JPH0159314U - - Google Patents
Info
- Publication number
- JPH0159314U JPH0159314U JP15399287U JP15399287U JPH0159314U JP H0159314 U JPH0159314 U JP H0159314U JP 15399287 U JP15399287 U JP 15399287U JP 15399287 U JP15399287 U JP 15399287U JP H0159314 U JPH0159314 U JP H0159314U
- Authority
- JP
- Japan
- Prior art keywords
- dielectric strip
- conductive
- strip chip
- end surfaces
- conductive surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
Description
第１図は本考案に係る実装手順を説明するため
の図、第２図はコルピツツ型発振器の基本回路図
、第３図は誘電体ストリツプチツプの形状を示す
斜視図、第４図は従来の実装手順を説明するため
の図である。
図中、１……誘電体ストリツプチツプ、２……
上面、２ａ，３ａ，４ａ，５ａ……銀メツキ部、
３……下面、３ｂ，３ｃ……無メツキ部、４，５
……端面、１０，３０……基板、１１〜１３，３
１〜３３……パターン。
Fig. 1 is a diagram for explaining the mounting procedure according to the present invention, Fig. 2 is a basic circuit diagram of a Colpitts type oscillator, Fig. 3 is a perspective view showing the shape of a dielectric strip chip, and Fig. 4 is a conventional mounting method. It is a figure for explaining a procedure. In the figure, 1... dielectric strip chip, 2...
Upper surface, 2a, 3a, 4a, 5a...silver plating part,
3...Bottom surface, 3b, 3c...Unplated part, 4, 5
...End face, 10,30...Substrate, 11-13,3
1 to 33...pattern.
Claims (1)
板上に実装する構造において、 前記誘電体ストリツプチツプの上面および両端
面に連続する導電面を形成するとともに、下面に
は前記両端面の導電面とは不連続の導電面を形成
し、 前記両端面および下面の導電面と基板上のパタ
ーンとをハンダにより接続した ことを特徴とする誘電体ストリツプチツプの実
装構造。 (2) 前記導電面が銀メツキにより形成されたこ
とを特徴とする実用新案登録請求の範囲第(1)項
記載の誘電体ストリツプチツプの実装構造。[Claims for Utility Model Registration] (1) In a structure in which a rectangular dielectric strip chip is mounted on a substrate, a conductive surface continuous to the top surface and both end surfaces of the dielectric strip chip is formed, and a conductive surface is formed on the bottom surface of the dielectric strip chip. A mounting structure for a dielectric strip chip, characterized in that a conductive surface is formed that is discontinuous with the conductive surfaces on both end surfaces, and the conductive surfaces on both end surfaces and the bottom surface are connected to a pattern on a substrate by solder. (2) The dielectric strip chip mounting structure according to claim 1, wherein the conductive surface is formed by silver plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15399287U JPH0159314U (en) | 1987-10-09 | 1987-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15399287U JPH0159314U (en) | 1987-10-09 | 1987-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0159314U true JPH0159314U (en) | 1989-04-13 |
Family
ID=31430322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15399287U Pending JPH0159314U (en) | 1987-10-09 | 1987-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0159314U (en) |
-
1987
- 1987-10-09 JP JP15399287U patent/JPH0159314U/ja active Pending