え、200〜215℃、
不活性気流中で6時間エステル化すると、酸価は
11.4となつたので、ハイドロキノン0.1gを加え、
金属製バツトに注入、固化させた。 Next, add 98g of maleic anhydride and heat at 200-215℃.
When esterified for 6 hours in an inert gas stream, the acid value is
11.4, so add 0.1g of hydroquinone,
It was poured into a metal vat and allowed to solidify.
黄褐色、融点約105〜110℃の不飽和アルキツド
Cが得られた。平均分子量約4500であつた。 An unsaturated alkyd C was obtained which was yellowish brown in color and had a melting point of about 105-110°C. The average molecular weight was approximately 4,500.
不飽和アルキツドC100部を粉砕し、p−メチ
ルスチレン110部に、60〜70℃に加温、溶解して
得られる不飽和ポリエステル樹脂Dは、ハーゼン
色数500、粘度9.5ポイズであつた。 Unsaturated polyester resin D obtained by pulverizing 100 parts of unsaturated alkyd C and dissolving it in 110 parts of p-methylstyrene while heating at 60 to 70 DEG C. had a Hazen color number of 500 and a viscosity of 9.5 poise.
不飽和ポリエステル樹脂D100部に、メチルエ
チルケトンパーオキシド2部、ナフテン酸コバル
ト1部、ジメチルアニリン0.2部を加えた系は、
室温で約40分でゲル化後ゆるやかに発熱し、最高
発熱温度は149℃に達した。 A system in which 2 parts of methyl ethyl ketone peroxide, 1 part of cobalt naphthenate, and 0.2 parts of dimethylaniline are added to 100 parts of unsaturated polyester resin D is as follows:
After gelation at room temperature for about 40 minutes, it slowly generated heat, reaching a maximum exothermic temperature of 149°C.
注型品の熱変形温度は104℃であつた。 The heat distortion temperature of the cast product was 104°C.
第1図は、実施例1で得られたエポキシ樹脂と
パラクレゾールとの反応生成物の赤外線スペクト
ルを示す。
第2図は、上記反応生成物とフマル酸との反応
によつて得られた本発明の不飽和アルキツドの赤
外線スペクトルを示す。
FIG. 1 shows an infrared spectrum of the reaction product of the epoxy resin obtained in Example 1 and p-cresol. FIG. 2 shows an infrared spectrum of the unsaturated alkyd of the present invention obtained by the reaction of the above reaction product with fumaric acid.
Claims (1)
不飽和アルキツド 〔但し、R1およびR2はそれぞれ水素またはメチ
ル基を表わし、nは0乃至2であり、mは2〜20
の整数である〕。 で表わされるエポキシ樹脂に対し、 該エポキシ樹脂中のエポキシ基が消滅する量の
クレゾールを反応させて反応生成物〔〕 を生成させた後、該反応生成物〔〕の中の水酸
基をα−β不飽和多塩基酸またはその無水物でエ
ステル化することを特徴とする、一般式 で表わされる硬化可能な不飽和アルキツドの製造
法 〔但し、R1、R2、nおよびmは前記に同じ〕。[Claims] 1. A curable unsaturated alkyd substantially represented by the following general formula: [However, R 1 and R 2 each represent hydrogen or a methyl group, n is 0 to 2, and m is 2 to 20
]. The epoxy resin represented by is reacted with cresol in an amount that eliminates the epoxy groups in the epoxy resin to form a reaction product [] is produced, and then the hydroxyl group in the reaction product [] is esterified with an α-β unsaturated polybasic acid or its anhydride. A method for producing a curable unsaturated alkyd represented by (where R 1 , R 2 , n and m are the same as above).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13801885A JPS62524A (en) | 1985-06-26 | 1985-06-26 | Curable unsaturated alkyd and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13801885A JPS62524A (en) | 1985-06-26 | 1985-06-26 | Curable unsaturated alkyd and its production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62524A JPS62524A (en) | 1987-01-06 |
| JPH0134530B2 true JPH0134530B2 (en) | 1989-07-19 |
Family
ID=15212131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13801885A Granted JPS62524A (en) | 1985-06-26 | 1985-06-26 | Curable unsaturated alkyd and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62524A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6542824B2 (en) | 2017-03-13 | 2019-07-10 | ファナック株式会社 | Image processing apparatus and image processing method for calculating likelihood of image of object detected from input image |
-
1985
- 1985-06-26 JP JP13801885A patent/JPS62524A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62524A (en) | 1987-01-06 |
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