JPH0144680B2 - - Google Patents
Info
- Publication number
- JPH0144680B2 JPH0144680B2 JP59000524A JP52484A JPH0144680B2 JP H0144680 B2 JPH0144680 B2 JP H0144680B2 JP 59000524 A JP59000524 A JP 59000524A JP 52484 A JP52484 A JP 52484A JP H0144680 B2 JPH0144680 B2 JP H0144680B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- thin film
- cell
- molecular beam
- cell shutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Description
【発明の詳細な説明】
(技術分野)
本発明は、マイクロ波素子あるいは発光・受光
素子として使用する単結晶薄膜周期構造を形成す
るためのMBE成長方法に関する。例えば、第1
図に示すような量子井戸型レーザーにおいては、
発光部に数10Å〜数100Å厚の種類の異なる層を
交互に、周期的に形成する必要があり、本発明
は、このような構造を形成するためのMBE成長
方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to an MBE growth method for forming a single crystal thin film periodic structure used as a microwave device or a light emitting/light receiving device. For example, the first
In a quantum well laser as shown in the figure,
It is necessary to alternately and periodically form different types of layers with thicknesses of several tens of angstroms to several hundreds of angstroms in the light emitting part, and the present invention relates to an MBE growth method for forming such a structure.
(従来技術とその問題点)
第2図は、従来の−族化合物半導体薄膜周
期構造形成のためのMBE成長方法を説明するた
めの図で、MBE装置の成長室を上から見た概略
図である。同様の概略図は、例えば、特許公報昭
57−47160にも示されており、また、公開特許公
報昭57−11899には、以下に述べる従来技術の問
題点であるセルシヤツターの開閉操作に関する記
述が成されている。さらに、MBE成長方法なら
びに薄膜周期構造を利用したデバイスに関する詳
細な説明は、日経エレクトロニクスNo.308(1983)
(by W.T.Tsang)などに掲載されている。(Prior art and its problems) Figure 2 is a diagram for explaining the conventional MBE growth method for forming a - group compound semiconductor thin film periodic structure, and is a schematic diagram of the growth chamber of the MBE apparatus seen from above. be. A similar schematic diagram can be found, for example, in the patent publication Showa
57-47160, and Japanese Unexamined Patent Publication No. 57-11899 describes the opening/closing operation of the cell shutter, which is a problem with the prior art described below. Furthermore, a detailed explanation of the MBE growth method and devices using thin film periodic structures can be found in Nikkei Electronics No. 308 (1983).
(by WTTsang) etc.
第2図において、1は基板ホルダー、2は基
板、3はセルシヤツター、4は族原料A(例え
ばGa)5はセル、6はセルシヤツター、7はA
とは種類の異なる族原料B(例えばAl)、8は
セルである。従来のMBE成長による−族化
合物半導体薄膜周期構造形成においては、基板ホ
ルダー1上に保持された基板2は、成長室内にお
いて、セル5ならびにセル8の中心軸の交わる位
置に設置されて成長が行なわれる。そして、セル
5より蒸発した族原料A4の分子線ならびに、
セル8より蒸発した族原料B7の分子線を、そ
れぞれセルシヤツター3ならびにセルシヤツター
6を、交互に所定の周期で開閉することによつ
て、基板2上に、族原料AならびにBから成る
種類の異なる−族化合物半導体薄膜を交互に
周期的に形成する。 In Fig. 2, 1 is a substrate holder, 2 is a substrate, 3 is a cell shutter, 4 is a group material A (eg, Ga), 5 is a cell, 6 is a cell shutter, and 7 is an A
Group raw material B (for example, Al), which is different from the above, and 8 are cells. In conventional MBE growth to form a periodic structure of - group compound semiconductor thin films, the substrate 2 held on the substrate holder 1 is placed in the growth chamber at a position where the center axes of cells 5 and 8 intersect, and growth is performed. It will be done. Then, the molecular beam of group raw material A4 evaporated from cell 5 and
By alternately opening and closing the cell shutters 3 and 6 at a predetermined period, the molecular beams of the group raw materials B7 evaporated from the cell 8 are applied to different types of group raw materials A and B on the substrate 2. Group compound semiconductor thin films are alternately and periodically formed.
