JPH0152419B2 - - Google Patents
Info
- Publication number
- JPH0152419B2 JPH0152419B2 JP1604081A JP1604081A JPH0152419B2 JP H0152419 B2 JPH0152419 B2 JP H0152419B2 JP 1604081 A JP1604081 A JP 1604081A JP 1604081 A JP1604081 A JP 1604081A JP H0152419 B2 JPH0152419 B2 JP H0152419B2
- Authority
- JP
- Japan
- Prior art keywords
- cyanate ester
- resin composition
- bis
- curable resin
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004643 cyanate ester Substances 0.000 claims description 29
- 239000011342 resin composition Substances 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 20
- 229920001897 terpolymer Polymers 0.000 claims description 12
- RWNQRLATPAGHIM-UHFFFAOYSA-N buta-1,3-diene;2-methylbuta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N.CC(=C)C=C RWNQRLATPAGHIM-UHFFFAOYSA-N 0.000 claims description 11
- 150000001412 amines Chemical class 0.000 claims description 10
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 12
- 239000003054 catalyst Substances 0.000 description 11
- -1 4-cyanatophenyl Chemical group 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 229920000459 Nitrile rubber Polymers 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920000768 polyamine Polymers 0.000 description 4
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 4
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 150000001913 cyanates Chemical class 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- GUGZCSAPOLLKNG-UHFFFAOYSA-N (4-cyanatophenyl) cyanate Chemical compound N#COC1=CC=C(OC#N)C=C1 GUGZCSAPOLLKNG-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical group C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 description 2
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 125000001651 cyanato group Chemical group [*]OC#N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- FSQQTNAZHBEJLS-UPHRSURJSA-N maleamic acid Chemical compound NC(=O)\C=C/C(O)=O FSQQTNAZHBEJLS-UPHRSURJSA-N 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- HMHLDAMOJGEOMQ-UHFFFAOYSA-N (1-cyanato-4-phenylcyclohexa-2,4-dien-1-yl) cyanate Chemical group C1=CC(OC#N)(OC#N)CC=C1C1=CC=CC=C1 HMHLDAMOJGEOMQ-UHFFFAOYSA-N 0.000 description 1
- UFKLQICEQCIWNE-UHFFFAOYSA-N (3,5-dicyanatophenyl) cyanate Chemical compound N#COC1=CC(OC#N)=CC(OC#N)=C1 UFKLQICEQCIWNE-UHFFFAOYSA-N 0.000 description 1
- YDCUTCGACVVRIQ-UHFFFAOYSA-N (3,6-dicyanatonaphthalen-1-yl) cyanate Chemical compound N#COC1=CC(OC#N)=CC2=CC(OC#N)=CC=C21 YDCUTCGACVVRIQ-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- OFIWROJVVHYHLQ-UHFFFAOYSA-N (7-cyanatonaphthalen-2-yl) cyanate Chemical compound C1=CC(OC#N)=CC2=CC(OC#N)=CC=C21 OFIWROJVVHYHLQ-UHFFFAOYSA-N 0.000 description 1
- ZBBLRPRYYSJUCZ-GRHBHMESSA-L (z)-but-2-enedioate;dibutyltin(2+) Chemical compound [O-]C(=O)\C=C/C([O-])=O.CCCC[Sn+2]CCCC ZBBLRPRYYSJUCZ-GRHBHMESSA-L 0.000 description 1
- QMTFKWDCWOTPGJ-KVVVOXFISA-N (z)-octadec-9-enoic acid;tin Chemical compound [Sn].CCCCCCCC\C=C/CCCCCCCC(O)=O QMTFKWDCWOTPGJ-KVVVOXFISA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- XOJRVZIYCCJCRD-UHFFFAOYSA-N 1-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1OC1=CC=C(N2C(C=CC2=O)=O)C=C1 XOJRVZIYCCJCRD-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- GEEGPFGTMRWCID-UHFFFAOYSA-N 1-n,1-n,1-n',1-n'-tetramethylbutane-1,1-diamine Chemical compound CCCC(N(C)C)N(C)C GEEGPFGTMRWCID-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- AJHFBIPDUISYDU-UHFFFAOYSA-N 2-(2-ethyl-5-methyl-1h-imidazol-4-yl)propanenitrile Chemical class CCC1=NC(C(C)C#N)=C(C)N1 AJHFBIPDUISYDU-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- HYVGFUIWHXLVNV-UHFFFAOYSA-N 2-(n-ethylanilino)ethanol Chemical compound OCCN(CC)C1=CC=CC=C1 HYVGFUIWHXLVNV-UHFFFAOYSA-N 0.000 description 1
