JPH0154857B2 - - Google Patents
Info
- Publication number
- JPH0154857B2 JPH0154857B2 JP58174198A JP17419883A JPH0154857B2 JP H0154857 B2 JPH0154857 B2 JP H0154857B2 JP 58174198 A JP58174198 A JP 58174198A JP 17419883 A JP17419883 A JP 17419883A JP H0154857 B2 JPH0154857 B2 JP H0154857B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- tool
- wires
- wear resistance
- life
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
Landscapes
- Wire Bonding (AREA)
Description
【発明の詳細な説明】 （発明の利用分野） 本発明はワイヤボンダ用ツールに関する。[Detailed description of the invention] (Field of application of the invention) The present invention relates to tools for wire bonders.
（発明の背景）
ワイヤボンダ用ツールは、第１図に示すように
アルミニウム又は金等のワイヤを通すワイヤ挿通
用穴１ａが垂直に形成されたツール１と、第２図
に示すように下端側面に傾斜してワイヤ挿通用穴
２ａが形成されたツール２とが用いられている。(Background of the Invention) A wire bonder tool consists of a tool 1 having a vertical wire insertion hole 1a for passing a wire made of aluminum or gold, as shown in FIG. A tool 2 having an inclined wire insertion hole 2a is used.
ところで、かかるツール１，２はワイヤを基板
に押し付けて短時間にボンドするので、耐摩耗性
に優れたタングステンカーバイト又はセラミツク
等によつて一般に製作されているが、長時間使用
すると、ワイヤによつて先端が摩耗したり、ワイ
ヤが付着したりして使用不能になる。 By the way, these tools 1 and 2 are generally made of tungsten carbide or ceramic, which have excellent wear resistance, because they press the wire against the substrate and bond it in a short time. As a result, the tip may wear out or the wire may stick to it, making it unusable.
摩耗については、第１図に示すツール１はあま
り問題は生じなく、相当摩耗するまで使用できる
が、第２図に示すツール２は先端のテールレスカ
ツトする部分が摩耗すると、ワイヤ切れ、テール
残り等が発生し、製品の信頼性が低下する。 Regarding wear, tool 1 shown in Figure 1 does not cause many problems and can be used until it is considerably worn, but tool 2 shown in Figure 2 may break the wire or leave a tail if the part at the tip that performs tailless cutting wears out. etc., and the reliability of the product decreases.
ワイヤが付着した場合は、ボンド強度が低下す
るので、ツール１，２の寿命は著しく短い。そこ
で、ワイヤが付着した場合は、洗滌を頻繁に行わ
なければならなく、生産性が悪い。 If the wire is attached, the bond strength will be reduced and the life of the tools 1 and 2 will be significantly shortened. Therefore, if the wire is attached, cleaning must be carried out frequently, resulting in poor productivity.
例えば、ワイヤとしてアルミニウム線を用いた
場合、ワイヤ径が25〜80μｍφの細線は主として
摩耗によるので、約50〜60万ボンドで寿命とな
る。ワイヤ径が80μｍφ以上の中線及び太線にな
ると、超音波発振のパワーも大きく、またツール
を試料に押付ける荷重も大きくなるので、ワイヤ
が付着し易くなり、ワイヤの付着によつて約４万
ボンド程度で寿命となる。このようにワイヤが付
着したものは、洗滌によつてワイヤの付着を取除
くことができるが、５〜６回の洗滌によつてもワ
イヤの付着を取除くことができないものを生じ
る。 For example, when an aluminum wire is used as the wire, a fine wire with a wire diameter of 25 to 80 μmφ is mainly abraded, and therefore has a service life of about 500,000 to 600,000 bonds. When the wire diameter becomes medium or thick wire of 80μmφ or more, the power of ultrasonic oscillation is large, and the load pressing the tool against the sample becomes large, so the wire tends to stick. The life span is about bond. In cases where wires are attached in this way, the wires can be removed by washing, but there are some cases in which the wires cannot be removed even after washing 5 to 6 times.
（発明の目的）
本発明の目的は、耐摩耗性の向上及び長寿命化
を図ることができるワイヤボンダ用ツールを提供
することにある。(Objective of the Invention) An object of the present invention is to provide a wire bonder tool that can improve wear resistance and extend life.
（発明の実施例）
本発明者は、ツールの先端を拡大して観察した
ところ、その素材に無数の気泡が存在しており、
その気泡にワイヤが詰つてだんだん蓄積されてワ
イヤが付着していることが判つた。(Embodiment of the Invention) When the inventor of the present invention enlarged and observed the tip of the tool, he found that there were countless air bubbles in the material.
It was found that the bubbles were filled with wires, which gradually accumulated and became attached to the wires.
そこで、ツールの下端にツールの材料と同種も
しくはそれより固い材料をイオン打込みし、前記
気泡を塞いだところ、ツールの先端が一層固くな
り、耐摩耗性が向上した。また気泡が塞がれ、ワ
イヤの付着着が起きなくなり、長寿命化が図れ
た。実験の結果、耐摩耗性及び寿命は従来の約50
％伸びた。 Therefore, when a material similar to or harder than the material of the tool was ion-implanted into the lower end of the tool to close the air bubbles, the tip of the tool became even harder and its wear resistance improved. In addition, the air bubbles were blocked and the wires no longer adhered to each other, resulting in a longer service life. As a result of the experiment, the wear resistance and lifespan are about 50
%Extended.
（発明の効果）
以上の説明から明らかな如く、本発明によれ
ば、ツールの下端にツールの材料と同種もしくは
それより固い材料をイオン打込みしてなるので、
耐摩耗性が向上し、かつ長寿命化が図れる。(Effects of the Invention) As is clear from the above description, according to the present invention, a material similar to or harder than the material of the tool is ion-implanted into the lower end of the tool.
Improves wear resistance and extends life.
第１図及び第２図はツールの一部切欠ぎ断面で
示すの正面図である。
１，２……ツール。
FIGS. 1 and 2 are front views of the tool, shown in partially cutaway section. 1, 2...Tools.
Claims (1)
り固い材料をイオン打込みしてなるワイヤボンダ
用ツール。1. A wire bonder tool whose tip is ion-implanted with a material similar to or harder than the tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58174198A JPS6066441A (en) | 1983-09-22 | 1983-09-22 | Tool for wire bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58174198A JPS6066441A (en) | 1983-09-22 | 1983-09-22 | Tool for wire bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6066441A JPS6066441A (en) | 1985-04-16 |
| JPH0154857B2 true JPH0154857B2 (en) | 1989-11-21 |
Family
ID=15974436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58174198A Granted JPS6066441A (en) | 1983-09-22 | 1983-09-22 | Tool for wire bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6066441A (en) |
-
1983
- 1983-09-22 JP JP58174198A patent/JPS6066441A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6066441A (en) | 1985-04-16 |
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