JPH0160544U - - Google Patents
Info
- Publication number
- JPH0160544U JPH0160544U JP15729187U JP15729187U JPH0160544U JP H0160544 U JPH0160544 U JP H0160544U JP 15729187 U JP15729187 U JP 15729187U JP 15729187 U JP15729187 U JP 15729187U JP H0160544 U JPH0160544 U JP H0160544U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- reinforcing material
- resin
- material made
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012779 reinforcing material Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15729187U JPH0160544U (cs) | 1987-10-14 | 1987-10-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15729187U JPH0160544U (cs) | 1987-10-14 | 1987-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0160544U true JPH0160544U (cs) | 1989-04-17 |
Family
ID=31436604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15729187U Pending JPH0160544U (cs) | 1987-10-14 | 1987-10-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0160544U (cs) |
-
1987
- 1987-10-14 JP JP15729187U patent/JPH0160544U/ja active Pending
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