- FZZMTSNZRBFGGU-UHFFFAOYSA-N 2-chloro-7-fluoroquinazolin-4-amine Chemical compound FC1=CC=C2C(N)=NC(Cl)=NC2=C1 FZZMTSNZRBFGGU-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- SIQHSJOKAUDDLN-UHFFFAOYSA-N 2-methyl-1-propylimidazole Chemical compound CCCN1C=CN=C1C SIQHSJOKAUDDLN-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 1
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- OMHOXRVODFQGCA-UHFFFAOYSA-N 4-[(4-amino-3,5-dimethylphenyl)methyl]-2,6-dimethylaniline Chemical compound CC1=C(N)C(C)=CC(CC=2C=C(C)C(N)=C(C)C=2)=C1 OMHOXRVODFQGCA-UHFFFAOYSA-N 0.000 description 1
- XECVXFWNYNXCBN-UHFFFAOYSA-N 4-[(4-aminophenyl)-phenylmethyl]aniline Chemical compound C1=CC(N)=CC=C1C(C=1C=CC(N)=CC=1)C1=CC=CC=C1 XECVXFWNYNXCBN-UHFFFAOYSA-N 0.000 description 1
- CJXRYVQHINFIKO-UHFFFAOYSA-N 4-[1-(4-aminophenyl)-1-phenylethyl]aniline Chemical compound C=1C=C(N)C=CC=1C(C=1C=CC(N)=CC=1)(C)C1=CC=CC=C1 CJXRYVQHINFIKO-UHFFFAOYSA-N 0.000 description 1
- ZSQIQUAKDNTQOI-UHFFFAOYSA-N 4-[1-(4-aminophenyl)cyclohexyl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)CCCCC1 ZSQIQUAKDNTQOI-UHFFFAOYSA-N 0.000 description 1
- KIMCSKCETOAMBU-UHFFFAOYSA-N 4-[2-(4-amino-3,5-dibromophenyl)propan-2-yl]-2,6-dibromoaniline Chemical compound C=1C(Br)=C(N)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(N)C(Br)=C1 KIMCSKCETOAMBU-UHFFFAOYSA-N 0.000 description 1
- UBKRDXUXTYBRHS-UHFFFAOYSA-N 4-[2-(4-amino-3-methylphenyl)propan-2-yl]-2-methylaniline Chemical compound C1=C(N)C(C)=CC(C(C)(C)C=2C=C(C)C(N)=CC=2)=C1 UBKRDXUXTYBRHS-UHFFFAOYSA-N 0.000 description 1
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 description 1
- ZTKDMNHEQMILPE-UHFFFAOYSA-N 4-methoxy-n,n-dimethylaniline Chemical compound COC1=CC=C(N(C)C)C=C1 ZTKDMNHEQMILPE-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- 229920000784 Nomex Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- GXFRMDVUWJDFAI-UHFFFAOYSA-N [2,6-dibromo-4-[2-(3,5-dibromo-4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C(Br)=C(OC#N)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(OC#N)C(Br)=C1 GXFRMDVUWJDFAI-UHFFFAOYSA-N 0.000 description 1
- YKONYNBAMHVIMF-UHFFFAOYSA-N [2,6-dichloro-4-[2-(3,5-dichloro-4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C(Cl)=C(OC#N)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(OC#N)C(Cl)=C1 YKONYNBAMHVIMF-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- SNYVZKMCGVGTKN-UHFFFAOYSA-N [4-(4-cyanatophenoxy)phenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1OC1=CC=C(OC#N)C=C1 SNYVZKMCGVGTKN-UHFFFAOYSA-N 0.000 description 1
- CNUHQZDDTLOZRY-UHFFFAOYSA-N [4-(4-cyanatophenyl)sulfanylphenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1SC1=CC=C(OC#N)C=C1 CNUHQZDDTLOZRY-UHFFFAOYSA-N 0.000 description 1
- BUPOATPDNYBPMR-UHFFFAOYSA-N [4-(4-cyanatophenyl)sulfonylphenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1S(=O)(=O)C1=CC=C(OC#N)C=C1 BUPOATPDNYBPMR-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- AUYQDAWLRQFANO-UHFFFAOYSA-N [4-[(4-cyanatophenyl)methyl]phenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1CC1=CC=C(OC#N)C=C1 AUYQDAWLRQFANO-UHFFFAOYSA-N 0.000 description 1
