JPH0140666Y2 - - Google Patents
Info
- Publication number
- JPH0140666Y2 JPH0140666Y2 JP20483583U JP20483583U JPH0140666Y2 JP H0140666 Y2 JPH0140666 Y2 JP H0140666Y2 JP 20483583 U JP20483583 U JP 20483583U JP 20483583 U JP20483583 U JP 20483583U JP H0140666 Y2 JPH0140666 Y2 JP H0140666Y2
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- plate
- thermoplastic synthetic
- bodies
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 28
- 239000000057 synthetic resin Substances 0.000 claims description 28
- 229920001169 thermoplastic Polymers 0.000 claims description 19
- 239000004416 thermosoftening plastic Substances 0.000 claims description 19
- 239000011231 conductive filler Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 6
- 230000000379 polymerizing effect Effects 0.000 claims description 3
- 239000000945 filler Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 4
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
本考案は主として電磁波遮蔽性のハウジング等
に適用せられる板状体の接合構造に関するもので
ある。
この種の板状体としては電磁波遮蔽層を構成す
る導電性充填材を混合した熱可塑性合成樹脂層
と、該熱可塑性合成樹脂層を被覆保護する導電性
充填材を含まない熱可塑性合成樹脂層とからなる
二層構造を有するものが提供されている。
従来、このような板状体の一対を接合するには
第１図に示すように熱可塑性合成樹脂層１と、導
電性熱可塑性合成樹脂層２とからなる一対の板状
体１０，１０の端部相互を重合して接着剤等によ
つて接着する構成が提供されている。しかしこの
ような構成では板状体１０，１０接合部において
一方の板状体１０の熱可塑性合成樹脂層１に相当
する巾だけ電磁波遮蔽性に隙間を生じ電磁波は該
隙間を介して矢印に示すように外界に漏洩する。
本考案は上記従来の欠点を改良して板状体の接
合部からの電磁波の漏洩を防止することを目的と
し、熱可塑性合成樹脂層と、導電性充填材を混合
した熱可塑性合成樹脂層とからなる二層構造を有
する一対の板状体の端部相互を重合することによ
つて接合し、該接合部に導電体を挿入せしめて該
一対の板状体の導電性充填材を混合した熱可塑性
合成樹脂層相互を導通したことを骨子とするもの
である。
本考案は上記骨子により、板状体の接合部に挿
入した導電体によつて板状体の導電性充填材を混
合した熱可塑性合成樹脂層相互が導通するから、
接合部における一方の板状体の熱可塑性合成樹脂
層に相当する巾だけの電磁波遮蔽性の隙間は該隙
間に存在する該導電体によつて電磁的に遮蔽さ
れ、該隙間から電磁波が外界へ漏洩することが防
止されるのである。
本考案を第２図以下に示す実施例によつて説明
すれば、第２図において板状体１０は導電性充填
材を含まない熱可塑性合成樹脂層１と、導電性充
填材を混合した熱可塑性合成樹脂層２とからなる
二層構造を有し、一対の板状体１０は端部相互を
重合することによつて接合し、鉄等の導電性材料
からなるビス４を該接合部３に貫通させることに
よつて該接合部３は接着剤を用いたり融着させた
りすることなくして固定される。第３図において
は同様な二層構造の板状体１０の一対が同様に接
合されるが、ビス４にかえてボルト１４Ａ、ナツ
ト１４Ｂによつて接合部３が固定され、また一方
の板状体１０は接合部３付近から外方へ彎曲せら
れている。第４図においては同様な二層構造の板
状体１０の一方の熱可塑性合成樹脂層１を端部に
おいて切欠き、該切欠き部に他方の板状体１０の
端部を嵌合することにより接合されるが、該接合
部３には金属棒２４が挿入されている。本実施例
では一対の板状体１０，１０の熱可塑性合成樹脂
層２，２相互が当接しているから電磁波遮蔽性は
該構成自体で発現されるのであるが金属棒２４の
挿入により一層電磁波遮蔽性が強化される。第５
図においては同様な二層構造の板状体１０の一対
が同様に接合されるが、金属棒２４にかえて導電
性材料からなるビス３４が貫通され、また一方の
板状体１０は接合部３付近から外方へ彎曲せられ
ている。
本考案に用いる熱可塑性合成樹脂層を例示すれ
ばポリ塩化ビニル、ポリアミドABSポリスチレ
ン、ポリフエニレンオキサイド、ポリプロピレ
ン、ポリエチレン、ポリカーボネートなどであ
る。望ましくは射出成形に適する点、導電性充填
材の混入に適する点、熱可塑性合成樹脂層１側に
使用する熱可塑性合成樹脂（以下合成樹脂Ａとす
る）と、熱可塑性合成樹脂層２側に使用する導電
性充填材を混合した熱可塑性合成樹脂（以下合成
樹脂Ｂとする）との相溶性が良い点などから合成
樹脂Ｂと、合成樹脂Ａは、例えば以下の組み合わ
せが望ましい。ポリスチレン−ポリスチレン・ポ
リフエニレンオキサイド、ABS−ABS・ポリカ
ーボネート・ポリ塩化ビニル、ポリアミド−ポリ
アミド、ポリカーボネート−ABS・ポリカーボ
ネート、ポリプロピレン−ポリエチレン・ポリプ
ロピレン、ポリフエニレンオキサイド−ポリプロ
ピレン・ポリスチレン、ポリ塩化ビニル−
ABS・ポリメチルメタクリレート・ポリ塩化ビ
ニル。
本考案に用いる導電性充填材（以下単に充填材
と言う）とは例えば黄銅、真ちゆう、銀、銅、ニ
ツケル、ステンレス等の金属あるいは炭素等の導
電性物質の粉末状、繊維状、リボン状、フレーク
状等の形状を有する微小体、あるいは上記金属を
コートしたガラス、プラスチツク、セラミツク等
の微小体から適宜選択して用いることができる。
前記合成樹脂Ｂに添加される充填材は一種だけで
もよいしまた数種適当に混合して使用してもよ
い。また合成樹脂Ｂに添加する充填材の添加量
は、合成樹脂Ｂの種類または充填材の種類および
その組み合わせによつて異なるが、用途に応じて
適宜選定することができる。しかし、流れ性、混
和性の点から充填材の望ましい形状は厚みが
0.1m／ｍ以下で大きな面の面積が４mm2以下のフ
レークか、径が10〜100μmで長さが１〜4m／ｍ
の微小繊維が望ましい。更に合成樹脂Ｂと充填材
の比率は電磁波遮蔽性と流れ性からみて、充填材
の容積比率として10〜25％にすべきである。
第１表に代表的な配合例を示す。
The present invention mainly relates to a joining structure of plate-like bodies that is applied to electromagnetic shielding housings and the like. This type of plate-shaped body includes a thermoplastic synthetic resin layer mixed with a conductive filler that constitutes an electromagnetic wave shielding layer, and a thermoplastic synthetic resin layer that does not contain a conductive filler that covers and protects the thermoplastic synthetic resin layer. A structure having a two-layer structure consisting of the following is provided. Conventionally, in order to join a pair of such plate-like bodies, as shown in FIG. A configuration is provided in which the ends are overlapped and bonded with adhesive or the like. However, in such a configuration, a gap is created in the electromagnetic wave shielding property by a width corresponding to the thermoplastic synthetic resin layer 1 of one of the plate bodies 10 at the joint between the plate bodies 10 and 10, and the electromagnetic waves pass through the gap as shown by the arrow. It leaks to the outside world. The present invention aims