JPH0146640B2 - - Google Patents

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Publication number
JPH0146640B2
JPH0146640B2 JP59239561A JP23956184A JPH0146640B2 JP H0146640 B2 JPH0146640 B2 JP H0146640B2 JP 59239561 A JP59239561 A JP 59239561A JP 23956184 A JP23956184 A JP 23956184A JP H0146640 B2 JPH0146640 B2 JP H0146640B2
Authority
JP
Japan
Prior art keywords
component
fibers
melting point
conductive
conductive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59239561A
Other languages
Japanese (ja)
Other versions
JPS61118237A (en
Inventor
Itsupei Kato
Masao Takasu
Tsuneo Maruyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kureha Corp
Original Assignee
Kureha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kureha Corp filed Critical Kureha Corp
Priority to JP23956184A priority Critical patent/JPS61118237A/en
Priority to US06/694,638 priority patent/US4645566A/en
Priority to DE8585100822T priority patent/DE3564301D1/en
Priority to EP85100822A priority patent/EP0151448B1/en
Publication of JPS61118237A publication Critical patent/JPS61118237A/en
Publication of JPH0146640B2 publication Critical patent/JPH0146640B2/ja
Granted legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21HPULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H13/00Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
    • D21H13/10Organic non-cellulose fibres
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21HPULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H5/00Special paper or cardboard not otherwise provided for
    • D21H5/12Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/24Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Paper (AREA)
  • Non-Insulated Conductors (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