以上の工程によると、たとえばセルシヤツター
3を開いている間は、セルシヤツター6は閉じら
れていることになる。ところで、一般に−族
化合物半導体をMBE成長する場合、族原料の
セル温度は、通常700〜1000℃の高温に加熱され
ている。このため、セルシヤツター3を開いてい
る間、セルシヤツター6を閉じることによつて、
セルシヤツター6が加熱され、またセル温度その
ものも、セルシヤツターによる外乱を受ける。セ
ルシヤツターが加熱されることにより、セルシヤ
ツターから不純物分子が蒸発し、成長している薄
膜内に取り込まれる結果、薄膜の電気特性の劣化
を引き起こす。第3図、第4図は、上記の内容に
関する測定結果を示したものである。第3図は、
四重極質量分析装置を用いて、セルシヤツターを
閉じた後の、不純ガス量の変化を調べた結果であ
り、セルシヤツターを閉じた直後にH2O+やCO+
の質量ピーク強度が瞬間的ではあるが増大してお
り、不純ガス量が増大していることが分かる。ま
た、第4図は、例えばInGaAs単結晶薄膜におい
て得られた結果であるが、薄膜内の残留不純物キ
ヤリア濃度が増大するほど電子移動度が減少して
おり、電気特性が劣化していることが分かる。 According to the above steps, for example, while the cell shutter 3 is open, the cell shutter 6 is closed. By the way, when a - group compound semiconductor is grown by MBE, the cell temperature of the group raw material is generally heated to a high temperature of 700 to 1000°C. Therefore, by closing the cell shutter 6 while the cell shutter 3 is open,
The cell shutter 6 is heated, and the cell temperature itself is also subjected to disturbances caused by the cell shutter. When the cell shutter is heated, impurity molecules are evaporated from the cell shutter and incorporated into the growing thin film, resulting in deterioration of the electrical properties of the thin film. FIGS. 3 and 4 show measurement results regarding the above contents. Figure 3 shows
These are the results of using a quadrupole mass spectrometer to investigate changes in the amount of impure gas after the cell shutter was closed .
It can be seen that the mass peak intensity increases, albeit momentarily, and the amount of impure gas increases. Furthermore, Figure 4 shows the results obtained for an InGaAs single crystal thin film, for example, and the electron mobility decreases as the residual impurity carrier concentration within the thin film increases, indicating that the electrical characteristics deteriorate. I understand.
以上のような、セルシヤツターからの不純ガス
発生といつた問題とは別に、セルシヤツターを閉
じたことによつて、セル温度そのものが揺乱を受
ける結果、再度セルシヤツター6を開いたとき
に、族原料B7の分子線強度にオーバーシユー
トを引き起こす。このことは、族原料B7から
成る−族化合物半導体薄膜の膜厚ならびに混
晶の場合には組成制御性を悪くする。第5図、第
6図、第7図は上記の内容に関する測定結果を
族元素としてIn、Gaを有する混晶の場合につい
て示したものである。第5図は、真空ゲージを用
いて、セルシヤツターを例えば約3分間閉じた
後、再び開いたときGa分子線強度(Torr)変化
を測定した結果である。セルシヤツターを開いた
直後に、分子線強度(Torr)がオーバーシユー
トし、その後本来の分子線強度(Torr.)に安定
するまで1〜2分を要することが分かる。オーバ
ーシユートの大きさは異なるが、同様の現象は、
In分子線強度でも観察された。また第6図は例え
ば、InP基板上にInxGa1-xAs成長したときの
InGaAsとInP基板の|△a/aInP|(△α=
αInGaAs−〓InP、〓InGaAsはInGaAsの格子定数、
αInPはInPの格子定数)に対するInとGaのフラ
ツクス強度比の影響を示したものである。第5図
のGa分子線強度(Torr)のオーバーシユート
は、そのまま第6図のフラツクス強度比の制御性
の低下につながり、|△a/a|すなわち
InxGa1-xAs単結晶薄膜の組成制御性も低下する。
現に第5図で示したようなオーバシユートの存在
する状態でMBE成長したInxGa1-xAs層の厚み方
向の組成分布をオージエ電子分光(AES)分析
した結果、第7図に示すように、セルシヤツター
開放直後、すなわちInxGa1-xAs/InP基板界面
近傍でInとGaの組成比に勾配が見られ、組成制
御性が悪いことが分かる。また、第7図は同じく
InP基板上にIn0.53Ga0.47As成長したときの族
(Ga、In)分子線強度(Torr.)と成長速度(μ
m/hr.)との相関性について、得られた実験結
果を示したものである。第5図の場合では、オー
バーシユートにより、Ga分子線強度(Torr.)