to improve the above-mentioned conventional drawbacks and prevent leakage of electromagnetic waves from the joints of plate-like bodies. The ends of a pair of plate-like bodies having a two-layer structure were joined by polymerizing each other, and a conductive material was inserted into the joint, and the conductive filler of the pair of plate-like bodies was mixed. The main idea is that the thermoplastic synthetic resin layers are electrically connected to each other. The present invention is based on the above-mentioned outline, since the thermoplastic synthetic resin layers mixed with the conductive filler of the plate-shaped body are electrically connected to each other by the conductor inserted into the joint of the plate-shaped body.
An electromagnetic wave-shielding gap with a width corresponding to the thermoplastic synthetic resin layer of one of the plate-shaped bodies at the joint is electromagnetically shielded by the conductor existing in the gap, and electromagnetic waves are transmitted from the gap to the outside world. This prevents leakage. The present invention will be explained with reference to the embodiment shown in FIG. 2 and below. In FIG. It has a two-layer structure consisting of a plastic synthetic resin layer 2, and the pair of plate-shaped bodies 10 are joined by polymerizing their ends, and a screw 4 made of a conductive material such as iron is attached to the joint 3. By penetrating the joint 3, the joint 3 is fixed without using adhesive or fusing. In FIG. 3, a pair of plate-shaped bodies 10 having a similar two-layer structure are joined in the same way, but the joint part 3 is fixed by bolts 14A and nuts 14B instead of screws 4, and one of the plate-shaped bodies The body 10 is curved outward from the vicinity of the joint 3. In FIG. 4, one thermoplastic synthetic resin layer 1 of a plate-like body 10 having a similar two-layer structure is cut out at an end, and the end of the other plate-like body 10 is fitted into the cutout. A metal rod 24 is inserted into the joint portion 3. In this embodiment, since the thermoplastic synthetic resin layers 2, 2 of the pair of plate-shaped bodies 10, 10 are in contact with each other, the electromagnetic wave shielding property is achieved by the structure itself, but the insertion of the metal rod 24 further enhances the electromagnetic wave shielding property. Shielding properties are strengthened. Fifth
In the figure, a pair of plate-like bodies 10 having a similar two-layer structure are joined in the same way, but instead of the metal rod 24, a screw 34 made of a conductive material is penetrated, and one plate-like body 10 is connected at the joint. It curves outward from around 3. Examples of the thermoplastic synthetic resin layer used in the present invention include polyvinyl chloride, polyamide ABS polystyrene, polyphenylene oxide, polypropylene, polyethylene, and polycarbonate. Desirably, the thermoplastic synthetic resin (hereinafter referred to as synthetic resin A) used on the thermoplastic synthetic resin layer 1 side and the thermoplastic synthetic resin layer 2 side are suitable for injection molding, suitable for mixing conductive fillers, and are suitable for injection molding. For example, the following combinations of synthetic resin B and synthetic resin A are desirable because of their good compatibility with the thermoplastic synthetic resin mixed with the conductive filler used (hereinafter referred to as synthetic resin B). Polystyrene-polystyrene/polyphenylene oxide, ABS-ABS/polycarbonate/polyvinyl chloride, polyamide-polyamide, polycarbonate-ABS/polycarbonate, polypropylene-polyethylene/polypropylene, polyphenylene oxide-polypropylene/polystyrene, polyvinyl chloride-
ABS, polymethyl methacrylate, polyvinyl chloride. The conductive filler (hereinafter simply referred to as filler) used in the present invention is, for example, a metal such as brass, brass, silver, copper, nickel, or stainless steel, or a powder, fiber, or ribbon of a conductive substance such as carbon. The material can be appropriately selected from microscopic objects having shapes such as cylindrical or flake-like, or microscopic objects coated with the above-mentioned metals such as glass, plastic, and ceramic.