[産業上の利用分野] 本発明は、電子部品の製品包装用フイルムや工
程内防塵フイルム或いは電子機器の電磁波シール
ド用フイルムとして用いられる導電フイルムの製
造法に関する。詳しくは、得られるフイルムが比
較的薄く且つ連続的な製造が可能であるととも
に、低坪量品であつても十分な導電性と優れた強
度を有する導電フイルムを製造することのできる
方法に関する。 [従来技術] 半導体ICやLSI等の電子部品、プリント基板、
磁気テープ等は包装、出荷の工程で静電気による
ほこりの吸着や静電気帯電によるトラブルから製
品を保護する必要があり、特にMOS型のIC等は
静電気により絶縁破壊を起こしやすいので帯電防
止は不可欠となつている。これらの静電気障害か
ら製品を保護するためには表面抵抗率の低い導電
フイルムで包装することが考えられる。また、上
記IC等の製品は取引上包装された内容物を透視
して判断可能なことが望まれるので、導電フイル
ムで包装する場合には、導電フイルム自体がある
程度の透明性を有することが要求される。 上記のような導電フイルムを製造するについて
は、導電性や透明性の要請に答えることに加え
て、より優れた透明性を保持し且つフイルムがし
なやかさを有するためにできるだけ厚さの薄いフ
イルムが得られること、及び製造工程においてフ
イルムが破断しない十分な強度を有しシート状の
ものが連続的に製造可能であることが必要とされ
る。 また、コンピユータ、計測機器等の電子機器産
業分野では、組み立て工程の他で静電気シール
ド、電磁波シールドの機能を有する導電フイルム
が必要とされている。これらの用途のものは必ず
しも透明性は要求されないが、十分な導電性と製
品強度が必要とされ、またシート状のものの連続
的製造が望される。 従来、ポリオレフイン系合成パルプに炭素繊維
を混入して紙料を抄紙し、得られる紙状物をポリ
オレフイン成分の融点以上の温度で熱融合させる
導電性ポリオレフイン材料の製造法が提案されて
いる(特公昭52−13214号)。また、炭素繊維の代
わりにステンレス繊維を使用した製造法も提案さ
れている(特公昭56−41760号)。 しかしながら、本発明者の実験によれば、ポリ
オレフイン系合成パルプと炭素繊維又はステンレ
ス繊維のみからなる導電フイルムを製造する場合
には、ポリオレフイン系合成パルプに物理的、化
学的結合性が殆どないため得られる紙状物の引張
強度、引裂き強さ、表面強度が弱く、ポリオレフ
インの熱融合前の工程においてフイルムが裂断す
る等してしまい、シート状のものを巻き取りなが
ら連続的に製造することは実際上困難であり、ま
た坪量の小さい薄手のフイルムで且つ十分な導電
性と強度を有する製品を製造することは不可能で
あつた。 強度不足を補うために熱水溶解性ポリビニルア
ルコール繊維状バインダーのごとき単一成分のバ
インダーを合成パルプと併用することが考えられ
るが、融点が低すぎるため抄紙機ドライヤーに溶
融したバインダーが付着するのでシートに粕が付
着したり、穴の発生や断紙の原因ともなるので好
ましくない。 補強材を用いることなく、ポリオレフイン系合
成パルプをドライパートで溶融することにより強
度を得ることは可能であるが問題が多い。 例えば合成パルプが溶融する直前のホケ、加熱
溶融が不均一になり、部分的な伸び更にシワの発
生等の問題があり、最終的に低坪量の精度の高い
フイルムを得ることは不可能である。 [発明が解決しようとする問題点] 本発明は、大きな強度を有し抄造性に優れ、製
造工程及び加工工程において裂断することがなく
連続的に薄手の導電フイルムを製造する方法を提
供するとともに、低坪量品であつても十分な導電
性を有するフイルムを得ること、並びに必要に応
じて材料の調整によつて優れた透明性を有する導
電フイルムを得ることを可能とし、前記従来の方
法における問題点を解決すべくなされたものであ
る。 [問題点を解決しようとする手段] 本発明においては、後に述べる熱可塑性複合繊
維を紙料に配配合してこの複合繊維の特性を利用
し、製造工程における加熱温度の制御によつて、
強度の優れた導電フイルムの連続的製造を可能に
するとともに、実験により最適な製造条件を見出
した。 即ち、本発明は、熱可塑性合成パルプ94.5〜40
容量%に、該熱可塑性合成パルプの融点よりも低
い融点を有する第1成分と該熱可塑性合成パルプ
の融点よりも高い融点を有する第2成分とからな
る熱可塑性複合繊維5〜30容量%及び導電繊維
(炭素繊維のみからなるものを除く)0.5〜30容量
%を混合してなる紙料を用いて湿紙を形成した
後、前記第1成分の融点以上で前記熱可塑性合成
パルプの融点よりも低い温度で加熱乾燥して第1
成分を溶融し、紙料が相互に接着された原紙を抄
造し、しかる後、該原紙を前記熱可塑性合成パル
プの融点以上で前記第2成分の融点より低い温度
で加熱、加圧して熱可塑性合成パルプを溶融し、
前記第2成分と前記導電繊維が分散されたフイル
ムを形成することを特徴とする面方向比抵抗1×
106Ω−cm以下の導電フイルムの製造法に関する。 (熱可塑性合成パルプ) 本発明において用いる熱可塑性合成パルプとし
ては、熱可塑性合成樹脂から成るパルプ等の抄紙
可能な繊維状物質をいう。 また、熱可塑性合成樹脂としては、ポリオレフ
イン、ポリアクリロニトリル、ポリエステル、ポ
リアミド等であり、加熱による溶融で透明化し、
冷却によつて固体高分子にもどつてもその透明性
を保持するものであればよい。これらのうち特に
好ましいのは融点が低く比較的廉価なポリオレフ
インであり、ポリオレフインとは、ポリエチレ
ン、ポリプロピレン、エチレンとプロピレンの共
重合物、エチレン又はプロピレンとα−オレフイ
ンとの共重合物、エチレン又はプロピレンと酢酸
ビニル、アクリル酸等との共重合物、又はこれら
の混合物又はこれらを更に化学処理した重合物等
を含むものである。尚、導電フイルムのヒートシ
ール性を考慮した場合には融点が200℃以下、特
に170℃以下のものが好ましい。 (導電繊維) 本発明において用いられる導電繊維とは、各種
の金属繊維又は、炭素繊維やガラス繊維等の無機
繊維の表面を金属で被覆した金属被覆繊維等が主
なものであるが、これらの他にも短繊維状とする
ことができ、且つ面方向比抵抗値の小さい材質、
例えば金属蒸着フイルムを繊維状に切断したもの
や、ポリアセチレン等の有機導電性繊維等も使用
可能である。 金属繊維としては、スチール繊維、ステンレ
ス・スチール繊維、アルミニウム繊維、シンチユ
ウ繊維、銅繊維、青銅繊維等があるが表面が酸化
されにくいステンレス・スチール繊維、アルミニ
ウム繊維、シンチユウ繊維等が扱いやすく望まし
い。これらの金属繊維は一般に引抜き法等により
種々の直径のものが製造されているが、本発明に
おいて用いるには、直径が1〜100μm、好まし
くは20μm以下で、繊維長が1〜40mm、好ましく
は3〜25mmのものがよい。直径が100μmを超え
ると製品となるフイルムの厚さが100μm以上と
なつて望ましくないし、繊維の重量のために繊維
がフイルムの片側に沈澱しやすく配合が不均一と
なるおそれがある。また、繊維は太い方がフイル
ムの不透明度を小かくしやすいが、製紙上均一に
分散させるためには、直径を20μm以下とするの
が望ましい。 繊維長が1mm以下の短いものでは、フイルム内
で繊維によるネツトワークの構成が難しくなるの
で好ましくなく、一方40mm以上となると、導電フ
イルム内に比較的に広範囲な繊維不在箇所や巨大
な繊維集塊を作りやすくなるので好ましくない。 炭素繊維やガラス繊維に金属を被覆した金属被
覆繊維を用いる場合にも、被覆される金属はアル
ミニウムやニツケル等の酸化されにくいものが望
ましい。 芯材となる炭素繊維としては、約1400℃以下の
比較的低温で焼成されるものから、より高温で焼
成して得られる黒鉛質のものまで用いることがで
きる。炭素繊維の形態としては、繊維長1〜40
mm、糸径5〜30μmの短繊維(チヨツプドフアイ
バ)が好ましく、この繊維の表面にアルミニウム
やニツケル等の金属を無電解メツキや真空蒸着等
の方法により0.5〜30μm程度の厚さ被覆したもの
を導電繊維として用いることができる。ガラス繊
維を芯材とする場合には、切断長さ7〜10mm、直
径10〜15μm程度のガラスのチヨツプドストラン
ドに、真空蒸着や金属浴への浸漬等の方法により
アルミニウムやニツケル等の金属を305μmの厚
さ被覆した市販のものを用いることができる。 導電繊維の紙料中への配合量は、少なずぎる
と、繊維同志の接触が不十分となり、面方向比抵
抗の小さい導電フイルムが得られないし、また導
電繊維があまり多すぎると、製品の強度が劣るこ
とに加えて均一なフイルムが得られにくくなる。
導電繊維の最適な配合割合は、用いる導電繊維の
種類や太さによつて変動しうるが、面方向比抵抗
が1×106Ω−cm以下の導電フイルムを得るには、
少なくとも0.5容量%以上、製品強度とフイルム
の均一性の点からは、30容量%以下配合する。 電磁波シールド用には、導電繊維を比較的多く
配合することが望ましい。 また、導電繊維の配合量は得られる導電フイル
ムの透明性に関係するので透明性の要求される用
途に用いる場合には、用途に応じた配合量の調整
を行う。不透明度を30%以下に確保したい場合に
は、導電繊維の量を、その太さに応じて配合し、
導電繊維の直径が5〜10μmの場合には7容量%
以下、10〜15μmの場合には12容量%以下、15〜
20μmの場合には30容量%以下とするのが望まし
い。 (熱可塑性複合繊維) 本発明においては上記原料に加えて、熱可塑性
合成パルプの融点よりも低い融点を有する第1成
分と熱可塑性合成パルプの融点よりも高い融点を
有する第2成分とからなる熱可塑性複合繊維を配
合する。 熱可塑性複合繊維とは、融点の異なる熱可塑性
樹脂2種以上から構成される繊維であり、一般に
複合紡糸法等によつて製造されるものである。1
例として特公昭48−15684号に開示されるものが
挙げられる。複合の第1成分と第2成分は、前記
した熱可塑性合成パルプのうち使用する合成パル
プの融点に応じて適宜選定される。例えば、合成
パルプとして、融点が120℃程度のポリエチレン
系合成パルプを用いる場合、これより低い融点を
有する低密度ポリエチレンを第1成分とし、ポリ
プロピレンを第2成分とする複合繊維を用いるこ
とができる。第1成分としては他にエチレン酢酸
ビニル共重合体やポリビニルアルコール等の比較
的融点の低いもの、第2成分としてはポリエステ
ル等がある。第1成分と第2成分は、それぞれ合
成パルプと同系のものであつても、融点において
差のあるものであれば使用できる。また、逆に、
複合繊維が決まれば、複合繊維の第1成分より融
点が高く、第2成分より融点が低いものとして熱
可塑性合成パルプを選択することもできる。 複合繊維の形態は、融点の高い第2成分を芯と
し、融点の低い第1成分を鞘とした同心状の或い
は偏心状の構造や芯部分が繊維の表面に露出した
ものの他、第1成分と第2成分が連続的で変則的
に複合しているものでもよく、高融点の第2成分
が溶融する以前の温度で、第1成分が、原紙の配
合原料中で他の紙料を相互に結合できるように複
合繊維の外部に溶出可能な形態であれば特に制限
されない。 また、複合繊維は、抄紙工程中の脱落を防止
し、且つ均一な配合を可能とするため繊維長が2
〜40mm程度のものが望ましく、特に好ましくは3
〜15mmのものであり、単繊度は1〜30デニール、
好ましくは1.5〜8デニールのものである。 上記複合繊維は、5〜30容量%の割合で配合す
る。5容量%以下では、原紙に強度を与える補強
効果が不十分であり、配合割合を増加するほど原
紙の引裂き強さは大となるが、20容量%以上では
強度の向上の度合がやや緩やかとなる。他方、配
合割合が30容量%を超えると、加熱、加圧処理後
得られる導電フイルム中に空隙が多発し均一なフ
イルムが製造できないし、製品の強度も劣ること
になる。原紙及び導電フイルム双方の特性上、特
に望ましい配合割合は10〜20容量%である。 (製造工程) 本発明方法においては、先ず、熱可塑性合成パ
ルプと導電繊維及び熱可塑性複合繊維を混合す
る。混合に際しては、熱可塑性合成パルプを予め
温水等に投入、撹拌して離解しておき、導電繊維
と複合繊維の方も水等に分散させておき、これら
を混合する。更に必要に応じて、化学パルプ等を
配合する場合には叩解したものを上記原料に混合
する。 混合紙料は十分に撹拌して均一なものとして抄
紙工程に送る。 抄紙においては、通常の製紙技術において用い
られる、すき網部、圧搾部、乾燥部等からなる抄
紙機を用いることができる。 上記紙料から形成される湿紙を、乾燥部で熱可
塑性複合繊維の第1成分の融点以上で、熱可塑性
合成パルプの融点より低い温度で加熱乾燥して、
第1成分のみを溶融して紙料が相互に接着された
原紙を抄造する。乾燥して得られた原紙は加熱加
圧される。加熱、加圧は通常製紙工程で紙に光沢
をつけ表面を平滑にするカレンダー処理やホツト
プレス処理等により行なうことができ、圧力条件
としては通常のカレンダー処理による40〜200Kg/
cmの線圧或いはホツトプレスによる場合には60〜
200Kg/cm2の圧力下で適宜選定する。また同様の条
件であればプラスチツク用カレンダーによる処理
でも行うことができる。 加熱、加圧の温度条件は、熱可塑性合成パルプ
の融点以上で熱可塑性複合繊維の第2成分の融点
より低い温度とし、得られた導電フイルム中には
第2成分と導電繊維が分散されたネツトワークが
形成される。 尚、本発明の発明思想を害しない範囲で、高強
度材料や高融点材料を更に配合することは何等差
し支えない。また、化学パルプ等の製紙用パルプ
を更配合してもよい。 導電繊維の種類によつては、化学パルプ等の製
紙用パルプを配合したものの方が帯電した静電気
の電荷の散逸速度が著しく大きくなる効果があ
る。 [作 用] 本発明方法においては、紙料中に、融点の異な
る成分で構成される複合繊維を配合し、第1段階
として、低融点の第1成分のみが溶融する温度で
加熱乾燥するため、低融点の第1成分が溶融して
他の紙料を結合するバインダーとしての役割を果
たすとともに、この第1成分が溶融しても、高融
点の第2成分が繊維の形態を保持し補強効果を発
揮し、原紙の引張り強さ及び引裂強度が大とな
る。また、第2段階の加熱、加圧処理後製造され
る導電フイルムは、各紙料が好適に接着されて形
成されるとともに第2成分の補強効果によつて強
度の優れたものとなる。 実験例 1 紙料として次のものを用いた。 熱可塑性合成パルプとして SWP UL−410(三井石油化学製 ポリエチレン
系樹脂、融点123℃、比重0.94、平均繊維長0.9
mm、白色度94%以上) 以下これをSWPと略す。 導電繊維として ステンレス・スチール繊維(日本冶金製 平均繊
維長3mm、直径8μm) 以下これをSSFと略す。 複合繊維として NBF −E(大和紡製 第1成分エチレン酢ビ共
重合体(融点96〜100℃)と第2成分ポリプロピ
レン(融点165〜170℃)からなり第1成分が鞘で
第2成分が芯の鞘芯型、繊維長5mm、繊度2デニ
ール〕 以下これをNBFと略す。 SSFのみは0.6容量%の一定量とし、SWPは
69.4〜99.4容量%、NBFは0〜30容量%の範囲で
それぞれの配合比率を変えて米(メートル)坪量
50g/m2の各種シートを作製した。 SWPとNBFとSSFはそれぞれ水に分散させた
後混合し紙料とした。乾燥はNBFの低融点の第
1成分の融点以上でSWPの融点以下の100〜115
℃で行い各種原紙を得た。 NBF配合率と裂断長及び比引裂き強さの関係
を第1図及び第2図に示す。 第1図から、NBF配合率5容量%以下加えて
も裂断長はあまり向上しない。5容量%以上裂断
長の向上が現れ、10容量%以上加えると著しい裂
断長の向上が見られる。20容量%以上になると裂
断長の向上の度合はやや緩やかとなり、30容量%
以上ではほぼ頭打ちとなる。 第2図から、NBF配合率の増加に伴い比引裂
き強さの向上が見られる。 次に、これらの原紙を試験用スーパーカレンダ
ーで加熱、加圧処理し透明シートを得た。スーパ
ーカレンダー条件は線圧60Kg/cm、速度4.5m/
分、ロール表面温度130℃で処理した。 フイルム化したシートの特性とNBF配合率の
関係を以下に示す。 第3図から、NBF配合率20容量%までは配合
率の増加に伴い裂断長も高くなるが、それ以上で
はほぼ一定の値を示す。 第4図によれば、フイルムの不透明度はNBF
の配合率に拘わらず10%以下であり、透明性の高
いフイルムが得られる。 尚、面方向比抵抗はSRIS2301に準拠したが、
NBFの有無に拘わらず面方向比抵抗、帯電圧及
び半減期に差は見られず、NBFがシートの電気
特性に悪影響を及ぼさないことが判明した。 以上の実験結果から、原紙の抄紙及び加熱、加
圧処理の作業上必要とされる裂断長及び比引裂き
強さはNBFの配合率5容量%以上で満される。 またフイルム化したシートの強度に対しても
NBFは有効に働き、電気的特性に対しては悪影
響を及ぼさないことが認められる。しかし、
NBFが剛直な繊維形態であるため、配合率30容
量%以上のものは加熱加圧後に得られるフイルム
に空隙が生じるようになり、目的とするフイルム
が得にくくなる。よつてNBFの配合率は30容量
%以下とする必要があり、作業性に係る強度の点
からは5容量%以上、望ましくは10容量%以上と
する。 実験例 2 SWP/NBF/SSFの配合比が容量%で、
62.8/26.9/10.3(重量比35/15/50)の紙料を用
いて、目標坪量30g/m2、50g/m2、100g/m2
200g/m2の4種のシート状のフイルムを作製し
た。各フイルムの特性は第1表の通りであつた。
面方向比抵抗はSRIS2301に準拠した(以下面方
向比抵抗の測定については同様)。
[Industrial Application Field] The present invention relates to a method for manufacturing a conductive film used as a product packaging film for electronic parts, an in-process dustproof film, or an electromagnetic shielding film for electronic equipment. Specifically, the present invention relates to a method for producing a conductive film that is relatively thin and can be manufactured continuously, and has sufficient conductivity and excellent strength even if it is a low basis weight product. [Conventional technology] Electronic components such as semiconductor ICs and LSIs, printed circuit boards,
Magnetic tape and other products need to be protected from problems caused by static electricity that attracts dust and electrostatic charges during the packaging and shipping process.In particular, MOS type ICs are susceptible to dielectric breakdown due to static electricity, so anti-static is essential. ing. In order to protect products from these electrostatic disturbances, packaging them with a conductive film with low surface resistivity may be considered. In addition, it is desirable for products such as the above-mentioned ICs to be able to see through and judge the packaged contents for transactions, so when packaging with conductive film, the conductive film itself is required to have a certain degree of transparency. be done. In order to manufacture the above-mentioned conductive film, in addition to meeting the demands for conductivity and transparency, it is also important to make the film as thin as possible in order to maintain superior transparency and make the film flexible. It is necessary that the film can be obtained, and that it has sufficient strength so that the film does not break during the manufacturing process, and that sheet-like products can be manufactured continuously. Furthermore, in the field of electronic equipment industry such as computers and measuring instruments, conductive films that have functions of electrostatic shielding and electromagnetic shielding in addition to assembly processes are required. Although transparency is not necessarily required for these uses, sufficient conductivity and product strength are required, and continuous production of sheet-like products is desired. Conventionally, a method for producing conductive polyolefin materials has been proposed in which paper stock is made by mixing carbon fibers into polyolefin-based synthetic pulp, and the resulting paper-like