- PPZSVSGWDQKBIW-UHFFFAOYSA-N [4-bis(4-cyanatophenoxy)phosphanyloxyphenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1OP(OC=1C=CC(OC#N)=CC=1)OC1=CC=C(OC#N)C=C1 PPZSVSGWDQKBIW-UHFFFAOYSA-N 0.000 description 1
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- LZKLAOYSENRNKR-LNTINUHCSA-N iron;(z)-4-oxoniumylidenepent-2-en-2-olate Chemical compound [Fe].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O LZKLAOYSENRNKR-LNTINUHCSA-N 0.000 description 1
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- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
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- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
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- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- 125000005590 trimellitic acid group Chemical class 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Description
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The present invention is a resin composition that provides a resin with excellent physical properties such as impact resistance, flexibility, and heat resistance, and has practical properties that can be used in various applications such as paints, varnishes, adhesives, laminates, and molded products. It's expensive. The cyanate ester-based curable resin composition () of the present invention is disclosed in Japanese Patent Publication No. 41-1928 (component a),
46-41112 (composition of a + c), 54-30440 (a
+b composition) Publication No. 52-31279 (a+b+c
compositions) and others, and are used in various applications such as laminated products due to their excellent heat resistance and electrical properties. The present inventor has discovered that compositions of this cyanate ester-based curable resin composition () and acrylonitrile-butadiene rubber, polyisoprene rubber, etc., have improved impact resistance and flexibility, which are disadvantages of cyanate ester-based resin compositions. They discovered that they could provide a well-balanced composition with improved heat resistance and less deterioration in heat resistance, etc., and filed a patent application. after that,
As a result of extensive research, we discovered that by using an acrylonitrile-butadiene-isoprene terpolymer, we could obtain a well-balanced composition with less deterioration in heat resistance than in these earlier applications.
The invention has been completed. That is, the present invention provides a. a. a polyfunctional cyanate ester, a prepolymer of the cyanate ester, or a prepolymer of the cyanate ester and an amine; In a cyanate ester curable resin composition () consisting of a prepolymer of maleimide and an amine or c. an epoxy resin, an acrylonitrile-butadiene-isoprene terpolymer () is added to
This is a curable resin composition containing less than 50% by weight, particularly in the range of 5 to 40% by weight. The present invention significantly improves the impact resistance and flexibility of cyanate ester-based curable resin compositions (), and also improves the acrylonitrile-butadiene-isoprene terpolymer (). This is a composition with greatly improved heat resistance and electrical properties. The configuration of the present invention will be explained below. First, in the acrylonitrile-butadiene-isoprene terpolymer () of the present invention, the acrylonitrile component is 15 to 55 wt%, and the balance is 45 to 55 wt%.
