JPH0144436B2 - - Google Patents
Info
- Publication number
- JPH0144436B2 JPH0144436B2 JP57065791A JP6579182A JPH0144436B2 JP H0144436 B2 JPH0144436 B2 JP H0144436B2 JP 57065791 A JP57065791 A JP 57065791A JP 6579182 A JP6579182 A JP 6579182A JP H0144436 B2 JPH0144436 B2 JP H0144436B2
- Authority
- JP
- Japan
- Prior art keywords
- molybdenum
- nickel
- composite material
- producing
- nickel composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明はモリブデン材とニツケル材を重合して
なる複合材の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for producing a composite material formed by polymerizing a molybdenum material and a nickel material.
例えば半導体素子を取付けるための半導体基板
として、基体であるモリブデン材の表面上に薄い
ニツケル材を重合した構成の複合材が用いられて
いる。この複合材は、モリブデン材が半導体素子
と近似した熱膨張率を有するものであり、ニツケ
ル材がモリブデンと半導体素子元素Siとが反応す
ることを抑制する役割を有するものであつて半導
体基板として適している。この複合材は通常全体
厚さが0.25〜1.5mmであり、ニツケル材は10〜50μ
ｍの厚さを有するものである。
For example, a composite material in which a thin nickel material is polymerized on the surface of a base molybdenum material is used as a semiconductor substrate for mounting a semiconductor element. In this composite material, the molybdenum material has a coefficient of thermal expansion similar to that of the semiconductor element, and the nickel material has the role of suppressing the reaction between molybdenum and the semiconductor element element Si, making it suitable as a semiconductor substrate. ing. This composite material usually has an overall thickness of 0.25-1.5mm, and the nickel material has a total thickness of 10-50μ
It has a thickness of m.
しかして、従来この複合材を製造する場合に
は、モリブデン材の表面にニツケルメツキを施し
てニツケル材を重合する方法が行なわれていた。 Conventionally, when manufacturing this composite material, a method has been used in which the surface of a molybdenum material is plated with nickel and the nickel material is polymerized.
しかるに、モリブデン材の表面にニツケルメツ
キを施す方法においてはメツキ層に気泡が生じや
すい難点があるとともに、均一な厚味を得るため
に、ニツケルメツキを複数回に分けて行なうこと
により所定厚さのメツキ層（ニツケル材）を形成
している。しかしながら、メツキ処理の費用は高
価であり、メツキ処理を数回行なうことはニツケ
ル材を形成するための費用が増大し、従つて複合
材の製造コストが高くなるという問題が生じてい
る。
However, the method of applying nickel plating to the surface of molybdenum material has the disadvantage that bubbles tend to form in the plating layer, and in order to obtain a uniform thickness, nickel plating is performed in multiple steps to form a plating layer of a predetermined thickness. (nickel material). However, the plating process is expensive, and performing the plating process several times increases the cost of forming the nickel material, resulting in a problem in that the manufacturing cost of the composite material increases.
本発明はニツケル材をモリブデン材に経済的な
方法で重合することにより複合材の製造コストの
低減を図つたモリブデンとニツケルからなる複合
材の製造方法を提供するものである。
The present invention provides a method for manufacturing a composite material made of molybdenum and nickel, which aims at reducing the manufacturing cost of the composite material by polymerizing nickel material into molybdenum material in an economical manner.
本発明の複合材の製造方法は、ニツケル材とし
て板材を使用するもので、モリブデン材の表面を
清浄化した後に、板状のニツケル材とモリブデン
材とを温間加工して重合した状態で接合すること
により、ニツケル材を経済的な方法で強固にモリ
ブデン材に接合できるものである。
The method for producing a composite material of the present invention uses a plate material as the nickel material, and after cleaning the surface of the molybdenum material, the plate-shaped nickel material and molybdenum material are warm-processed and bonded in a polymerized state. By doing so, nickel material can be firmly bonded to molybdenum material in an economical manner.
本発明の複合材の製造方法を、半導体基板を製
造する場合を例にとり説明する。
The method for manufacturing a composite material of the present invention will be explained by taking as an example the case of manufacturing a semiconductor substrate.