material is thermally fused at a temperature higher than the melting point of the polyolefin component. Publication No. 52-13214). A manufacturing method using stainless steel fibers instead of carbon fibers has also been proposed (Special Publication No. 41760/1983). However, according to the inventor's experiments, when producing a conductive film made only of polyolefin-based synthetic pulp and carbon fibers or stainless steel fibers, it is difficult to produce a conductive film because the polyolefin-based synthetic pulp has almost no physical or chemical bonding properties. The tensile strength, tear strength, and surface strength of the paper-like products produced are weak, and the film may tear during the process before heat fusing the polyolefin, making it impossible to continuously manufacture sheet-like products while winding them up. In practice, it has been difficult and impossible to manufacture a thin film with a small basis weight and sufficient electrical conductivity and strength. To compensate for the lack of strength, it is possible to use a single-component binder such as a hot water-soluble polyvinyl alcohol fibrous binder in combination with synthetic pulp, but the melting point is too low and the molten binder will stick to the dryer of the paper machine. This is undesirable as it may cause lees to adhere to the sheet, create holes, or cause paper breakage. Although it is possible to obtain strength by melting polyolefin synthetic pulp in a dry part without using reinforcing materials, there are many problems. For example, synthetic pulp has problems such as blistering just before it melts, uneven heating and melting, partial elongation, and wrinkles, making it impossible to obtain a highly accurate film with a low basis weight. be. [Problems to be Solved by the Invention] The present invention provides a method for continuously manufacturing a thin conductive film that has high strength and excellent paper formability and does not tear during the manufacturing and processing steps. At the same time, it is possible to obtain a film with sufficient conductivity even if it is a low basis weight product, and to obtain a conductive film with excellent transparency by adjusting the material as necessary, and it is possible to obtain a conductive film with excellent transparency even if it is a low basis weight product. This was done to solve problems in the method. [Means for solving the problem] In the present invention, thermoplastic conjugate fibers described later are blended into paper stock, utilizing the properties of this conjugate fiber, and by controlling the heating temperature in the manufacturing process,
In addition to making it possible to continuously manufacture a conductive film with excellent strength, we also discovered the optimal manufacturing conditions through experiments. That is, the present invention uses thermoplastic synthetic pulp 94.5 to 40
5 to 30% by volume of thermoplastic composite fibers consisting of a first component having a melting point lower than the melting point of the thermoplastic synthetic pulp and a second component having a melting point higher than the melting point of the thermoplastic synthetic pulp; After forming a wet paper using a paper stock made by mixing 0.5 to 30% by volume of conductive fibers (excluding those consisting only of carbon fibers), the temperature is higher than the melting point of the first component and lower than the melting point of the thermoplastic synthetic pulp. The first one is heated and dried at a low temperature.
The components are melted to form a base paper in which the paper stocks are mutually bonded, and then the base paper is heated and pressurized at a temperature higher than the melting point of the thermoplastic synthetic pulp and lower than the melting point of the second component to make it thermoplastic. Melt synthetic pulp,
The in-plane specific resistance 1× is characterized in that the second component and the conductive fibers form a dispersed film.
This invention relates to a method for manufacturing a conductive film having a resistance of 10 6 Ω-cm or less. (Thermoplastic synthetic pulp) The thermoplastic synthetic pulp used in the present invention refers to a fibrous material that can be made into paper, such as pulp made of a thermoplastic synthetic resin. In addition, thermoplastic synthetic resins include polyolefin, polyacrylonitrile, polyester, polyamide, etc., which become transparent when melted by heating.
Any material may be used as long as it maintains its transparency even when it returns to a solid polymer upon cooling. Among these, particularly preferred are polyolefins that have a low melting point and are relatively inexpensive. Polyolefins include polyethylene, polypropylene, copolymers of ethylene and propylene, copolymers of ethylene or propylene and α-olefin, ethylene or and vinyl acetate, acrylic acid, etc., a mixture thereof, or a polymer obtained by further chemically treating these. In addition, when considering the heat sealability of the conductive film, it is preferable that the melting point is 200°C or lower, particularly 170°C or lower. (Conductive fiber) The conductive fiber used in the present invention is mainly a variety of metal fibers or metal-coated fibers made by coating the surface of inorganic fibers such as carbon fibers or glass fibers with metal. In addition, materials that can be made into short fibers and have a small specific resistance value in the planar direction,
For example, metal-deposited films cut into fibers, organic conductive fibers such as polyacetylene, etc. can also be used. Examples of metal fibers include steel fibers, stainless steel fibers, aluminum fibers, cinched fibers, copper fibers, bronze fibers, etc., but stainless steel fibers, aluminum fibers, cinched fibers, etc. whose surfaces are resistant to oxidation are preferred because they are easy to handle. These metal fibers are generally produced in various diameters by a drawing method, etc., but for use in the present invention, fibers with a diameter of 1 to 100 μm, preferably 20 μm or less, and a fiber length of 1 to 40 mm, preferably 3 to 25 mm is best. If the diameter exceeds 100 μm, the resulting film will have a thickness of 100 μm or more, which is undesirable, and due to the weight of the fibers, the fibers tend to settle on one side of the film, which may result in non-uniform blending. Further, the thicker the fibers, the easier it is to reduce the opacity of the film, but in order to ensure uniform dispersion in papermaking, it is desirable that the diameter be 20 μm or less. If the fiber length is short, 1 mm or less, it becomes difficult to construct a network of fibers within the film, which is undesirable. On the other hand, if the fiber length is 40 mm or more, there may be relatively wide areas where fibers are absent or large fiber agglomerates within the conductive film. This is not preferable because it makes it easier to create. Even when using metal-coated fibers in which carbon fibers or glass fibers are coated with metal, it is desirable that the coated metal be oxidizable, such as aluminum or nickel. As the carbon fiber serving as the core material, it is possible to use carbon fibers ranging from those fired at a relatively low temperature of about 1400° C. or less to graphitic fibers fired at higher temperatures. The form of carbon fiber has a fiber length of 1 to 40
Chopped fibers with a thread diameter of 5 to 30 μm are preferable, and the surface of these fibers is coated with metal such as aluminum or nickel to a thickness of about 0.5 to 30 μm by electroless plating or vacuum deposition. The obtained fibers can be used as conductive fibers. When glass fiber is used as the core material, aluminum, nickel, etc. are applied to chopped glass strands with a cut length of 7 to 10 mm and a diameter of 10 to 15 μm by vacuum deposition or immersion in a metal bath. A commercially available product coated with metal to a thickness of 305 μm can be used. If the amount of conductive fibers added to the paper stock is too small, the contact between the fibers will be insufficient, making it impossible to obtain a conductive film with low in-plane resistivity, and if the amount of conductive fibers is too large, the strength of the product will decrease. In addition to being inferior, it becomes difficult to obtain a uniform film.
The optimal blending ratio of the conductive fibers may vary depending on the type and thickness of the conductive fibers used, but in order to obtain a conductive film with an in-plane specific resistance of 1×10 6 Ω-cm or less,
It should be blended at least 0.5% by volume, but not more than 30% by volume from the viewpoint of product strength and film uniformity. For electromagnetic shielding, it is desirable to incorporate a relatively large amount of conductive fiber. Furthermore, since the amount of conductive fibers to be blended is related to the transparency of the resulting conductive film, when used for applications that require transparency, the amount to be blended is adjusted depending on the application. If you want to keep the opacity below 30%, mix the amount of conductive fibers according to their thickness.
7% by volume if the diameter of the conductive fiber is 5 to 10 μm
Below, in case of 10~15μm, 12% by volume or less, 15~
In the case of 20 μm, it is desirable to set it to 30% by volume or less. (Thermoplastic composite fiber) In addition to the above raw materials, the present invention comprises a first component having a melting point lower than the melting point of the thermoplastic synthetic pulp and a second component having a melting point higher than the melting point of the thermoplastic synthetic pulp. Blending thermoplastic composite fibers. Thermoplastic composite fibers are fibers composed of two or more types of thermoplastic resins having different melting points, and are generally produced by a composite spinning method or the like. 1