It is usually synthesized by a random copolymerization method, with 85 wt% of butadiene and isoprene, and the ratio is appropriately selected. The polymerization method usually uses acrylonitrile, butadiene, and isoprene monomers,
It is produced by charging water, a surfactant, and a redox catalyst into a reaction vessel, conducting emulsion polymerization, and then separating and obtaining the polymer by salting out or the like. In the present invention, such terpolymers that are liquid at room temperature (Mooney viscosity 0) to those having a Mooney viscosity of 200 can be used. Next, the cyanate ester-based curable resin composition () of the present invention is a known composition as described above, and is a compound having two or more cyanate groups (-O-Câ¡N) in the molecule, or The prepolymer alone or a resin composition containing these components as essential components. The multifunctional cyanate ester, which is an essential component, is an organic compound having two or more cyanate ester groups, and a suitable cyanate ester has the following general formula: R(-O-Câ¡N)m...( 1) [In the formula, m is an integer of 2 or more and usually 5 or less, and is an aromatic organic group, and the cyanate ester group is bonded to the aromatic ring of the organic group R] It is a compound that Specific examples include 1,3- or 1,4-dicyanatobenzene,
1,3,5-tricyanatobenzene, 1,3
-, 1,4-, 1,6-, 1,8-, 2,6- or 2,7-dicyanatonaphthalene, 1,3,
6-tricyanatonaphthalene, 4,4-dicyanatobiphenyl, bis(4-cyanatophenyl)methane, 2,2-bis(4-cyanatophenyl)propane, 2,2-bis(3, 5-dichloro-4-cyanatophenyl)propane, 2,2
-Bis(3,5-dibromo-4-cyanatophenyl)propane, bis(4-cyanatophenyl)ether, bis(4-cyanatophenyl)
Thioether, bis(4-cyanatophenyl)
Sulfone, tris(4-cyanatophenyl) phosphite, tris(4-cyanatophenyl)
These include phosphates, and cyanate esters obtained by the reaction of novolacs with cyanogen halides. In addition to these, Tokuko Sho 41-1928, Tokko Sho
43-18468, Special Publication 44-4791, Special Publication 45-11712,
Special Publication No. 46-41112, Special Publication No. 47-26853, and Special Publication No. 1983
Cyanic acid esters described in 51-63149 and the like can also be used. Further, a prepolymer obtained by polymerizing the above-mentioned polyfunctional cyanate ester in the presence of a catalyst such as a mineral acid, a Lewis acid, a salt such as sodium carbonate or lithium chloride, or a phosphate ester such as tributylphosphine. It can be used as These prepolymers generally have a sym-triazine ring in the molecule, which is formed by trimerization of the cyanide group in the cyanate ester. In the present invention, it is preferable to use the prepolymer having an average molecular weight of 400 to 6,000. Furthermore, the polyfunctional cyanate esters described above can also be used in the form of prepolymers with amines. Examples of amines that can be suitably used include meta or paraphenylene diamine, meta or para xylylene diamine, 1,4- or 1,3-cyclohexane diamine, hexahydroxylylene diamine,
4,4'-diaminobiphenyl, bis(4-aminophenyl)methane, bis(4-aminophenyl)
Ether, bis(4-aminophenyl)sulfone, bis(4-amino-3-methylphenyl)methane, bis(4-amino-3,5-dimethylphenyl)methane, bis(4-aminophenyl)cyclohexane, 2,2- Bis(4-aminophenyl)propane, 2,2-bis(4-amino-3-
methylphenyl)propane, 2,2-bis(3,
5-dibromo-4-aminophenyl)propane,
Bis(3-chloro-4-aminophenyl)methane, bis(4-aminophenyl)phenylmethane, 3,4-diaminophenyl)-4'-aminophenylmethane, 1,1-bis(4-aminophenyl)-1- phenylethane, etc. Of course, the above-mentioned polyfunctional cyanate ester,
The prepolymers, and the prepolymers with amines, can be used in the form of mixtures. Components that can be combined with the polyfunctional cyanate ester to obtain the cyanate ester resin composition of the present invention include maleimides having two or more maleimide groups, and monofunctional or polyfunctional hydroxy compounds ( esters of meth)acrylic acid,
Epoxy ester of (meth)acrylic acid, (meth)
(meth) such as alkenyl esters of acrylic acid
Esters of acrylic acid and prepolymers thereof; polyallyl compounds such as diallyl phthalate, divinylbenzene, diallylbenzene, trialkenyl isocyanurate, etc. and prepolymers thereof; dicyclopentadiene and prepolymers thereof; epoxy resins; phenolic resins; polyvinyl formal, polyvinyl Polyvinyl acetal resins such as acetal and polyvinyl butyral;
Acrylic resin with OH group or COOH group,
Silicone resins, alkyd resins, etc. may also be used as appropriate. Here, maleimides are represented by the following general formula (2) [Wherein, R is a divalent, usually pentavalent or less aromatic or alicyclic organic group, and X 1 and X 2 are hydrogen, halogen,
or an alkyl group, where m is 2 or more and usually 5 or less. ] It is a compound represented by The maleimide represented by the above formula has maleic anhydride and an amino group of 2 to 2.
