JPH0158657U - - Google Patents

Info

Publication number
JPH0158657U
JPH0158657U JP15047187U JP15047187U JPH0158657U JP H0158657 U JPH0158657 U JP H0158657U JP 15047187 U JP15047187 U JP 15047187U JP 15047187 U JP15047187 U JP 15047187U JP H0158657 U JPH0158657 U JP H0158657U
Authority
JP
Japan
Prior art keywords
magnetic field
steel strip
plating metal
molten plating
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15047187U
Other languages
English (en)
Other versions
JPH0721567Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15047187U priority Critical patent/JPH0721567Y2/ja
Publication of JPH0158657U publication Critical patent/JPH0158657U/ja
Application granted granted Critical
Publication of JPH0721567Y2 publication Critical patent/JPH0721567Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Coating With Molten Metal (AREA)

Description

【図面の簡単な説明】
第１図Ａ，Ｂは本考案の一実施例と電磁力分布
図、第２図Ａは、本考案の気体噴射ノズルの正面
図、第２図Ｂは同上の右端面図、第３図Ａは本考
案ノズルの渦電流回路を示す説明図、第３図Ｂは
従来ノズルの渦電流回路を示す説明図、第４図Ａ
，Ｂは従来の溶融メツキ装置とその電磁力分布を
示す説明図である。 １は溶融メツキ金属浴、２はイクジツトロール
、３は鋼ストリツプ、４は溶融メツキ金属、５は
コイル、６は移動磁界発生装置、７は気体噴射ノ
ズル、８は金属板、９は絶縁物、１０は通しボル
ト、１１はスリツト。

Claims (1)

    【実用新案登録請求の範囲】
  1. 溶融メツキ金属浴槽のストリツプ出側近傍に、溶
    融メツキ金属浴中を通過して浮上する鋼ストリツ
    プに付着した溶融メツキ金属を浴面側に押し下げ
    る移動磁界を発生する移動磁界発生装置と、さら
    に該移動磁界発生装置と鋼ストリツプとの間に鋼
    ストリツプの板幅方向に金属板と絶縁物とを交互
    に積層した構造の広巾気体噴射ノズルを設けたこ
    とを特徴とする溶融メツキ装置。
JP15047187U 1987-10-02 1987-10-02 溶融メッキ装置 Expired - Lifetime JPH0721567Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15047187U JPH0721567Y2 (ja) 1987-10-02 1987-10-02 溶融メッキ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15047187U JPH0721567Y2 (ja) 1987-10-02 1987-10-02 溶融メッキ装置

Publications (2)

Publication Number Publication Date
JPH0158657U true JPH0158657U (ja) 1989-04-12
JPH0721567Y2 JPH0721567Y2 (ja) 1995-05-17

Family

ID=31423648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15047187U Expired - Lifetime JPH0721567Y2 (ja) 1987-10-02 1987-10-02 溶融メッキ装置

Country Status (1)

Country Link
JP (1) JPH0721567Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009500520A (ja) * 2005-06-30 2009-01-08 アーベーベー・アーベー 厚さをコントロールするためのデバイス及び方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009500520A (ja) * 2005-06-30 2009-01-08 アーベーベー・アーベー 厚さをコントロールするためのデバイス及び方法

Also Published As

Publication number Publication date
JPH0721567Y2 (ja) 1995-05-17

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