An example is the one disclosed in Japanese Patent Publication No. 48-15684. The first component and the second component of the composite are appropriately selected depending on the melting point of the synthetic pulp used among the thermoplastic synthetic pulps described above. For example, when using polyethylene-based synthetic pulp with a melting point of about 120° C. as the synthetic pulp, a composite fiber containing low-density polyethylene having a lower melting point as the first component and polypropylene as the second component can be used. Other examples of the first component include those having relatively low melting points such as ethylene vinyl acetate copolymer and polyvinyl alcohol, and examples of the second component include polyester. Even if the first component and the second component are similar to synthetic pulp, they can be used as long as they have different melting points. Also, conversely,
Once the composite fiber is determined, a thermoplastic synthetic pulp may be selected as having a melting point higher than the first component of the composite fiber and lower than the second component. Composite fibers have a concentric or eccentric structure in which the second component with a high melting point is the core and the first component with the low melting point is the sheath, or the core part is exposed on the surface of the fiber. The second component and the second component may be continuously and irregularly combined, and the first component mutually binds the other paper materials in the blended raw materials of the base paper at a temperature before the high melting point second component melts. There is no particular restriction as long as it is in a form that can be eluted to the outside of the composite fiber so that it can be bonded to the composite fiber. In addition, composite fibers have a fiber length of 2 to prevent them from falling off during the papermaking process and to enable uniform blending.
It is desirable to have a diameter of about 40mm, particularly preferably 3mm.
~15mm, single fineness 1~30 denier,
Preferably it has a denier of 1.5 to 8. The above composite fibers are blended in a proportion of 5 to 30% by volume. If it is less than 5% by volume, the reinforcing effect that gives strength to the base paper is insufficient, and as the blending ratio increases, the tear strength of the base paper will increase, but if it is more than 20% by volume, the degree of strength improvement will be somewhat gradual. Become. On the other hand, if the blending ratio exceeds 30% by volume, there will be many voids in the conductive film obtained after heating and pressure treatment, making it impossible to produce a uniform film, and the strength of the product will be poor. Considering the characteristics of both the base paper and the conductive film, a particularly desirable blending ratio is 10 to 20% by volume. (Manufacturing process) In the method of the present invention, first, thermoplastic synthetic pulp, conductive fibers, and thermoplastic composite fibers are mixed. When mixing, the thermoplastic synthetic pulp is placed in hot water or the like in advance and stirred to disintegrate it, and the conductive fibers and composite fibers are also dispersed in water or the like, and then these are mixed. Furthermore, if necessary, when blending chemical pulp or the like, the beaten pulp is mixed with the above raw materials. The mixed paper stock is sufficiently stirred to make it homogeneous and sent to the paper making process. In papermaking, a papermaking machine that is used in normal papermaking technology and is composed of a screen section, a pressing section, a drying section, etc. can be used. Wet paper formed from the above paper stock is heated and dried in a drying section at a temperature higher than the melting point of the first component of the thermoplastic composite fiber and lower than the melting point of the thermoplastic synthetic pulp,
Only the first component is melted to produce a base paper in which paper stock is bonded to each other. The base paper obtained by drying is heated and pressurized. Heating and pressure can be done by calendering or hot press treatment, which makes the paper glossy and smooth the surface in the normal papermaking process, and the pressure conditions are 40 to 200 kg/kg by normal calendering.
cm linear pressure or hot press: 60~
Select appropriately under a pressure of 200Kg/cm 2 . Further, under similar conditions, treatment using a plastic calendar can also be carried out. The temperature conditions for heating and pressurizing were set to a temperature higher than the melting point of the thermoplastic synthetic pulp and lower than the melting point of the second component of the thermoplastic composite fiber, and the second component and conductive fibers were dispersed in the obtained conductive film. A network is formed. It should be noted that there is no problem in adding a high-strength material or a high-melting point material to the extent that it does not impair the inventive idea of the present invention. Further, papermaking pulp such as chemical pulp may be added. Depending on the type of conductive fiber, those containing paper-making pulp such as chemical pulp have the effect of significantly increasing the dissipation rate of static electricity. [Function] In the method of the present invention, composite fibers composed of components with different melting points are blended into the paper stock, and as a first step, the fibers are heated and dried at a temperature at which only the first component with a low melting point melts. , the first component with a low melting point melts and plays the role of a binder that binds other paper stocks, and even if this first component melts, the second component with a high melting point maintains the fiber shape and strengthens it. It is effective and increases the tensile strength and tear strength of the base paper. Further, the conductive film produced after the second stage of heating and pressure treatment is formed by suitably adhering the respective paper materials and has excellent strength due to the reinforcing effect of the second component. Experimental Example 1 The following was used as paper stock. As a thermoplastic synthetic pulp, SWP UL-410 (manufactured by Mitsui Petrochemicals, polyethylene resin, melting point 123℃, specific gravity 0.94, average fiber length 0.9)
mm, whiteness of 94% or more) This is hereinafter abbreviated as SWP. The conductive fiber is stainless steel fiber (manufactured by Nippon Yakin, average fiber length 3 mm, diameter 8 μm), hereinafter abbreviated as SSF. The composite fiber is NBF-E (manufactured by Daiwabo Co., Ltd.) The first component is ethylene vinyl acetate copolymer (melting point 96-100℃) and the second component polypropylene (melting point 165-170℃).The first component is a sheath and the second component is a sheath. Core sheath-core type, fiber length 5 mm, fineness 2 denier] This is hereinafter abbreviated as NBF. Only SSF is a constant amount of 0.6% by volume, and SWP is
The rice (meter) basis weight was determined by varying the blending ratio in the range of 69.4 to 99.4 volume% and NBF from 0 to 30 volume%.
Various sheets of 50 g/m 2 were produced. SWP, NBF, and SSF were each dispersed in water and then mixed to make paper stock. Drying is performed at a temperature of 100 to 115, above the melting point of the first component with a low melting point of NBF and below the melting point of SWP.
The test was carried out at ℃ to obtain various base papers. The relationship between the NBF blending ratio, tear length, and specific tear strength is shown in Figures 1 and 2. From FIG. 1, even if NBF is added at a blending rate of 5% by volume or less, the breaking length does not improve much. An improvement in the breaking length appears when adding 5% by volume or more, and a significant improvement in the breaking length is seen when adding 10% by volume or more. At 20% by volume or more, the degree of improvement in fracture length becomes somewhat gradual, and at 30% by volume,
At this point, it has almost reached a plateau. From FIG. 2, it can be seen that the specific tear strength improves as the NBF content increases. Next, these base papers were heated and pressurized using a test supercalender to obtain a transparent sheet. Super calendar conditions are linear pressure 60Kg/cm, speed 4.5m/
The treatment was carried out at a roll surface temperature of 130°C. The relationship between the properties of the film sheet and the NBF blending ratio is shown below. From FIG. 3, it can be seen that the fracture length increases as the NBF content increases up to 20% by volume, but remains almost constant above that. According to Figure 4, the opacity of the film is NBF
Regardless of the blending ratio, it is 10% or less, and a highly transparent film can be obtained. In addition, although the in-plane specific resistance complies with SRIS2301,
Regardless of the presence or absence of NBF, no difference was observed in the in-plane resistivity, charging voltage, or half-life, indicating that NBF does not adversely affect the electrical properties of the sheet. From the above experimental results, the tearing length and specific tear strength required for paper making and heating and pressure treatment of the base paper are satisfied when the NBF blending ratio is 5% by volume or more. Also, regarding the strength of the film sheet,
It is recognized that NBF works effectively and does not have a negative effect on electrical characteristics. but,
Since NBF is in the form of rigid fibers, if the blending ratio exceeds 30% by volume, voids will appear in the film obtained after heating and pressing, making it difficult to obtain the desired film. Therefore, the blending ratio of NBF needs to be 30% by volume or less, and from the viewpoint of strength related to workability, it should be 5% by volume or more, preferably 10% by volume or more. Experimental example 2 The blending ratio of SWP/NBF/SSF is volume %,
Using paper stocks of 62.8/26.9/10.3 (weight ratio 35/15/50), target basis weights are 30g/m 2 , 50g/m 2 , 100g/m 2 ,
Four types of sheet-like films of 200 g/m 2 were produced. The properties of each film were as shown in Table 1.
Planar resistivity was based on SRIS2301 (the same applies to measurements of planar resistivity below).