は、本来の強度の約1.2〜1.4倍にまで上昇してお
り、また、In分子線強度(Torr.)においてもオ
ーバーシユートが観測されていることから、第8
図のGa+Inビーム強度も、1.2〜1.4倍以上の値と
なり、成長速度も1.2〜1.4倍以上になる。このよ
うに、セルシヤツターを開いた直後においては、
成長速度が設計値よりも大きくなつており、この
ことは、薄膜の厚み制御性を劣化させる。このよ
うに第1図に示すような従来の−族化合物半
導体薄膜周期構造形成のためのMBE成長方法に
おいては、セルシヤツターの開閉によつて族分
子線の切り換えを行なうことにより、不純ガスの
発生、分子線強度の揺乱を引き起こすことにな
り、このため薄膜の電気的特性を劣化させ、また
膜厚や、あるいは混晶の場合には組成制御性に悪
影響を及ぼし、薄膜周期構造を形成した際の周期
性劣化を引き起こすという欠点を有する。 Apart from the problem of impure gas generation from the cell shutter as mentioned above, closing the cell shutter causes fluctuations in the cell temperature itself, and as a result, when the cell shutter 6 is opened again, the group raw material B7 causes an overshoot in the molecular beam intensity. This makes it difficult to control the thickness of the - group compound semiconductor thin film made of the group raw material B7 and the composition in the case of a mixed crystal. FIGS. 5, 6, and 7 show measurement results regarding the above contents in the case of a mixed crystal containing In and Ga as group elements. FIG. 5 shows the results of measuring changes in Ga molecular beam intensity (Torr) using a vacuum gauge when the cell shutter was closed for about 3 minutes and then reopened. It can be seen that immediately after opening the cell shutter, the molecular beam intensity (Torr) overshoots, and then it takes 1 to 2 minutes to stabilize to the original molecular beam intensity (Torr.). Although the magnitude of overshoot is different, the same phenomenon is
It was also observed in In molecular beam intensity. Figure 6 also shows, for example, when InxGa 1-x As is grown on an InP substrate.
|△a/aInP|(△α=
αInGaAs−〓InP,〓InGaAs is the lattice constant of InGaAs,
αInP is the lattice constant of InP) and shows the influence of the flux intensity ratio of In and Ga. The overshoot of the Ga molecular beam intensity (Torr) in Fig. 5 directly leads to a decrease in the controllability of the flux intensity ratio in Fig. 6, and |△a/a|
The composition controllability of the InxGa 1-x As single crystal thin film also deteriorates.
As a result of Auger electron spectroscopy (AES) analysis of the composition distribution in the thickness direction of the In x Ga 1-x As layer grown by MBE in the presence of an overshoot as shown in Fig. 5, the results are as shown in Fig. 7. , a gradient is observed in the composition ratio of In and Ga immediately after the cell shutter is opened, that is, near the InxGa 1-x As/InP substrate interface, indicating poor composition controllability. Also, Figure 7 shows the same
Group (Ga, In ) molecular beam intensity (Torr.) and growth rate (μ
This figure shows the experimental results obtained regarding the correlation with m/hr.). In the case of Figure 5, the Ga molecular beam intensity (Torr.) is increased due to overshoot.
has increased to about 1.2 to 1.4 times the original intensity, and overshoot has also been observed in the In molecular beam intensity (Torr.).
The Ga+In beam intensity shown in the figure is also 1.2 to 1.4 times higher, and the growth rate is also 1.2 to 1.4 times higher. In this way, immediately after opening the cell shutter,
The growth rate is higher than the designed value, which deteriorates the thickness controllability of the thin film. In this way, in the conventional MBE growth method for forming a periodic structure of a - group compound semiconductor thin film as shown in FIG. 1, the generation of impurity gas and This causes fluctuations in the molecular beam intensity, which deteriorates the electrical properties of the thin film and adversely affects the film thickness or, in the case of mixed crystals, the composition controllability, and when a periodic structure of the thin film is formed. This has the disadvantage of causing periodicity deterioration.
