JPH0160544U - - Google Patents

Info

Publication number
JPH0160544U
JPH0160544U JP1987157291U JP15729187U JPH0160544U JP H0160544 U JPH0160544 U JP H0160544U JP 1987157291 U JP1987157291 U JP 1987157291U JP 15729187 U JP15729187 U JP 15729187U JP H0160544 U JPH0160544 U JP H0160544U
Authority
JP
Japan
Prior art keywords
chip
reinforcing material
resin
material made
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987157291U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987157291U priority Critical patent/JPH0160544U/ja
Publication of JPH0160544U publication Critical patent/JPH0160544U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1987157291U 1987-10-14 1987-10-14 Pending JPH0160544U (th)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987157291U JPH0160544U (th) 1987-10-14 1987-10-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987157291U JPH0160544U (th) 1987-10-14 1987-10-14

Publications (1)

Publication Number Publication Date
JPH0160544U true JPH0160544U (th) 1989-04-17

Family

ID=31436604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987157291U Pending JPH0160544U (th) 1987-10-14 1987-10-14

Country Status (1)

Country Link
JP (1) JPH0160544U (th)

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