【表】 第1表の結果から、目標坪量が30g/m2、50g/
m2のような低坪量品であつても、面方向比抵抗が
高坪量品と比べて遜色のないものが得られること
が判る。また、低坪量品ほど不透明度が小さく、
透明性が要求される分野での使用が可能である。 次にプラスチツクシールド材評価装置(タケダ
理研工業(株)、TR17301)を用い第1表の導電フ
イルム50g/m2品について各周波数(MHz)に対
するシールド効果(電界)を測定し、第5図に示
した。図示のごとく100MHzまでの領域では30dB
以上で電磁波シールド効果を有することが判つ
た。なお、シールド効果(磁界)についてもほぼ
同様の効果が認められた。 実施例 1 熱可塑性合成パルプとしてSWPの一定量を50
℃の温水に投入して3%の濃度とし、撹拌機で離
解した。また熱可塑性複合繊維としてNBFの一
定量を常温の水中に分散させた。更に導電繊維と
してSSFを常温の水に1%の濃度となるように分
散させ、これに消泡剤を少量加えて調製した。 SWP/NBF/SSFの配合比を容量%で、
82.2/16.5/1.3(重量比75/15/10)となるよう
に採り混合槽に入れ20分以上撹拌し、ついで分散
剤を原料に対し少量加え、テストマシンによつて
米(メートル)坪量50g/m2を目標として原紙を
製造した。原紙の乾燥はNBFの鞘成分の融点96
〜100℃以上で、SWPの融点123℃以下の100〜
115℃で行つた。製造速度は30m/分で、ドライ
ヤーに特に離型処理をしなくても、ドライヤーか
らの剥離が良好で紙切れもなく容易に連続生産す
ることができた。この原紙を線圧60Kg/cm、ロー
ル表面温度はSWPの融点123℃以上でNBFの芯
成分の融点165〜170℃以下の130℃の条件でスー
パーカレンダー処理した。通紙速度は4.5m/分
で行つた。 比較として、SWP/NBF/SSFの配合比が容
量%で98.7/0/1.3(重量比90/0/10)即ち実
施例とSSFの配合量が同じでNBFを含まないも
のについて、同様に原紙及び導電フイルムを製造
した。しかし、紙力が弱いため紙切れが起こり連
続製造が極めて困難であつた。 本実施例及び比較例について原紙と導電フイル
ムの物性を第2表に示す。
[Table] From the results in Table 1, the target basis weight is 30g/m 2 and 50g/m2.
It can be seen that even with a low basis weight product such as m 2 , a product with in-plane specific resistance comparable to that of a high basis weight product can be obtained. In addition, the lower the basis weight, the lower the opacity.
It can be used in fields where transparency is required. Next, using a plastic shielding material evaluation device (Takeda Riken Kogyo Co., Ltd., TR17301), the shielding effect (electric field) for each frequency (MHz) was measured for the two 50g/m conductive films shown in Table 1, and the results are shown in Figure 5. Indicated. 30dB in the region up to 100MHz as shown
From the above, it was found that it has an electromagnetic shielding effect. In addition, almost the same effect was observed regarding the shielding effect (magnetic field). Example 1 A certain amount of SWP was 50% as thermoplastic synthetic pulp.
The mixture was poured into warm water at ℃ to give a concentration of 3%, and disintegrated with a stirrer. In addition, a certain amount of NBF as a thermoplastic composite fiber was dispersed in water at room temperature. Furthermore, SSF was prepared as a conductive fiber by dispersing it in water at room temperature to a concentration of 1%, and adding a small amount of an antifoaming agent to this. The mixing ratio of SWP/NBF/SSF in volume %,
82.2/16.5/1.3 (weight ratio 75/15/10), put it in a mixing tank and stir for more than 20 minutes, then add a small amount of dispersant to the raw material, and measure the basis weight in meters using a test machine. The base paper was manufactured with a target of 50 g/m 2 . The drying of the base paper is at the melting point of the NBF sheath component, 96
~100~ above 100℃, SWP melting point below 123℃
It was carried out at 115℃. The production speed was 30 m/min, and even without any special mold release treatment on the dryer, the film could be easily released continuously from the dryer and there was no paper breakage. This base paper was supercalendered under the conditions of a linear pressure of 60 Kg/cm and a roll surface temperature of 130°C, which is above the melting point of SWP, 123°C, and below the melting point of the core component of NBF, 165-170°C. The paper passing speed was 4.5 m/min. For comparison, the base paper was prepared with the SWP/NBF/SSF blending ratio of 98.7/0/1.3 in volume% (weight ratio 90/0/10), that is, the same amount of SSF as in the example but without NBF. And a conductive film was manufactured. However, because the paper strength was weak, paper breakage occurred and continuous production was extremely difficult. Table 2 shows the physical properties of the base paper and conductive film for this example and comparative example.