まず、厚さ１〜３mm程度の板状をなすモリブデ
ン材を用意し、このモリブデン材におけるニツケ
ル材を接合するための表面に酸化膜除去処理を施
し、モリブデン材の表面に生じている酸化膜を除
去する。この処理の具体的な方法としては、例え
ばピアノ線又はステンレス線からなるワイヤブラ
シを使用し、このワイヤブラシをモーターなどに
より回転させてモリブデン材の表面上を擦る方法
がある。この処理によりモリブデン材の表面に生
じていた酸化膜が取り除かれて表面が清浄とな
り、また酸化物や異物を除去することにより表面
が活性化する。すなわち、この処理はモリブデン
材の表面にニツケル材を重合接合する上で阻害す
る要素を除去し、良好に接合を行なえるようにす
るために行なうものである。 First, a plate-shaped molybdenum material with a thickness of about 1 to 3 mm is prepared, and the surface of this molybdenum material for joining the nickel material is subjected to oxide film removal treatment to remove the oxide film that has formed on the surface of the molybdenum material. Remove. A specific method for this treatment is to use a wire brush made of piano wire or stainless steel wire, for example, and rotate this wire brush by a motor or the like to rub the surface of the molybdenum material. This treatment removes the oxide film that had formed on the surface of the molybdenum material, making the surface clean, and activating the surface by removing oxides and foreign substances. That is, this treatment is carried out in order to remove elements that hinder the polymerization bonding of the nickel material to the surface of the molybdenum material and to enable good bonding.
さらに、モリブデン材とニツケル材を温間加工
により重合接合する。この工程では、まずモリブ
デン材を100℃から400℃好ましくは150〜250℃の
温度範囲で加熱する。モリブデン材に対しては例
えばガス又は電気によつて加熱し、またこの加熱
は大気中にて行なうことが可能である。次いで、
加熱されたモリブデン材の表面上に、厚さ0.03〜
0.2mm程度の極く薄い板状をなすニツケル材を重
ね合せて載せ、この重ね合せたモリブデン材とニ
ツケル材とを一対の加圧ロールの間に通して加圧
変形させる。このため、ニツケル材は加圧ロール
の圧力によりモリブデン材の表面上に重合して圧
着し、同時にモリブデン材とニツケル材は加圧ロ
ールにより圧延される。加圧ロールによるモリブ
デン材とニツケル材からなる複合材に対する加工
率は、70％から40％の範囲とする。これは加工率
が40％より少ないと接合状態が安定せず、逆に70
％を越えると加工が困難となるという理由による
ものである。 Furthermore, the molybdenum material and the nickel material are polymerized and bonded by warm processing. In this step, the molybdenum material is first heated in a temperature range of 100°C to 400°C, preferably 150 to 250°C. The molybdenum material can be heated, for example by gas or electricity, and the heating can be carried out in the atmosphere. Then,
On the surface of heated molybdenum material, thickness 0.03~
Very thin plate-shaped nickel materials of about 0.2 mm are stacked one on top of the other, and the stacked molybdenum and nickel materials are passed between a pair of pressure rolls and deformed under pressure. Therefore, the nickel material is polymerized and pressed onto the surface of the molybdenum material by the pressure of the pressure roll, and at the same time, the molybdenum material and the nickel material are rolled by the pressure roll. The processing rate for composite materials consisting of molybdenum and nickel materials using pressure rolls shall be in the range of 70% to 40%. This is because if the processing rate is less than 40%, the bonding condition will not be stable;
This is because if it exceeds %, processing becomes difficult.