It can be produced by a method known per se, in which maleamic acid is prepared by reacting with a polyamine having five polyamines, and then the maleamic acid is cyclized by dehydration. It is preferable that the polyamine used be an aromatic amine in terms of the heat resistance of the final resin, but if flexibility and flexibility of the resin are desired, alicyclic amines may be used alone or in combination. Also,
It is particularly desirable for the polyvalent amines to be primary amines in terms of reactivity, but secondary amines can also be used. Suitable amines include amines that can be used in the prepolymer with the cyanate ester described above;
These include melamines having an s-triazine ring, and polyamines made by reacting aniline with formalin and linking benzene rings with methylene bonds. In the present invention, the above-mentioned maleimide can also be used in the form of a prepolymer instead of in the form of a so-called monomer. The curable resin composition of the present invention using the above-described components can be produced by various methods such as simply mixing, pre-reacting, and mixing pre-reacted materials and unreacted materials and further pre-reacting. It is manufactured by The resin composition of the present invention obtained as described above can vary from a solvent-free liquid at room temperature to a solid depending on the components used and the ratio of amounts used. The usage ratio of the acrylonitrile-butadiene-isoprene terpolymer () is as described above. Heat resistance has both aspects of improving electrical characteristics, and from this point of view, there are no particular limitations. However, the main purpose of the present invention is to improve component (), and from this point of view, in the present invention, component () usually accounts for less than 50% by weight of the composition, preferably 5 to 5% by weight. It is used in an amount of 40% by weight, particularly in the range of 5 to 30% by weight. Furthermore, the resin composition of the present invention itself has the property of becoming a heat-resistant resin by being bonded and reticulated by heating, but in order to promote crosslinking and reticulation, it is usually used in the form of a catalyst. Such catalysts include 2-methylimidazole, 2-undecylimidazole, 2-heptadecyl imidazole, 2
-Phenylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2methylimidazole, 1-propyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2ethyl-4-methyl imidazoles exemplified by imidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-guanaminoethyl-2-methylimidazole, as well as trimellitic acid adducts of these imidazoles; N,N-dimethylbenzylamine,
N,N-dimethylaniline, N,N-dimethyltoluidine, N,N-dimethyl-p-anisidine,
p-halogeno-N,N-dimethylaniline, 2-
N-ethylanilinoethanol, tri-n-butylamine, pyridine, quinoline, N-methylmorpholine, triethanolamine, triethylenediamine, N,N,N',N'-tetramethylbutanediamine, N-methylpiperidine, etc. Tertiary amines; Phenols such as phenol, cresol, xylenol, resorcin, catechol, phloroglucin; lead naphthenate, lead stearate, zinc naphthenate, zinc octylate, tin oleate, dibutyltin maleate, manganese naphthenate, Organic metal salts such as cobalt naphthenate and iron acetylacetonate; inorganic metal salts such as SnCl 4 , ZnCl 2 , AlCl 3 ; benzoyl peroxide, lauroyl peroxide, caprylyl peroxide, acetyl peroxide, parachlorobenzoyl peroxide, jeter Peroxides such as sharybutyl sieperphthalate; maleic anhydride, phthalic anhydride, lauric anhydride, pyromellitic anhydride,
trimellitic anhydride, hexahydrophthalic anhydride,
Acid anhydrides such as hexahydro trimellitic anhydride and hexahydropyromellitic anhydride are mentioned. The amount of catalyst added is sufficient within the range of catalyst amounts in a general sense, for example 10