【表】【table】

【表】 表中のヒートシール強度はタツピースタンダー
ドT517−69に準拠し、シート条件は圧着圧力2
Kg/cm2、圧着時間1秒、温度150℃、シール幅10
mm、強度試験は万能引張り試験機テンシロン(東
洋ボールドウイン(株)製)によるT型剥離速度50
mm/分、つかみ間隔10cm、試験片の幅2.5cmであ
つた。第2表によれば、不透明度の低い、ヒート
シール強度のある導電フイルムが得られることを
示す。比較例との対比ではSWPの一部をNBFに
置き換えることにより、強度において著しい向上
が見られる。特に原紙においてはNBFの配合に
より裂断長で2倍以上、比引裂き強さで3倍以上
の強度が出ている。これが原紙を容易に連続させ
る要因となつていることを示す。不透明度は5.5
%であり、通常の透明性のプラスチツクフイルム
と比較して遜色がなかつた。また、得られた導電
フイルムは静電障害防止用として好適に使用でき
た。 実施例 2 SWP/NBF/SSFの配合比を容量%で、
83.7/15.7/0.6(重量比80/15/5)、目標米坪量
25g/m2、50g/m2として、実施例1と同様にして
原紙及び導電フイルムを得た。この物性を第3表
に示す。
[Table] The heat seal strength in the table is based on Tatsupi Standard T517-69, and the sheet conditions are crimping pressure 2
Kg/cm 2 , crimping time 1 second, temperature 150℃, seal width 10
mm, the strength test was performed using a universal tensile tester Tensilon (manufactured by Toyo Baldwin Co., Ltd.) at a T-type peeling rate of 50
mm/min, the grip interval was 10 cm, and the width of the test piece was 2.5 cm. Table 2 shows that a conductive film with low opacity and high heat seal strength can be obtained. In comparison with the comparative example, a significant improvement in strength can be seen by replacing part of SWP with NBF. In particular, in base paper, the strength of the paper is more than doubled in terms of tearing length and more than three times as strong in terms of specific tear strength by adding NBF. This shows that this is a factor that allows the base paper to be easily continuous. Opacity is 5.5
%, which was comparable to ordinary transparent plastic film. Moreover, the obtained conductive film could be suitably used for preventing electrostatic damage. Example 2 Mixing ratio of SWP/NBF/SSF in volume %,
83.7/15.7/0.6 (weight ratio 80/15/5), target basis weight
A base paper and a conductive film were obtained in the same manner as in Example 1 using 25 g/m 2 and 50 g/m 2 . The physical properties are shown in Table 3.