(発明の構成)
本発明の目的は、前述のセルシヤツターの開閉
に伴なつて生じる−族化合物半導体薄膜周期
構造の電気特性劣化ならびに周期性劣化を低減す
るMBE成長方法を提供することである。(Structure of the Invention) An object of the present invention is to provide an MBE growth method that reduces the electrical property deterioration and periodicity deterioration of the - group compound semiconductor thin film periodic structure that occurs with the opening and closing of the cell shutter described above.
以下に図面を参照して、本発明について詳細に
説明する。 The present invention will be described in detail below with reference to the drawings.
第9図は、本発明のMBE成長方法の実施例を
説明するための図で、成長室を上から見た図であ
る。9,10はそれぞれ族原料A、B、11,
12は分子線セルである。中央のマスク13には
円形等の形状をした穴があいており、族分子1
1,12より飛び出した族分子AおよびBはそ
れぞれこの穴を通り14,15の位置に到達す
る。基板ホルダー16は軸17の回りに回転して
おりちようど14,15の位置を通るようになつ
ている。従つて基板18上には14の位置で族
分子Aよりなる−族半導体薄膜が、15の位
置では族分子Bよりなる−族半導体薄膜が
成長することになり、基板ホルダーが回転してい
るためこれらの半導体薄膜が交互に積層成長する
ことになる。例えば族元素にAs、族元素A、
BにそれぞれIn、Gaを用いればInAs−GaAsの
積層多層構造が形成できる。 FIG. 9 is a diagram for explaining an embodiment of the MBE growth method of the present invention, and is a view of the growth chamber viewed from above. 9 and 10 are group raw materials A, B, 11, and
12 is a molecular beam cell. The central mask 13 has a hole in the shape of a circle or the like, and the group molecule 1
Group molecules A and B that have jumped out from 1 and 12 pass through this hole and reach positions 14 and 15, respectively. The substrate holder 16 is rotated around an axis 17 and passes through the positions of the guides 14 and 15. Therefore, on the substrate 18, a - group semiconductor thin film consisting of group molecules A is grown at position 14, and a - group semiconductor thin film consisting of group molecules B is grown at position 15. Since the substrate holder is rotating, These semiconductor thin films are grown alternately in layers. For example, group elements include As, group element A,
If In and Ga are used for B, respectively, a laminated multilayer structure of InAs-GaAs can be formed.
第9図において−族化合物半導体単結晶薄
膜周期構造の周期は、基板ホルダーの回転速度を
変えることによつて、簡単に変更することができ
る。また族原料Aからなる−族化合物半導
体薄膜と、族原料Bからなる−族化合物半
導体薄膜の膜厚の比は、あらかじめ各々のセル温
度を調整して、族原料Aと族原料Bの分子線
強度比を変えることによつて、簡単に変更するこ
とができる。 In FIG. 9, the period of the - group compound semiconductor single crystal thin film periodic structure can be easily changed by changing the rotation speed of the substrate holder. In addition, the ratio of the film thickness of the - group compound semiconductor thin film made of group raw material A and the - group compound semiconductor thin film made of group raw material B can be determined by adjusting the cell temperature of each group in advance. It can be easily changed by changing the intensity ratio.
第9図に示すような本発明による薄膜周期構造
の成長方法では、セルシヤツターは常に開放状態
にあり、成長を終了するときのみ、セルシヤツタ
ーを閉じれば良い。この結果、セルシヤツターの
開閉を周期的に行なう従来のMBE成長方法で問
題になる、不純ガスの発生や分子線強度の揺乱が
成長途中において全く起こらなくなり、含有不純
物量の少ない、かつ周期性の良い、−族化合
物半導体薄膜周期構造を形成することができる。 In the method of growing a thin film periodic structure according to the present invention as shown in FIG. 9, the cell shutter is always open and needs to be closed only when growth is finished. As a result, the generation of impurity gas and fluctuations in the molecular beam intensity, which are problems with the conventional MBE growth method in which the cell shutter is periodically opened and closed, do not occur during growth, and the amount of impurities contained is small and periodicity is reduced. A good - group compound semiconductor thin film periodic structure can be formed.