ここで、モリブデン材とニツケル材とを重合接
合するために、モリブデン材を温度100〜400℃で
加熱して温間加工を行なう理由について説明を加
える。モリブデン材を800℃程度の温度で加熱し
て熱間加工によりモリブデン材とニツケル材を重
合接合する場合には、温間加工の場合に比して大
なる接合強度を得ることができるが、反面モリブ
デン材を800℃まで加熱すると表面に酸化膜が生
じて接合を妨げるため、真空又は還元雰囲気中で
行う必要が生じるとともに、ニツケルとモリブデ
ンの降状強さの違いが大きくなるため、接合加工
が困難になり、また、ニツケル材がモリブデン材
中に拡散して脆くなり実用に適さないという欠点
がある。また、モリブデン材を常温のままにして
冷間加工によりモリブデン材とニツケル材との重
合接合を行なう場合は、モリブデン材の酸化膜や
ニツケル材の拡散は生じないが、両者の、特にモ
リブデンの降伏強度が高くなつて接合しにくくな
り、接合強度が低下して実用に適さないという欠
点が生じる。これに対して温間加工により接合す
る場合には、例えば半導体基板として使用する上
で実用上充分な接合強度を得ることができるとと
もに、ニツケル材がモリブデン材中に拡散する度
合が小さい。特にモリブデン材を100〜400℃好ま
しくは150〜250℃の温度で大気中にて加熱しても
モリブデン材に酸化膜が形成されず、これにより
モリブデン材に対する加熱を還元雰囲気中ではな
く大気中で行なうことができ設備的に有利である
という利点も生じる。 Here, in order to polymerize and bond the molybdenum material and the nickel material, an explanation will be given of the reason why the molybdenum material is heated at a temperature of 100 to 400° C. to perform warm working. When molybdenum material and nickel material are polymerized and bonded by heating the molybdenum material to a temperature of about 800℃ and hot working, it is possible to obtain greater bonding strength than in the case of warm working, but on the other hand, When molybdenum materials are heated to 800°C, an oxide film forms on the surface and prevents bonding, which necessitates bonding in a vacuum or reducing atmosphere. At the same time, the difference in precipitation strength between nickel and molybdenum increases, making the bonding process difficult. Moreover, the nickel material diffuses into the molybdenum material and becomes brittle, making it unsuitable for practical use. In addition, when polymerizing molybdenum and nickel materials by cold working while leaving the molybdenum materials at room temperature, an oxide film of the molybdenum materials and diffusion of the nickel materials do not occur, but the breakdown of both, especially the molybdenum, occurs. The disadvantage is that the strength increases, making it difficult to bond, and the bonding strength decreases, making it unsuitable for practical use. On the other hand, when bonding is performed by warm processing, it is possible to obtain a bonding strength that is practically sufficient for use as a semiconductor substrate, for example, and the degree of diffusion of the nickel material into the molybdenum material is small. In particular, even if molybdenum material is heated in the air at a temperature of 100 to 400°C, preferably 150 to 250°C, an oxide film will not be formed on the molybdenum material. It also has the advantage that it can be carried out and is advantageous in terms of equipment.
このようにして図面で示すようにモリブデン材
１の表面上に薄いニツケル材２２を重合した複合
材、すなわち半導体基板を製造できる。 In this way, as shown in the drawings, a composite material, that is, a semiconductor substrate, can be manufactured in which a thin nickel material 22 is polymerized on the surface of a molybdenum material 1.
この複合材は接合工程を終了した後に、温度
700〜800℃で加熱して拡散焼鈍を行ない、ニツケ
ル材とモリブデン材との接合をさらに安定化させ
ることもできる。この場合、ニツケル材のモリブ
デン材に対する拡散は最小限に抑制する。 After completing the bonding process, this composite material is heated to
It is also possible to perform diffusion annealing by heating at 700 to 800°C to further stabilize the bond between the nickel material and the molybdenum material. In this case, diffusion of the nickel material into the molybdenum material is minimized.
なお、モリブデン材とニツケル材は、夫々複数
の半導体基板を材料取りできる大きさの材料と
し、これらモリブデン材とニツケル材を重合接合
した後に、この複合材から複数の半導体基板を切
断して製造する方法が実用上適している。 The molybdenum material and the nickel material are each of a size that can be used to make multiple semiconductor substrates, and after the molybdenum material and the nickel material are polymerized and bonded, the composite material is cut into multiple semiconductor substrates. The method is practically suitable.
本発明においては半導体基板に限定されずに、
モリブデン材とニツケル材を重合接合した複合材
を製造する場合に広く適用できる。 In the present invention, without being limited to semiconductor substrates,
It can be widely applied to the production of composite materials made by polymerizing and bonding molybdenum and nickel materials.