It may be used in an amount of % by weight or less. Although the crosslinking and reticulation reaction mechanism of the curable resin composition of the present invention described in detail above has not been proven, the reaction of the cyanato groups of multifunctional cyanate esters and the multifunctional The reaction of the maleimide group of the maleimides is estimated as follows. (1) Reaction of polyfunctional cyanate ester. (2) Reaction of polyfunctional maleimide. Furthermore, the reaction mechanisms of epoxy groups in epoxy resins with hydroxyl groups, carboxyl groups, amino groups, acid anhydride groups, etc. are known. From the above, in the composition of the present invention, in addition to the reactions that are presumed to occur in a composition comprising a known polyfunctional cyanate ester, a polyfunctional maleimide, and an epoxy resin, It is assumed that there is a possibility that the reaction between the nitrile groups and unsaturated double bonds of the newly added acrylonitrile-butadiene-isoprene terpolymer () and the cyanato groups and maleimide groups may occur. . However, it is not conceivable that all of the components react in proportion to the amount of functional groups as assumed above and form the cured product of the present invention. That is, since different functional groups have different reaction temperatures, rates, selectivities, types of catalysts, etc., the reactions of the functional groups in each of the above-mentioned components in the present invention mainly depend on the different components. It is thought that this contributes to the improvement of the affinity (compatibility) between the particles and realizes a finer dispersion state. The temperature for curing the curable resin composition of the present invention varies depending on the presence or absence of a curing agent and catalyst, the types of composition components, etc., but it may be generally selected within the range of 100 to 300°C. When used in the production of molded products, laminates, adhesive structures, etc., it is preferable to apply pressure during heat curing, and generally speaking, the pressure is appropriately selected within the range of 1 to 500 kg/cm 2 . The composition of the present invention may contain various additives as desired, as long as the original properties of the composition are not impaired. These additives include:
Natural or synthetic resins for imparting new properties to the composition of the invention; fibrous reinforcement; fillers;
Various known additives such as dyes and pigments; thickeners; lubricants; and flame retardants are included, and may be used in appropriate combinations as desired. The curable resin composition of the present invention described in detail above has the advantage that it has a relatively fast curing speed and can be cured under relatively mild conditions.
Excellent workability and productivity can be obtained when used in various applications, and the cured resin obtained by curing this composition has excellent impact resistance, flexibility, adhesion or adhesion, and heat resistance. It has a desirable combination of various properties such as electrical properties and chemical resistance.
It also has excellent moisture resistance. Thus, the composition of the present invention can be used in various paints, electrically insulating varnishes, adhesives,
It is useful as a laminated material suitable for furniture, building materials, exterior materials, electrical insulation materials, etc., or as various molding resins. The present invention will be explained in more detail below using Examples and Comparative Examples. Example 1 900 g of 2,2-bis(4-cyanatophenyl)propane and 100 g of bis(4-maleimidophenyl)methane were reacted at 150°C for 150 minutes, and this was mixed with acrylonitrile-butadiene-isoprene ternary containing 34 wt% of acrylonitrile component. 200 g of a copolymer (trade name Nipol DN 1201; manufactured by Nippon Zeon Co., Ltd.) was added and dissolved in methyl ethyl ketone. In this solution, 0.4 g of zinc octylate and 0.2 g of triethylenediamine were uniformly dissolved and mixed as a catalyst, and a glass woven fabric was also impregnated with this solution and dried to obtain a B-stage prepreg. Six sheets of this prepreg were stacked, electrolytic copper foil with a thickness of 35 Όm was layered on both sides, and lamination molding was performed at 175° C. and 40 kg/cm 2 for 120 minutes to obtain a double-sided copper-clad laminate. This laminate has a copper foil peel strength of 1.90 kg/cm, no abnormality in solder heat resistance (after floating at 350°C for 3 minutes), and a glass transition temperature of 220°C. 1-trichlorethylene, methyl ethyl ketone, 10% HCl, 10%
No abnormalities were observed even after immersion in NaCl for 10 minutes. Example 2 700g of 1,4-dicyanatobenzene and bis(4
âmaleimidophenyl) ether and 300 g at 150°C.
200 g of glycidyl methacrylate and 200 g of the same acrylonitrile-butadiene-isoprene terpolymer as in Example 1 were added and mixed, and methyl ethyl ketone and N,
Heat and heat the mixed solvent with N-dimethylformamide.