本発明では、不純ガス発生ならびに分子線強度
揺乱の問題を解消できることがその主たる効果で
あるが、例えば、第9図において複数個の基板ホ
ルダーを取りつけ、同一方向に基板ホルダーを回
転運動させるか、または領域14,15を含む大
きな基板ホルダーを設け、これに複数枚の基板を
はりつけ基板ホルダーを自転させれば、同一周期
の単結晶薄膜周期構造を有した基板ウエハーを、
1回の成長で複数枚得ることができるようにな
り、量産性も向上できるという効果も期待でき
る。 The main effect of the present invention is that it can solve the problems of impurity gas generation and molecular beam intensity fluctuation, but for example, as shown in FIG. Alternatively, if a large substrate holder including regions 14 and 15 is provided, a plurality of substrates are attached to it, and the substrate holder is rotated, a substrate wafer having a periodic structure of a single crystal thin film with the same period can be obtained.
It is now possible to obtain multiple sheets with one growth, and it is also expected to have the effect of improving mass productivity.
(発明の効果)
本発明の効果は、成長室内に穴のあいたマスク
を設けることにより、各セルシヤツターを常に開
放した状態で、基板ホルダーを回転運動をさせる
ことによつて、セルシヤツターからの不純ガス発
生ならびに、分子線強度の揺乱を解消することが
でき、その結果、著しく周期性が良く、かつ微細
な単結晶薄膜周期構造を簡単に形成することがで
きることである。(Effects of the Invention) The effects of the present invention are that impurity gas generation from the cell shutters is prevented by rotating the substrate holder with each cell shutter always open by providing a mask with holes in the growth chamber. In addition, it is possible to eliminate fluctuations in molecular beam intensity, and as a result, it is possible to easily form a fine single-crystal thin film periodic structure with extremely good periodicity.
第1図は、量子井戸型レーザーの概略図、第2
図は、−族化合物半導体単結晶薄膜周期構造
を形成するための従来のMBE成長方法を説明す
るための図、第3図は、セルシヤツターからの不
純ガス発生に関する測定結果、第4図は、In0.53
Ga0.47As単結晶薄膜の残留不純物キヤリア濃度と
電子移動度との関係についての測定結果、第5図
は、セルシヤツター開放直後における分子線強度
オーバーシユートに関する測定結果、第6図は、
InxGa1-xAs組成と、族(InとGa)分子線強度
比との関係についての測定結果、第7図は、Inx
Ga1-xAs層の厚み方向におけるAES分析結果、第
8図は、In0.53Ga0.47As単結晶薄膜の成長速度と、
族(Ga+In)分子線強度との関係についての
測定結果、第9図は、本発明のMBE成長方法を
説明するための図である。
A……P型GaAs、B……P型GaxAl1-xAs、
C……ノンドープGaAsウエル、D……ノンドー
プGaxAl1-xAsバリヤ、E……n型GaxAl1-xAs、
F……n型GaAs、1,16……基板ホルダー、
2,18……基板、3,6……セルシヤツター、
4,9……原料A、5,8,11,12……セ
ル、7,10……原料B、17……回転軸、13
……穴のあいたマスク、14……原料分子Aが到
達する領域、15……原料分子Bが到達する領
域。
Figure 1 is a schematic diagram of a quantum well laser; Figure 2 is a schematic diagram of a quantum well laser;
The figure is a diagram for explaining the conventional MBE growth method for forming a - group compound semiconductor single crystal thin film periodic structure, Figure 3 is the measurement result regarding impurity gas generation from the cell shutter, and Figure 4 is 0.53
Figure 5 shows the measurement results of the relationship between the residual impurity carrier concentration and electron mobility of a Ga 0.47 As single crystal thin film, and Figure 6 shows the measurement results of the molecular beam intensity overshoot immediately after the cell shutter is opened.
Figure 7 shows the measurement results of the relationship between the In x Ga 1-x As composition and the group ( In and Ga) molecular beam intensity ratio.
The AES analysis results in the thickness direction of the Ga 1-x As layer, Figure 8, show the growth rate of the In 0.53 Ga 0.47 As single crystal thin film,
FIG. 9 is a diagram for explaining the MBE growth method of the present invention, showing the measurement results regarding the relationship with the group (Ga+In) molecular beam intensity. A...P-type GaAs, B...P-type GaxAl 1-x As,
C...Non-doped GaAs well, D...Non-doped GaxAl 1-x As barrier, E...n-type GaxAl 1-x As,
F...n-type GaAs, 1,16...substrate holder,
2, 18... board, 3, 6... cell shutter,
4, 9... Raw material A, 5, 8, 11, 12... Cell, 7, 10... Raw material B, 17... Rotating shaft, 13
. . . Mask with holes, 14 . . . Region where raw material molecules A reach, 15 . . . Region where raw material molecules B reach.