【表】 NBFの配合により原紙の強度が向上し低坪量
25g/m2品についても実施例1と同様に容易に連
続製造することができた。 SSFの低配合により不透明度は低くなつており
しかも面方向比抵抗が十分に小さい。 得られた導電フイルムは、電子部品のホコリ付
着防止用袋として良好に使用できた。 実施例 3 SWP/NBF/SSFの配合比を容量%で、
62.8/26.9/10.3、目標米坪量を70g/m2とし、実
施例1と同様にして導電フイルムを得た。実施例
1と同様に容易に連続生産することができた。得
られた導電フイルムは坪量69.5g/m2、不透明度
39.5%、面方向比抵抗1.5×10-2Ω−cm、裂断長
2.43Kmであつた。 SSFの配合比を高め、坪量を70g/m2とすると
透明性が劣るようになるが、一方500MHzの周波
数の電磁波に対して43dBのシールド効果、1GHz
の周波数の電磁波に対して30dBのシールド効果
があり、電磁波シールド材として好適に使用でき
た。 実施例 4 SWP/NBF/SSFの配合比を容量%で、
87.2/10/2.8、目標米坪量を50g/m2とし、実施
例1と同様にして導電フイルムを得た。実施例1
と同様に容易に連続生産することができた。得ら
れた導電フイルムは坪量51.2g/m2、不透明度6.5
%、面方向比抵抗7.5×10-1Ω−cm、裂断長1.95Km
であつた。 実施例 5 複合繊維としてNBFに代えてES−Chop −
EA(チツソ(株)製、ポリエチレンとポリプロピレン
の複合繊維、低融点部100〜110℃、高融点部165
〜170℃、繊維長5mm、繊度3デニール)(以下
ESと略す)を用いて、SWP/ES/SSFの配合比
を容量%で77.2/20/2.8とし目標米坪量を50g/
m2で、実施例1に準じて原紙及び導電フイルムを
製造した。原紙の乾燥温度はESの低融点部の融
点100〜110℃以上で、SWPの融点123℃以下と
し、融着効果により連続生産が容易であつた。得
られた導電フイルムは、米坪量49.5g/m2、不透
明度6.8%、裂断長2.38Km、面方向比抵抗6.7×
10-1Ω−cmであつた。 実施例 6 導電繊維として、炭素繊維(呉羽化学工業製ピ
ツチ系炭素繊維 平均繊維長6mm、単糸径12.5μ
m)の表面に厚さ約1μmのニツケルを化学メツ
キにより被覆した繊維(以下Ni−CFと略す)を
用い、第4表に示す各配合比でSWP、NBF及び
Ni−CFを配合した他は実施例1と同様にして、
3種類の導電フイルムを製造した。 各導電フイルムの物性は第4表に示す通りであ
つた。
[Table] The strength of the base paper is improved and the basis weight is reduced by adding NBF.
Similarly to Example 1, 25 g/m 2 products could be easily and continuously manufactured. Due to the low content of SSF, the opacity is low, and the in-plane resistivity is sufficiently low. The obtained conductive film could be used satisfactorily as a bag for preventing dust from adhering to electronic components. Example 3 Mixing ratio of SWP/NBF/SSF in volume %,
A conductive film was obtained in the same manner as in Example 1, with a target weight of 62.8/26.9/10.3 and a target basis weight of 70 g/m 2 . As in Example 1, continuous production could be easily carried out. The obtained conductive film has a basis weight of 69.5 g/m 2 and an opacity.
39.5%, in-plane resistivity 1.5×10 -2 Ω-cm, breaking length
It was 2.43km. If the SSF compounding ratio is increased and the basis weight is 70g/m 2 , transparency becomes inferior, but on the other hand, it has a shielding effect of 43dB against electromagnetic waves at a frequency of 500MHz, and a shielding effect of 43dB at 1GHz.
It had a shielding effect of 30 dB against electromagnetic waves at a frequency of , making it suitable for use as an electromagnetic shielding material. Example 4 Mixing ratio of SWP/NBF/SSF in volume %,
A conductive film was obtained in the same manner as in Example 1, with a sample weight of 87.2/10/2.8 and a target basis weight of 50 g/m 2 . Example 1
could easily be serially produced. The obtained conductive film has a basis weight of 51.2 g/m 2 and an opacity of 6.5.
%, surface direction specific resistance 7.5×10 -1 Ω−cm, fracture length 1.95Km
It was hot. Example 5 ES-Chop − instead of NBF as composite fiber
EA (manufactured by Chitsuso Co., Ltd., composite fiber of polyethylene and polypropylene, low melting point 100-110℃, high melting point 165
~170℃, fiber length 5mm, fineness 3 denier) (below)
(abbreviated as ES), the mixing ratio of SWP/ES/SSF is set to 77.2/20/2.8 in volume%, and the target basis weight is 50g/
m 2 , base paper and conductive film were produced according to Example 1. The drying temperature of the base paper was set above the melting point of the low melting point portion of ES, 100 to 110°C, and below the melting point of SWP, 123°C, and continuous production was easy due to the fusing effect. The obtained conductive film has a basis weight of 49.5 g/m 2 , an opacity of 6.8%, a tearing length of 2.38 km, and a specific resistance in the plane direction of 6.7×
It was 10 -1 Ω-cm. Example 6 Carbon fiber (pitch carbon fiber manufactured by Kureha Chemical Industry Co., Ltd., average fiber length 6 mm, single yarn diameter 12.5 μm) was used as the conductive fiber.
SWP, NBF and
Same as Example 1 except that Ni-CF was added.
Three types of conductive films were manufactured. The physical properties of each conductive film were as shown in Table 4.