本発明のモリブデン−ニツケル複合材の製造方
法は、モリブデン材の表面を清浄化した後に、板
状をなすニツケル材を常温加工によりモリブデン
材に重合して接合するので、ニツケル材をモリブ
デン材に強固に重合接合できるとともに、短時間
で能率よく、生産できるので従来のようにニツケ
ルメツキを数回に分けて施す場合に比して安価に
ニツケル材をモリブデン材に重合させることがで
き、モリブデン材とニツケル材からなる複合材の
製造コストを大幅に低減させることができる。
In the method for manufacturing a molybdenum-nickel composite material of the present invention, after cleaning the surface of the molybdenum material, the plate-shaped nickel material is polymerized and bonded to the molybdenum material by processing at room temperature, so that the nickel material is firmly attached to the molybdenum material. It is possible to polymerize and bond nickel to molybdenum material in a short time and efficiently, so it is possible to polymerize nickel material to molybdenum material at a lower cost compared to the conventional method of applying nickel plating in several steps. The manufacturing cost of composite materials made from these materials can be significantly reduced.
図面は本発明の製造方法により製造した複合材
を示す正面図である。
１……モリブデン材、２……ニツケル材。
The drawing is a front view showing a composite material manufactured by the manufacturing method of the present invention. 1... Molybdenum material, 2... Nickel material.
Claims (1)
記モリブデン材を100〜400℃の温度で加熱する工
程と、前記モリブデン材の清浄化された表面にニ
ツケル材を重合する工程と、重合されたモリブデ
ン材及びニツケル材を加圧して接合する工程とを
具備することを特徴とするモリブデン−ニツケル
複合材の製造方法。 ２ 清浄化する工程は、酸化膜を除去する工程で
ある特許請求の範囲第１項に記載のモリブデン−
ニツケル複合材の製造方法。 ３ 清浄化する工程は機械的研摩である特許請求
の範囲第１項に記載のモリブデン−ニツケル複合
材の製造方法。 ４ 加熱は150〜250℃の温度で行なう特許請求の
範囲第１項に記載のモリブデン−ニツケル複合材
の製造方法。 ５ 加圧は圧延加工でなる特許請求の範囲第１項
に記載のモリブデン−ニツケル複合材の製造方
法。 ６ 接合する工程の加工率は40〜70％である特許
請求の範囲第５項に記載のモリブデン−ニツケル
複合材の製造方法。 ７ 接合する工程のあとに拡散、熱処理を施こす
特許請求の範囲第１項に記載のモリブデン−ニツ
ケル複合材の製造方法。 ８ 拡散熱処理は700〜900℃で行なう特許請求の
範囲第７項に記載のモリブデン−ニツケル複合材
の製造方法。[Claims] 1. A step of cleaning the surface of a molybdenum material, a step of heating the molybdenum material at a temperature of 100 to 400°C, and a step of polymerizing a nickel material on the cleaned surface of the molybdenum material. 1. A method for producing a molybdenum-nickel composite material, comprising: and a step of pressurizing and joining polymerized molybdenum material and nickel material. 2. The molybdenum powder according to claim 1, wherein the cleaning step is a step of removing an oxide film.
Method for manufacturing nickel composite material. 3. The method for producing a molybdenum-nickel composite material according to claim 1, wherein the cleaning step is mechanical polishing. 4. The method for producing a molybdenum-nickel composite material according to claim 1, wherein the heating is performed at a temperature of 150 to 250°C. 5. The method for producing a molybdenum-nickel composite material according to claim 1, wherein the pressing is performed by rolling. 6. The method for producing a molybdenum-nickel composite material according to claim 5, wherein the processing rate in the joining step is 40 to 70%. 7. The method for producing a molybdenum-nickel composite material according to claim 1, wherein diffusion and heat treatment are performed after the bonding step. 8. The method for producing a molybdenum-nickel composite material according to claim 7, wherein the diffusion heat treatment is performed at 700 to 900°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6579182A JPS58181490A (en) | 1982-04-20 | 1982-04-20 | Production of molybdenum-nickel composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6579182A JPS58181490A (en) | 1982-04-20 | 1982-04-20 | Production of molybdenum-nickel composite material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58181490A JPS58181490A (en) | 1983-10-24 |
| JPH0144436B2 true JPH0144436B2 (en) | 1989-09-27 |
Family
ID=13297201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6579182A Granted JPS58181490A (en) | 1982-04-20 | 1982-04-20 | Production of molybdenum-nickel composite material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58181490A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60225436A (en) * | 1984-04-23 | 1985-11-09 | Toshiba Corp | Molybdenum disc for semiconductor substrate |
-
1982
- 1982-04-20 JP JP6579182A patent/JPS58181490A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58181490A (en) | 1983-10-24 |
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