Claims (1)
晶薄膜周期構造の形成方法において、成長室中に
一つの穴のあいたマスクを設け、As等のV族分
子は成長室に充たし、複数の族分子セルから出
た分子ビームが中央のマスクの穴を通り基板ホル
ダー上の半導体基板に当たるように基板ホルダー
を特定の軸のまわりに回転させることによつて異
なる−族半導体薄膜を周期的に連続成長させ
ることを特徴とするMBE成長方法。1. In a method for forming a periodic structure of a - group compound semiconductor single crystal thin film by MBE growth, a mask with one hole is provided in the growth chamber, the growth chamber is filled with group V molecules such as As, and group V molecules such as A s are collected from multiple group molecule cells. By rotating the substrate holder around a specific axis so that the emitted molecular beam passes through the hole in the central mask and hits the semiconductor substrate on the substrate holder, different − group semiconductor thin films are periodically and continuously grown. Characteristic MBE growth method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59000524A JPS60145998A (en) | 1984-01-07 | 1984-01-07 | Mbe growth method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59000524A JPS60145998A (en) | 1984-01-07 | 1984-01-07 | Mbe growth method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60145998A JPS60145998A (en) | 1985-08-01 |
| JPH0144680B2 true JPH0144680B2 (en) | 1989-09-28 |
Family
ID=11476152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59000524A Granted JPS60145998A (en) | 1984-01-07 | 1984-01-07 | Mbe growth method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60145998A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6261315A (en) * | 1985-09-11 | 1987-03-18 | Sharp Corp | Molecular beam epitaxy device |
| JPH05114768A (en) * | 1991-04-12 | 1993-05-07 | Texas Instr Inc <Ti> | Superlattice formation method |
-
1984
- 1984-01-07 JP JP59000524A patent/JPS60145998A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60145998A (en) | 1985-08-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Ploog | Molecular beam epitaxy of III–V compounds | |
| US5316615A (en) | Surfactant-enhanced epitaxy | |
| Parker et al. | Observation and control of the amphoteric behaviour of Si-doped InSb grown on GaAs by MBE | |
| US5490880A (en) | Compound semiconductors and a method for thin film growth | |
| Kim et al. | Thermal-strain-induced splitting of heavy-and light-hole exciton energies in CuI thin films grown by vacuum evaporation | |
| Feng et al. | New III–V semiconductor InGaAsBi alloy grown by molecular beam epitaxy | |
| Cheng et al. | Molecular‐beam epitaxial growth of uniform Ga0. 47In0. 53As with a rotating sample holder | |
| Tadokoro et al. | Growth and characterization of CdS epilayers on (100) GaAs by atomic layer epitaxy | |
| Yurasov et al. | Structural and electrical properties of Ge-on-Si (0 0 1) layers with ultra heavy n-type doping grown by MBE | |
| US4935382A (en) | Method of making a semiconductor-insulator-semiconductor structure | |
| Moiseev et al. | Type II broken-gap InAs/GaIn0. 17As0. 22Sb heterostructures with abrupt planar interface | |
| EP0215436A2 (en) | Method of growth of thin film layer for use in a composite semiconductor | |
| Henini | Molecular beam epitaxy: from research to manufacturing | |
| JPS60145998A (en) | Mbe growth method | |
| US5628834A (en) | Surfactant-enhanced epitaxy | |
| JPS60100422A (en) | Mbe growing process for forming single crystal thin film cyclic structure | |
| EP0062818B1 (en) | Process of producing a Hall element or magnetoresistive element comprising an indium-antimony complex crystal semiconductor | |
| Brunner et al. | Influence of growth conditions on the photoluminescence of pseudomorphic MBE grown Si1-xGex quantum wells | |
| JPS6247839B2 (en) | ||
| JPS63137415A (en) | Method for forming single crystal thin film | |
| JPS6247840B2 (en) | ||
| Van Hove et al. | Analysis of growth parameters and strain in GaInSb/InAs superlattices | |
| US4539178A (en) | Indium-antimony complex crystal semiconductor and process for production thereof | |
| JP2563530B2 (en) | Superlattice structure element | |
| JP2612467B2 (en) | Heterogeneous structure thin film simultaneous growth equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |