JPH0150520B2 - - Google Patents
Info
- Publication number
- JPH0150520B2 JPH0150520B2 JP27693887A JP27693887A JPH0150520B2 JP H0150520 B2 JPH0150520 B2 JP H0150520B2 JP 27693887 A JP27693887 A JP 27693887A JP 27693887 A JP27693887 A JP 27693887A JP H0150520 B2 JPH0150520 B2 JP H0150520B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- granular
- punched
- granular solder
- shows
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Powder Metallurgy (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、半導体チツプやチツプ抵抗などを多
量にはんだ付けする場合に用いられる粒状はんだ
の製造方法である。DETAILED DESCRIPTION OF THE INVENTION The present invention is a method for manufacturing granular solder used when soldering large quantities of semiconductor chips, chip resistors, and the like.
従来、半導体チツプやチツプ抵抗などは、リー
ド付けや基板上へのボンデイング等のために電極
上にはんだ付けされる。従つて、これ等のチツプ
を多量にはんだ付けする場合、穴のあいたステン
レス鋼板上にチツプと一体に粒状はんだを滑らせ
て実装し、その後、一括して加熱・溶融させるい
わゆる置きはんだ付け方法が採用されている。 Conventionally, semiconductor chips, chip resistors, and the like are soldered onto electrodes for lead attachment or bonding onto a substrate. Therefore, when soldering a large quantity of these chips, the so-called spot soldering method involves sliding granular solder together with the chips onto a perforated stainless steel plate, and then heating and melting them all at once. It has been adopted.
しかし、機器の小形化、高密度化のために各種
チツプ寸法が小さくなると共に、それに用いられ
る粒状はんだ素材の寸法も小さくなり（直径５mm
以下）、粒状はんだのすべり移動が円滑にいかな
いという問題点を有し、はんだの供給性が悪く、
作業能率を著しく低下させていた。 However, as the size of various chips has become smaller due to the miniaturization and higher density of devices, the size of the granular solder material used for them has also become smaller (5 mm in diameter).
(below), the problem is that the granular solder does not slide smoothly, and the solder supply is poor.
This significantly reduced work efficiency.
第１図は従来から用いられている粒状はんだの
供給方式を示す模擬図で、粒状はんだ１はガイド
板２を傾斜することにより、ガイド板２にあけら
れている穴３内に、１個ずつ滑り落ちることを示
している。 FIG. 1 is a mock diagram showing the conventionally used granular solder supply method. By tilting the guide plate 2, the granular solder 1 is placed one by one into the holes 3 made in the guide plate 2. It shows that it is slipping.
第２図ａは従来の粒状はんだの断面形状を、ｂ
は本発明による粒状はんだの断面形状を示す。 Figure 2a shows the cross-sectional shape of conventional granular solder, and b
shows the cross-sectional shape of the granular solder according to the present invention.
従来の粒状はんだは一般にはプレスによる打抜
きにより成形されるため、端面は剪断面となり、
片面に必ずバリを生じる。このバリは粒状はんだ
同志がひつかかり、からまつて１個ずつすべり落
ちずにかたまつて落ちる原因となる。 Conventional granular solder is generally formed by punching with a press, so the end surface becomes a sheared surface,
There will always be burrs on one side. This burr causes the granular solder to get stuck together, tangle, and fall in clumps instead of slipping off one by one.
本発明は上記の問題点を解決し、板上において
すべり移動が極めて円滑な粒状はんだ製造方法を
提供することを目的とする。 It is an object of the present invention to solve the above-mentioned problems and provide a method for producing granular solder that allows extremely smooth sliding movement on a plate.
第６図ａ〜ｃによつて本発明による粒状はんだ
の製造方法を説明する。 The method for manufacturing granular solder according to the present invention will be explained with reference to FIGS. 6a to 6c.
まず、第６図ａに示すように、平板状のはんだ
素材６を上金型７と下金型８との間に挿入し、ハ
ンマ９を上金型７の孔から降下させて打抜く。こ
の打抜きによつて形成された打抜きはんだ１０の
外観は、第６図ａに示すように、周囲に打抜きに
よるバリ１１が形成されている。 First, as shown in FIG. 6a, a flat solder material 6 is inserted between an upper mold 7 and a lower mold 8, and a hammer 9 is lowered through a hole in the upper mold 7 to punch it out. The appearance of the punched solder 10 formed by this punching is as shown in FIG. 6a, with burrs 11 formed around the periphery.
次に、この打抜きはんだ１０を、下金型の孔か
ら戻しポンチ１２によつて、平板状のはんだ素材
６の打抜きによつて生じた穴１３に押し戻す。 Next, the punched solder 10 is pushed back into the hole 13 formed by punching the flat solder material 6 through the hole in the lower mold by the return punch 12.
このとき打抜きはんだ１０の周囲のバリは、戻
しポンチで押し付けられて穴１３の縁部によつて
第６図ｂに示すように除去され、あるいは、押し
つぶされて丸くなつて、穴１３内に嵌まる。 At this time, the burr around the punched solder 10 is pressed by a return punch and removed by the edge of the hole 13 as shown in FIG. circle.
さらに、次の工程で、先端に丸味を帯びさせた
ノツクアウト棒１５で、はんだ素材６の穴１３に
戻され嵌合されたはんだ１４を上金型７の孔から
突き出すと、第６図ｃで示すように、丸味を帯び
た周囲にバリがない半球状に下方に突出するよう
に湾曲した形状の粒状はんだ１６が得られる。 Furthermore, in the next step, when the solder 14 that has been returned and fitted into the hole 13 of the solder material 6 is pushed out from the hole of the upper mold 7 using the knock-out rod 15 with a rounded tip, as shown in FIG. As shown, granular solder 16 having a rounded periphery without burrs and curved in a hemispherical shape protruding downward is obtained.
このようにして得た粒状はんだは、第２図ｂに
示すように打抜き時に生じたバリが除去されてい
ると共に、全体が球面状に湾曲しているため、ガ
イド板２との接触面積が小さくなり、また個々の
粒状はんだ同志の接触面積も小さくなるから、第
１図のガイド板２から落下する際の摩擦抵抗が著
しく減少する。 As shown in FIG. 2b, the granular solder thus obtained has had the burrs generated during punching removed and is curved in a spherical shape as a whole, so the contact area with the guide plate 2 is small. Furthermore, since the contact area between individual solder particles becomes smaller, the frictional resistance when falling from the guide plate 2 shown in FIG. 1 is significantly reduced.
第３図に粒状はんだ１を山にした時のすべり開
始角度試験方法を示す。粒状はんだ１はSn―Pb
共晶はんだで、板厚0.1mm、直径3.2mmに打抜かれ
たものである。 FIG. 3 shows a method for testing the slip start angle when the granular solder 1 is piled up. Granular solder 1 is Sn-Pb
It is made of eutectic solder and is punched to a thickness of 0.1 mm and a diameter of 3.2 mm.
200個の粒状はんだ１をストツパ４で止めてお
いて、積み上げた後、アルミ板５を徐々に傾斜さ
せ、粒状はんだ１の山が崩れて、すべり始めた時
の角度を測定した結果、第２図ａに示す従来の粒
状はんだの場合には、すべり開始角度は22度で、
粒状はんだは１個ずつではなく、かたまつた状態
ですべり落ちた。 200 pieces of granular solder 1 were stopped by a stopper 4 and stacked, and then the aluminum plate 5 was gradually tilted, and the angle at which the pile of granular solder 1 collapsed and started to slide was measured. In the case of the conventional granular solder shown in Figure a, the sliding start angle is 22 degrees,
The granular solder did not slide off one by one, but in clumps.
一方、第２図ｂに示す粒状はんだは、すべり開
始角度は14度で、しかも粒状はんだが１個ずつ分
離し、サラサラとした状態で移動した。これは半
球状に腕曲しているためガイド板２との接触面積
が従来のものより著しく少なく、接触面積が著し
く減少し、またバリがないので、他の粒状はんだ
にひつかからないためと考えられる。 On the other hand, the granular solder shown in FIG. 2b had a sliding start angle of 14 degrees, and the granular solder separated one by one and moved smoothly. This is thought to be because the contact area with the guide plate 2 is significantly smaller than the conventional one because the arm is bent in a hemispherical shape, and since there is no burr, it does not stick to other granular solder. .
この時の粒状はんだの金属顕微鏡による断面写
真を第４図に示すと共に、表面形状測定結果を第
５図に示す。第４図ａは従来例、第４図ｂは本発
明の形状はんだを示している。 FIG. 4 shows a cross-sectional photograph of the granular solder taken with a metallurgical microscope, and FIG. 5 shows the results of surface shape measurement. FIG. 4a shows a conventional example, and FIG. 4b shows a shaped solder according to the present invention.
はんだにつけられた球面状の丸味は大きければ
良いが、供給後の安定性、製造加工性等を考慮し
て決定すれば良い。 The roundness of the spherical surface attached to the solder may be large as long as it is large, but it may be determined in consideration of stability after supply, manufacturing processability, etc.
なお、本実施例はSn―Pb系はんだについて述
べたが、Au―Sn系、Au―Si系、系等半導体に使
用されるAu系はんだやAgろう、りん銅ろう等一
般にろう付けに用いられる各種ろう材等にも同様
の効果が期待できる。 Although this example describes Sn-Pb-based solder, Au-based solder used in semiconductors such as Au-Sn based, Au-Si based, etc., Ag solder, phosphorous solder, etc. that are generally used for brazing may also be used. Similar effects can be expected with various brazing fillers.
以上説明したように本発明によれば、置きはん
だ付けをする場合に、ひつかかることなく円滑に
すべり落ちて能率よく作業を進められる粒状はん
だを容易に得ることができる。 As explained above, according to the present invention, it is possible to easily obtain granular solder that smoothly slides down without getting stuck and allows the work to be carried out efficiently when soldering is performed.
第１図は従来から用いられているはんだの供給
方式の模擬図、第２図は粒状はんだの断面図であ
り、ａは従来のもの、ｂは本発明の製造方法で得
られたものを示している。第３図は粒状はんだの
すべり開始試験方法を示す図である。第４図は第
２図に対応させた粒状はんだの金属顕微鏡による
断面写真で、ａは従来例を示し、ｂは本発明によ
る場合を示している。第５図は表面形状測定結果
を表わす図である。第６図ａ，ｂ，ｃは本発明に
よる粒状はんだの製造工程を示す説明図である。
１……粒状はんだ、２……ガイド板、３……
穴、１１……バリ。
Figure 1 is a mock diagram of a conventional solder supply method, and Figure 2 is a cross-sectional view of granular solder, where a shows the conventional solder and b shows the solder obtained by the manufacturing method of the present invention. ing. FIG. 3 is a diagram showing a method for testing the onset of slippage of granular solder. FIG. 4 is a cross-sectional photograph taken by a metallurgical microscope of granular solder corresponding to FIG. 2, where a shows the conventional example and b shows the case according to the present invention. FIG. 5 is a diagram showing the surface shape measurement results. FIGS. 6a, b, and c are explanatory views showing the manufacturing process of granular solder according to the present invention. 1... Granular solder, 2... Guide plate, 3...
Hole, 11...burr.
Claims (1)
平板状のはんだ素材を挿入し、ハンマ先端を該孔
に通過させて該平板状のはんだ素材を打抜きし、
次に、この打抜かれた打抜きはんだを戻しポンチ
によつて前記平板状のはんだ素材に前記打抜きに
よつて生じた穴に押戻して、該打抜きはんだの前
記打抜きによるバリを該穴縁部で押しつぶし、次
に、先端に丸味を帯びたノツクアウト棒によつて
前記打抜きはんだを突き出して、半球状に湾曲し
た粒状はんだを得ることを特徴とする粒状はんだ
の製造方法。1. Insert a flat solder material between an upper mold and a lower mold that have holes at the same position, pass the tip of a hammer through the holes to punch out the flat solder material,
Next, the punched solder is pushed back into the hole formed by the punching in the flat solder material using a return punch, and the burrs of the punched solder caused by the punching are crushed by the edge of the hole. . Next, the punched solder is pushed out using a knock-out rod having a rounded tip to obtain a hemispherically curved granular solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27693887A JPS6411095A (en) | 1987-10-30 | 1987-10-30 | Production of granular solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27693887A JPS6411095A (en) | 1987-10-30 | 1987-10-30 | Production of granular solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6411095A JPS6411095A (en) | 1989-01-13 |
| JPH0150520B2 true JPH0150520B2 (en) | 1989-10-30 |
Family
ID=17576496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27693887A Granted JPS6411095A (en) | 1987-10-30 | 1987-10-30 | Production of granular solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6411095A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013046450A1 (en) * | 2011-09-30 | 2013-04-04 | 千住金属工業株式会社 | Solder piece, chip solder, and method for manufacturing solder piece |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5240448B2 (en) * | 2008-08-27 | 2013-07-17 | トヨタ自動車株式会社 | Solder supply apparatus and solder supply method |
-
1987
- 1987-10-30 JP JP27693887A patent/JPS6411095A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013046450A1 (en) * | 2011-09-30 | 2013-04-04 | 千住金属工業株式会社 | Solder piece, chip solder, and method for manufacturing solder piece |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6411095A (en) | 1989-01-13 |
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