JPH0158953U - - Google Patents
Info
- Publication number
- JPH0158953U JPH0158953U JP15320587U JP15320587U JPH0158953U JP H0158953 U JPH0158953 U JP H0158953U JP 15320587 U JP15320587 U JP 15320587U JP 15320587 U JP15320587 U JP 15320587U JP H0158953 U JPH0158953 U JP H0158953U
- Authority
- JP
- Japan
- Prior art keywords
- lead wires
- chip
- pair
- semiconductor device
- chip holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の実施例に係るダイオードを概
略的に示した斜視図、第２図は実施例かかるダイ
オードの作製にあたつて使用されるリードフレー
ムの平面図、第３図は第二の実施例の要部を示す
断面図であり、第２図の―拡大断面図に相当
する図、第４図は第三の実施例の要部を示す平面
図、第５図は第四の実施例を示した図である。
１……リード線、２……チツプ素子、４……チ
ツプ挾持部。
FIG. 1 is a perspective view schematically showing a diode according to an embodiment of the present invention, FIG. 2 is a plan view of a lead frame used in manufacturing the diode according to the embodiment, and FIG. Fig. 4 is a plan view showing the main parts of the third embodiment, and Fig. 5 is a plan view showing the main parts of the fourth embodiment. It is a figure showing an example. 1... Lead wire, 2... Chip element, 4... Chip holding part.
Claims (1)
のリード線と、これら一対のリード線に電気的に
接続されるチツプ素子とを備える半導体装置にお
いて、 上記一対のリード線にそれぞれ、他方に対向す
る端部においてリード線の軸線方向に弾性変形可
能なチツプ挾持部を設けるとともに、上記チツプ
素子を上記各チツプ挾持部の間に配置してこれら
に挾圧支持させることを特徴とする、半導体装置
。[Claims for Utility Model Registration] A semiconductor device comprising a pair of lead wires arranged at a predetermined interval on the same axis, and a chip element electrically connected to the pair of lead wires, Each of the lead wires is provided with a chip holding part that can be elastically deformed in the axial direction of the lead wire at the end opposite to the other, and the chip element is disposed between the chip holding parts and supported by the chip holding parts. A semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15320587U JPH0158953U (en) | 1987-10-06 | 1987-10-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15320587U JPH0158953U (en) | 1987-10-06 | 1987-10-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0158953U true JPH0158953U (en) | 1989-04-13 |
Family
ID=31428834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15320587U Pending JPH0158953U (en) | 1987-10-06 | 1987-10-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0158953U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS505731U (en) * | 1973-05-17 | 1975-01-21 |
-
1987
- 1987-10-06 JP JP15320587U patent/JPH0158953U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS505731U (en) * | 1973-05-17 | 1975-01-21 |