JPH0144220Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a jet solder bath suitable for soldering printed circuit boards, particularly printed circuit boards mounted with chip components.

[Conventional technology]

In a printed circuit board on which chip components are mounted, the electrodes of the chip components and the mount, which is the conductive part of the printed circuit board, are at right angle corners, so even if these are soldered with molten solder, flux will not be generated at the corners. Fumes and air remained behind, preventing the penetration of molten solder, often resulting in poor soldering.

Various soldering methods and soldering baths have been proposed to eliminate the above-mentioned soldering defects in printed circuit boards mounted with chip components, but none of them have been satisfactory.

[Purpose of invention]

The object of the present invention is to provide a jet solder bath that does not cause soldering defects to printed circuit boards on which chip components are mounted.

[Structure of the idea]

Conventionally, when soldering printed circuit boards mounted with chip components using a jet solder bath, if the waves of the molten solder being jetted are made coarser, the rough waves will penetrate into the corners of the chip components and prevent soldering defects. I knew it. Therefore, by installing a plate with many holes in the jet nozzle and moving the hole plate from outside the nozzle, waves can be made coarser (Japanese Patent Application Laid-Open No. 59-1999).
110485) and a device that generates waves by moving a wave-making device equipped with a large number of plates (Japanese Patent Application Laid-open No. 58-28992). However, since conventional devices have sliding and rotating parts within the molten solder, they are prone to failure and are extremely expensive as they require a special drive device.

The present invention does not use a special driving device to roughen the waves of the jet solder, nor does it have any sliding or rotating parts within the molten solder, making it inexpensive and less prone to failure.

In a jet soldering bath equipped with a nozzle for spouting molten solder, which consists of a pair of spaced and opposing nozzle plates and side plates standing upright at both ends of the nozzle plates, a floating body whose both ends are supported by tension springs is connected to the The jet solder bath is characterized by having a free space inside the nozzle.

Here, "to be freely installed" means that the floating body is supported and installed so as to be freely movable within the nozzle.

The tension springs may each have a structure in which the other end is locked to the side plate and the tension of the tension springs can be adjusted.

Furthermore, each of the tension springs may have a structure in which the other end is locked to the side plate and the attachment position of the tension spring is adjustable.

〔Example〕

The present invention will be explained below based on the drawings.

As shown in FIGS. 1, 2, and 3,
The nozzle of the jet solder bath is formed from a pair of nozzle plates 1, 1 and side plates 2, 2 standing upright on both sides thereof. A floating body 4 having a tension spring 3 installed at both ends is installed in the nozzle approximately in the center of both nozzle plates, with the other ends of the tension spring being locked to the side plates 2, 2. The tension spring 3 is locked to the side plate 2 by being locked to a bolt 5 attached to the side plate. The bolt 5 is inserted into a vertically long hole 6 drilled in the side plate, and is screwed into a nut 8 outside the side plate via a washer 7 which is longer than the hole.

Next, the operation of the jet solder bath of the present invention having the above structure will be explained.

Molten solder sent by a pump (not shown) is caused to flow upward from the bottom of the nozzle. At this time, since there is a floating body inside the nozzle that is pulled at both ends by springs and is locked to the side plate, the molten solder flowing from below hits this floating body and flows further upward. However, since the floating body is attached with a tension spring and is in an unstable state, it swings irregularly up and down and left and right as shown by the dashed line in FIG. Therefore, the flow of the molten solder flowing from the bottom to the top is disturbed by the irregularly swinging floating bodies, and the part where the solder jets into the upper hole of the nozzle and comes into contact with the printed circuit board forms rough waves.

The undulating state of the molten solder changes depending on the installation position of the floating body. In other words, when the floating body is installed below the nozzle, the influence on the upward direction of the jet flow is small and the waves are small, but when the floating body is installed above the nozzle, the waves become coarse. Therefore, the installation position of the floating body is appropriately selected depending on the printed circuit board to be soldered. The position of the floating body can be easily adjusted by simply moving the bolt that locks the tension spring along the vertical hole in the side plate.

In the embodiment, a cylindrical floating body is shown, but it goes without saying that any shape can be used as long as it can be installed in the nozzle to make the waves of the solder jet rough.

[Effect of idea]

The jet soldering bath of the present invention has a simple structure and fewer failures because it simply has a floating body that moves irregularly inside the nozzle, and it also provides a wave jet suitable for soldering chip parts. It has no superior effect.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a perspective view of the jet solder bath of the present invention, FIG. 2 is a front center sectional view of the same, and FIG. 3 is a side view of the same. 1... Nozzle plate, 2... Side plate, 3... Tension spring, 4... Floating body.

Claims (1)

[Claims for Utility Model Registration] (1) In a jet soldering bath equipped with a nozzle for spouting molten solder, which consists of a pair of spaced and opposed nozzle plates and side plates erected at both ends thereof, both ends are connected by tension springs. A jet solder bath characterized in that a supported floating body is loosely installed within the nozzle. (2) The jet solder bath according to claim 1, wherein the tension spring is locked to the side plate and the tension of the tension spring is adjustable. (3) The jet solder bath according to claim 1 or 2, wherein the tension spring is locked to the side plate and the mounting position of the tension spring is adjustable.