【表】 [発明の効果] 本発明は前記したような作用を有するため、以
下のような効果が得られる。 原紙及びフイルムの引張強度や引裂き強さが
向上するため、抄紙工程においてドライヤーか
ら高速でフイルムを引き取ることができ、原紙
及びフイルムが破断することなくシート状の導
電フイルムの連続的製造及び加工を容易に行う
ことができる。 従来よりも薄手の製造が可能となる。また70
g/m2以下、特に50〜20g/m2程度の低坪量のフ
イルムの製造も可能である。 薄手のフイルムの製造が可能となる結果、少
量の導電繊維の使用量で高い導電性のフイルム
が得られる。 薄手で導電繊維の少ないフイルムの製造が可
能となる結果、より透明性の優れた包装用フイ
ルムが提供できる。 強度の向上により、低坪量で薄いフイルムで
あつても、導電繊維の高配合も可能であり、電
磁波シールド用のフイルムを提供することがで
きる。 上記の結果、坪量、厚さ等の調整により、用
途に応じて種々の特性のフイルムの製造が可能
である。 本発明方法で製造される導電フイルムの内、面
方向比抵抗が106〜100Ω−cmのものは電子部品の
ホコリ付着防止用袋として及び静電気障害防止用
として、面方向比抵抗が100Ω−cm以下のものは
電磁波シールド効果が要求される用途に好適であ
る。
[Table] [Effects of the Invention] Since the present invention has the above-described effects, the following effects can be obtained. Because the tensile strength and tear strength of the base paper and film are improved, the film can be removed from the dryer at high speed during the papermaking process, making it easy to continuously manufacture and process sheet-like conductive films without breaking the base paper or film. can be done. It is possible to manufacture thinner products than before. 70 again
It is also possible to produce a film with a low basis weight of less than g/m 2 , particularly about 50 to 20 g/m 2 . As a result of being able to manufacture a thin film, a highly conductive film can be obtained using a small amount of conductive fiber. As a result of being able to produce a thin film with fewer conductive fibers, it is possible to provide a packaging film with better transparency. Due to the improved strength, even if the film has a low basis weight and is thin, it is possible to incorporate a high amount of conductive fiber, and it is possible to provide a film for shielding electromagnetic waves. As a result of the above, by adjusting the basis weight, thickness, etc., it is possible to manufacture films with various characteristics depending on the application. Among the conductive films produced by the method of the present invention, those with a specific resistance in the planar direction of 10 6 to 10 0 Ω-cm can be used as bags for preventing dust from adhering to electronic components and for preventing electrostatic damage. Those with a resistance of 0 Ω-cm or less are suitable for applications requiring electromagnetic shielding effects.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、熱可塑性複合繊維の配合量に対する
原紙の裂断長の関係を表すグラフである。第2図
は、熱可塑性複合繊維の配合量に対する原紙の比
引裂き強さの関係を表すグラフである。第3図
は、熱可塑性複合繊維の配合量に対する導電フイ
ルムの裂断長の関係を表すグラフである。第4図
は、熱可塑性複合繊維の配合量に対する導電フイ
ルムの不透明度の関係を表すグラフである。第5
図は、導電フイルムの電磁波シールド効果(電
界)を示すグラフである。
FIG. 1 is a graph showing the relationship between the breaking length of base paper and the blending amount of thermoplastic conjugate fiber. FIG. 2 is a graph showing the relationship between the specific tear strength of base paper and the amount of thermoplastic conjugate fiber blended. FIG. 3 is a graph showing the relationship between the breaking length of the conductive film and the blending amount of the thermoplastic composite fiber. FIG. 4 is a graph showing the relationship between the opacity of the conductive film and the amount of thermoplastic conjugate fiber blended. Fifth
The figure is a graph showing the electromagnetic shielding effect (electric field) of a conductive film.

Claims (1)

【特許請求の範囲】 1 熱可塑性合成パルプ94.5〜40容量%に、該熱
可塑性合成パルプの融点よりも低い融点を有する
第1成分と該熱可塑性合成パルプの融点よりも高
い融点を有する第2成分とからなる熱可塑性複合
繊維5〜30容量%及び導電繊維(炭素繊維のみか
らなるものを除く)0.5〜30容量%を混合してな
る紙料を用いて湿紙を形成した後、前記第1成分
の融点以上で前記熱可塑性合成パルプの融点より
も低い温度で加熱乾燥して第1成分を溶融し、紙
料が相互に接着された原紙を抄造し、しかる後、
該原紙を前記熱可塑性合成パルプの融点以上で前
記第2成分の融点より低い温度で加熱、加圧して
熱可塑性合成パルプを溶融し、前記第2成分と前
記導電繊維が分散されたフイルムを形成すること
を特徴とする面方向比抵抗1×106Ω−cm以下の
導電フイルムの製造法。 2 第2成分と導電繊維が分散されたフイルムの
透明性が不透明度で30%以下である特許請求の範
囲第1項記載の導電フイルムの製造法。 3 第2成分と導電繊維が分散されたフイルムの
米(メートル)坪量が70g/m2以下である特許請
求の範囲第1項記載の導電フイルムの製造法。 4 導電繊維が金属繊維又は金属被覆繊維である
特許請求の範囲第1項記載の導電フイルムの製造
法。 5 金属繊維がステンレス・スチール繊維である
特許請求の範囲第4項記載の導電フイルムの製造
法。 6 熱可塑性複合繊維が、第2成分を芯とし第1
成分を鞘とした同心状又は偏心状の構造の複合繊
維である特許請求の範囲第1項記載の導電フイル
ムの製造法。
[Scope of Claims] 1 94.5 to 40% by volume of thermoplastic synthetic pulp, a first component having a melting point lower than the melting point of the thermoplastic synthetic pulp, and a second component having a melting point higher than the melting point of the thermoplastic synthetic pulp. After forming a wet paper using a paper stock consisting of a mixture of 5 to 30% by volume of thermoplastic composite fibers consisting of components and 0.5 to 30% by volume of conductive fibers (excluding those consisting only of carbon fibers), The first component is melted by heating and drying at a temperature higher than the melting point of the first component and lower than the melting point of the thermoplastic synthetic pulp, and a base paper in which the paper stocks are mutually bonded is produced, and then,
The base paper is heated and pressurized at a temperature higher than the melting point of the thermoplastic synthetic pulp and lower than the melting point of the second component to melt the thermoplastic synthetic pulp and form a film in which the second component and the conductive fibers are dispersed. A method for producing a conductive film having an in-plane specific resistance of 1×10 6 Ω-cm or less, characterized by: 2. The method for producing a conductive film according to claim 1, wherein the film in which the second component and conductive fibers are dispersed has a transparency of 30% or less in terms of opacity. 3. The method for producing a conductive film according to claim 1, wherein the film in which the second component and conductive fibers are dispersed has a basis weight in meters of 70 g/m 2 or less. 4. The method for producing a conductive film according to claim 1, wherein the conductive fiber is a metal fiber or a metal-coated fiber. 5. The method for producing a conductive film according to claim 4, wherein the metal fibers are stainless steel fibers. 6 The thermoplastic composite fiber has the second component as the core and the first component as the core.
The method for producing a conductive film according to claim 1, wherein the conductive film is a composite fiber having a concentric or eccentric structure with the component as a sheath.
JP23956184A 1984-01-27 1984-11-15 Manufacture of electrically conductive film Granted JPS61118237A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP23956184A JPS61118237A (en) 1984-11-15 1984-11-15 Manufacture of electrically conductive film
US06/694,638 US4645566A (en) 1984-01-27 1985-01-24 Process for producing electroconductive films
DE8585100822T DE3564301D1 (en) 1984-01-27 1985-01-28 Process for producing electroconductive films
EP85100822A EP0151448B1 (en) 1984-01-27 1985-01-28 Process for producing electroconductive films

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23956184A JPS61118237A (en) 1984-11-15 1984-11-15 Manufacture of electrically conductive film

Publications (2)

Publication Number Publication Date
JPS61118237A JPS61118237A (en) 1986-06-05
JPH0146640B2 true JPH0146640B2 (en) 1989-10-09

Family

ID=17046629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23956184A Granted JPS61118237A (en) 1984-01-27 1984-11-15 Manufacture of electrically conductive film

Country Status (1)

Country Link
JP (1) JPS61118237A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61160212A (en) * 1985-01-09 1986-07-19 Mishima Seishi Kk Preparation of transparent conductive film
JPH0626081B2 (en) * 1988-11-30 1994-04-06 三島製紙株式會社 Conductive film having a protective layer on the surface
JP2006077333A (en) * 2004-09-07 2006-03-23 Daio Paper Corp Wrapping paper for see-through package

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4136620A (en) * 1975-07-14 1979-01-30 South African Inventions Development Corporation Self steering railway truck
JPS5526209A (en) * 1978-08-08 1980-02-25 Nissan Motor Weft yarn tension controlling apparatus of loom
JPS58155917A (en) * 1982-03-10 1983-09-16 Isamu Kaji Manufacture of electro-conductive sheet or film

Also Published As

Publication number Publication date
JPS61118237A (en) 1986-06-05

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