JPH0158673B2 - - Google Patents

Info

Publication number
JPH0158673B2
JPH0158673B2 JP56137562A JP13756281A JPH0158673B2 JP H0158673 B2 JPH0158673 B2 JP H0158673B2 JP 56137562 A JP56137562 A JP 56137562A JP 13756281 A JP13756281 A JP 13756281A JP H0158673 B2 JPH0158673 B2 JP H0158673B2
Authority
JP
Japan
Prior art keywords
diaphragm
semiconductor
thin film
groove
mounting base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56137562A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5839069A (ja
Inventor
Kenkichi Takadera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shimadzu Corp
Original Assignee
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Priority to JP56137562A priority Critical patent/JPS5839069A/ja
Publication of JPS5839069A publication Critical patent/JPS5839069A/ja
Publication of JPH0158673B2 publication Critical patent/JPH0158673B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure

Landscapes

  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
JP56137562A 1981-08-31 1981-08-31 半導体ダイヤフラム Granted JPS5839069A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56137562A JPS5839069A (ja) 1981-08-31 1981-08-31 半導体ダイヤフラム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56137562A JPS5839069A (ja) 1981-08-31 1981-08-31 半導体ダイヤフラム

Publications (2)

Publication Number Publication Date
JPS5839069A JPS5839069A (ja) 1983-03-07
JPH0158673B2 true JPH0158673B2 (de) 1989-12-13

Family

ID=15201618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56137562A Granted JPS5839069A (ja) 1981-08-31 1981-08-31 半導体ダイヤフラム

Country Status (1)

Country Link
JP (1) JPS5839069A (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0643129B2 (ja) * 1984-03-01 1994-06-08 キヤノン株式会社 インクジェット記録ヘッド
JPH064334B2 (ja) * 1984-10-19 1994-01-19 キヤノン株式会社 液体噴射記録ヘツドの製造方法
JPS63283073A (ja) * 1987-05-15 1988-11-18 Toshiba Corp 半導体圧力センサ
JPH01127268U (de) * 1988-02-23 1989-08-31
JPH0363834U (de) * 1989-10-24 1991-06-21
US6346742B1 (en) 1998-11-12 2002-02-12 Maxim Integrated Products, Inc. Chip-scale packaged pressure sensor
US6351996B1 (en) * 1998-11-12 2002-03-05 Maxim Integrated Products, Inc. Hermetic packaging for semiconductor pressure sensors
JP4347560B2 (ja) 2002-12-17 2009-10-21 シャランインスツルメンツ株式会社 光学素子固定構造、光学素子固定体、光学素子および光学素子ホルダ
JP5837846B2 (ja) * 2012-02-29 2015-12-24 アルプス電気株式会社 静電容量型物理量センサとその製造方法
JP5824385B2 (ja) * 2012-02-29 2015-11-25 アルプス電気株式会社 静電容量型物理量センサとその製造方法

Also Published As

Publication number Publication date
JPS5839069A (ja) 1983-03-07

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