JPH0160794U - - Google Patents
Info
- Publication number
- JPH0160794U JPH0160794U JP15627687U JP15627687U JPH0160794U JP H0160794 U JPH0160794 U JP H0160794U JP 15627687 U JP15627687 U JP 15627687U JP 15627687 U JP15627687 U JP 15627687U JP H0160794 U JPH0160794 U JP H0160794U
- Authority
- JP
- Japan
- Prior art keywords
- linear solder
- core member
- flakes
- melt
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 2
- 239000011362 coarse particle Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
第１図乃至第３図は本考案の実施例で、それぞ
れ第１図は線状半田の平面図と断面図、第２図は
線状半田を使用して半田付けが行われる状態を示
す図、第３図は線状半田の他の実施例を示す図で
ある。 １，１１…線状半田、２，１２…核部材、
れ第１図は線状半田の平面図と断面図、第２図は
線状半田を使用して半田付けが行われる状態を示
す図、第３図は線状半田の他の実施例を示す図で
ある。 １，１１…線状半田、２，１２…核部材、
Claims (1)
- 半田付けの温度においては非溶融性である片状
または粗大粒子状の核部材を混入して成る線状半
田。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15627687U JPH0160794U (ja) | 1987-10-13 | 1987-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15627687U JPH0160794U (ja) | 1987-10-13 | 1987-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0160794U true JPH0160794U (ja) | 1989-04-18 |
Family
ID=31434673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15627687U Pending JPH0160794U (ja) | 1987-10-13 | 1987-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0160794U (ja) |
-
1987
- 1987-10-13 JP JP15627687U patent/JPH0160794U/ja active Pending