JPH0158995U - - Google Patents
Info
- Publication number
- JPH0158995U JPH0158995U JP15429087U JP15429087U JPH0158995U JP H0158995 U JPH0158995 U JP H0158995U JP 15429087 U JP15429087 U JP 15429087U JP 15429087 U JP15429087 U JP 15429087U JP H0158995 U JPH0158995 U JP H0158995U
- Authority
- JP
- Japan
- Prior art keywords
- air
- blowing
- holes
- electronic component
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007664 blowing Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例を示す電子機器筐
体における冷却構成図、第２図は第１図において
用いられている空気吹出し部の斜視図、第３図は
従来の電子機器筐体における冷却構成図である。
１…配管、２…空気吹出し部、２ａ…筐体、２
ｆ…面板、３…吹出し孔、４…吹出し孔からの空
気の流れ、５…電子部品用ボード、６…電子部品
。
Fig. 1 is a cooling configuration diagram of an electronic device casing showing an embodiment of this invention, Fig. 2 is a perspective view of the air blowing section used in Fig. 1, and Fig. 3 is a conventional electronic device casing. FIG. 1... Piping, 2... Air blowing part, 2a... Housing, 2
f...Face plate, 3...Blowout hole, 4...Air flow from the blowout hole, 5...Board for electronic components, 6...Electronic component.
Claims (1)
て空気を吹出す空気吹出し部と、上記吹出し孔か
ら吹出される空気の流れに沿うように位置されか
つ互いに平行と成る如く設けられる複数の電子部
品用ボードとより成る冷却装置において、 発熱量の多い電子部品用ボードに対応する吹出
し孔の大きさを、他の吹出し孔より大きくしたこ
とを特徴とする冷却装置。 (2) 空気吹出し部は配管を介してエアーが充填
されかつ吹出し孔を有する面板を有する筐体より
成ることを特徴とする実用新案登録請求の範囲第
１項記載の冷却装置。[Claims for Utility Model Registration] (1) An air blowing section that blows out air through a plurality of blowing holes distributed on a plane, and an air blowing section that is located along the flow of air blown out from the blowing holes. A cooling device comprising a plurality of electronic component boards arranged parallel to each other, characterized in that the size of the air outlet corresponding to the electronic component board that generates a large amount of heat is made larger than the other air outlet holes. Cooling system. (2) The cooling device according to claim 1, wherein the air blowing section is filled with air through piping and is comprised of a casing having a face plate having blowing holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15429087U JPH0158995U (en) | 1987-10-08 | 1987-10-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15429087U JPH0158995U (en) | 1987-10-08 | 1987-10-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0158995U true JPH0158995U (en) | 1989-04-13 |
Family
ID=31430888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15429087U Pending JPH0158995U (en) | 1987-10-08 | 1987-10-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0158995U (en) |
-
1987
- 1987-10-08 JP JP15429087U patent/JPH0158995U/ja active Pending
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