The mixture was uniformly dissolved and mixed with stirring, and 0.5 g of zinc octylate, 1.0 g of N,N-dimethylbenzylamine, and 0.2 g of benzoyl peroxide were uniformly dissolved and mixed in this solution as catalysts. This solution was applied to a length of 10 mm on the longitudinal ends of multiple stainless steel plates with a length of 125 mm, a width of 25 mm, and a thickness of 1 mm. After heating and drying to form a B-stage, the coated parts were overlapped and heated to 120 °C at 170 °C. It was further heated and cured at 260°C for 60 minutes. Table 1 shows the test results for the adhesive portion of this stainless steel plate. Comparative Example 1 In Example 2, in addition to the acrylonitrile-butadiene-isoprene terpolymer, acrylonitrile-butadiene copolymer (trade name, Nipol
1042; manufactured by Memoto Zeon Co., Ltd.) A resin solution was prepared and bonding was performed in the same manner except that 200 g of the resin solution was used. The results are shown in Table 1.
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第ïŒè¡šã«ç€ºããã[Table] Example 3 A resin solution obtained in exactly the same manner as in Example 2 was continuously impregnated into a fully aromatic polyamide fiber cloth (trade name: Nomex; manufactured by Dupont), and this was continuously impregnated at 140°C. The seeds were dried and hardened to obtain long seeds.
The performance of this sheet is shown in Table 2. Example 4 After preliminarily reacting 700 g of 2,2-bis(4-cyanatophenyl)propane at 150°C for 150 minutes, this was dissolved in methyl ethyl ketone to produce the same acrylonitrile-butadiene-isoprene terpolymer as in Example 1. After adding 300 g of Nipol DN 1201 (trade name: Nipol DN 1201, manufactured by Nippon Zeon Co., Ltd.) and uniformly dissolving and mixing, 0.1 g of zinc octylate and 1 g of dicumyl peroxide were added as catalysts to form a varnish. This varnish is continuously impregnated into a glass woven fabric and dried to form a B-stage prepreg, and then heated to 140°C.
A long sheet was obtained by curing. The performance of this sheet is shown in Table 2. Comparative Example 2 In Example 3, a long sheet was obtained in exactly the same manner as in Comparative Example 1, except that the resin composition solution used was obtained in the same manner as in Comparative Example 1. The performance of this sheet is shown in Table 2.
Claims (1)
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c.ãšããã·æš¹èãšãããªãã·ã¢ã³é žãšã¹ãã«ç³»ã®
ç¡¬åæ§æš¹èçµæç©ïŒïŒã«ãããŠãã¢ã¯ãªããã
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ãªãéé åããŠãªãç¡¬åæ§ã®æš¹èçµæç©ã ïŒ è©²ç¡¬åæ§ã®æš¹èçµæç©äžã®è©²ã·ã¢ã³é žãšã¹ã
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第ïŒé èšèŒã®ç¡¬åæ§ã®æš¹èçµæç©ã[Claims] 1 a. A polyfunctional cyanate ester, a prepolymer of the cyanate ester, or a prepolymer of the cyanate ester and an amine, or a and b. A polyfunctional maleimide, the maleimide prepolymer, or A prepolymer of the maleimide and an amine or
c. In a cyanate ester-based curable resin composition () consisting of an epoxy resin, acrylonitrile-butadiene-isoprene terpolymer () is blended in an amount such that the component () is less than 50% by weight of the composition. A curable resin composition made of 2 Based on the sum of the cyanate ester-based curable resin composition () and the terpolymer () in the curable resin composition, the component () is 5 to 40%
The curable resin composition according to claim 1, which is obtained by blending in a range of % by weight.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1604081A JPS57131247A (en) | 1981-02-05 | 1981-02-05 | Resin composition |
| US06/260,993 US4404330A (en) | 1980-05-06 | 1981-05-06 | Curable resin composition |
| DE3117902A DE3117902C2 (en) | 1980-05-06 | 1981-05-06 | Curable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1604081A JPS57131247A (en) | 1981-02-05 | 1981-02-05 | Resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57131247A JPS57131247A (en) | 1982-08-14 |
| JPH0152419B2 true JPH0152419B2 (en) | 1989-11-08 |
Family
ID=11905463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1604081A Granted JPS57131247A (en) | 1980-05-06 | 1981-02-05 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57131247A (en) |
-
1981
- 1981-02-05 JP JP1604081A patent/JPS57131247A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57131247A (en) | 1982-08-14 |
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