Only one type of filler may be added to the synthetic resin B, or a mixture of several types may be used. Further, the amount of the filler added to the synthetic resin B varies depending on the type of the synthetic resin B, the type of filler, and the combination thereof, and can be appropriately selected depending on the application. However, from the viewpoint of flowability and miscibility, the desired shape of the filler is thick.
Flakes of 0.1m/m or less with a large surface area of 4mm2 or less, or 10-100μm in diameter and 1-4m/m in length
fine fibers are desirable. Further, the ratio of the synthetic resin B to the filler should be 10 to 25% as a volume ratio of the filler in terms of electromagnetic wave shielding properties and flowability. Table 1 shows typical formulation examples.
【表】
本考案の二層構造は、いわゆる２色射出成形機
のような射出ユニツトを２基備えた公知の装置に
よつて製造することが出来る。[Table] The two-layer structure of the present invention can be manufactured using a known device equipped with two injection units, such as a so-called two-color injection molding machine.
第１図は従来例の部分側断面図、第２図は本考
案の一実施例の部分側断面図、第３図は他の実施
例の部分側断面図、第４図は更に他の実施例の部
分側断面図、第５図は更に他の実施例の部分側断
面図である。
図中、１……熱可塑性合成樹脂層、２……導電
性充填材を混合した熱可塑性合成樹脂層、３……
接合部、４，３４……ビス、１４Ａ……ボルト、
１４Ｂ……ナツト、２４……金属棒。
FIG. 1 is a partial side sectional view of a conventional example, FIG. 2 is a partial side sectional view of one embodiment of the present invention, FIG. 3 is a partial side sectional view of another embodiment, and FIG. 4 is a still another embodiment. FIG. 5 is a partial side sectional view of yet another embodiment. In the figure, 1... thermoplastic synthetic resin layer, 2... thermoplastic synthetic resin layer mixed with conductive filler, 3...
Joint part, 4, 34...screw, 14A...bolt,
14B...Natsuto, 24...Metal rod.
Claims (1)
た熱可塑性合成樹脂層とからなる二層構造を有す
る一対の板状体の端部相互を重合することによつ
て接合し、該接合部に導電体を挿入せしめて該一
対の板状体の導電性充填材を混合した熱可塑性合
成樹脂層相互を導通したことを特徴とする板状体
の接合構造。 A pair of plate-shaped bodies having a two-layer structure consisting of a thermoplastic synthetic resin layer and a thermoplastic synthetic resin layer mixed with a conductive filler are joined by polymerizing the ends of each other, and the joined portion is 1. A bonding structure for plate-like bodies, characterized in that a conductor is inserted to electrically connect the thermoplastic synthetic resin layers mixed with a conductive filler of the pair of plate-like bodies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20483583U JPS60109927U (en) | 1983-12-28 | 1983-12-28 | Joint structure of plate-shaped body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20483583U JPS60109927U (en) | 1983-12-28 | 1983-12-28 | Joint structure of plate-shaped body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60109927U JPS60109927U (en) | 1985-07-25 |
| JPH0140666Y2 true JPH0140666Y2 (en) | 1989-12-05 |
Family
ID=30767221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20483583U Granted JPS60109927U (en) | 1983-12-28 | 1983-12-28 | Joint structure of plate-shaped body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60109927U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5181468B2 (en) * | 2006-11-20 | 2013-04-10 | トヨタ自動車株式会社 | Fuel cell case |
-
1983
- 1983-12-28 JP JP20483583U patent/JPS60109927U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60109927U (en) | 1985-07-25 |
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