JPH0160929B2 - - Google Patents

Info

Publication number
JPH0160929B2
JPH0160929B2 JP57087171A JP8717182A JPH0160929B2 JP H0160929 B2 JPH0160929 B2 JP H0160929B2 JP 57087171 A JP57087171 A JP 57087171A JP 8717182 A JP8717182 A JP 8717182A JP H0160929 B2 JPH0160929 B2 JP H0160929B2
Authority
JP
Japan
Prior art keywords
hot
capacitor
film
electrode
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57087171A
Other languages
Japanese (ja)
Other versions
JPS58204521A (en
Inventor
Masaru Kanba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissin Electric Co Ltd
Original Assignee
Nissin Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissin Electric Co Ltd filed Critical Nissin Electric Co Ltd
Priority to JP57087171A priority Critical patent/JPS58204521A/en
Publication of JPS58204521A publication Critical patent/JPS58204521A/en
Publication of JPH0160929B2 publication Critical patent/JPH0160929B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/145—Organic dielectrics vapour deposited
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【発明の詳細な説明】 本発明は乾式コンデンサの製造方法に係わる。
コンデンサ素子構成は、通常電極、誘電体からな
つており、絶縁油の含浸が必要である。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a dry capacitor.
A capacitor element structure usually consists of an electrode and a dielectric, and requires impregnation with insulating oil.

一方、乾式コンデンサでは、素子に絶縁油を含
浸することなく、金属蒸着フイルムまたは普通の
アルミ箔と誘電体とを巻回または積層したような
素子が用いられる。
On the other hand, dry capacitors do not impregnate the element with insulating oil, but instead use an element in which a metallized film or ordinary aluminum foil and a dielectric material are wound or laminated.

乾式のものは含浸のものに比べて、油もれ、爆
発性、重量の点などで優れた面があるが、金属蒸
着フイルム使用のものは、高電圧使用では電極厚
さが問題になり、アルミ箔電極と誘電体とによる
ものは部分放電開始電圧が低く、一般的には
600V級以下のものにしか使用されていない。
Dry types are superior to impregnated types in terms of oil leakage, explosiveness, weight, etc., but those that use metallized film have problems with electrode thickness when used at high voltages. Partial discharge inception voltage is low for those using aluminum foil electrodes and dielectric material, and generally
It is only used for things below 600V class.

そこで、本発明は乾式コンデンサの高電圧にお
ける使用を目標として、コンデンサ素子の製造に
おいて、電極−誘電体間等にホツトメルト型のフ
イルム型接着剤を使用し、ホツトプレスによりコ
ンデンサ素子を成形し、これら素子により乾式コ
ンデンサを構成するようになしたものである。
Therefore, the present invention aims to use dry type capacitors at high voltages, and in manufacturing capacitor elements, a hot-melt film adhesive is used between the electrode and the dielectric material, and the capacitor elements are formed by hot pressing. A dry type capacitor is constructed using the following methods.

以下図面に示す説明図により説明する。 This will be explained below with reference to explanatory diagrams shown in the drawings.

第1図は巻回型素子を製造する場合の実施例の
説明図である。
FIG. 1 is an explanatory diagram of an embodiment for manufacturing a wound type element.

図において、1はプラスチツクフイルムによる
誘電体であり、2はホツトメルト型フイルム型接
着剤であり、3は例えばアルミ箔による電極であ
る。図に示すように、例えば2葉の電極3の間に
プラスチツクフイルムよりなる誘電体1を介在さ
せるが、この場合電極3と誘電体1とが十分接着
するように、また誘電体1が複数葉にわたるとき
は、これらの相隣る誘電体1同志が十分接着する
ように、電極3と誘電体1との間、誘電体1同志
の間にホツトメルト型のフイルム型接着剤を介在
させた絶縁構成とし、巻芯により巻回する。その
あと成形型を備えるホツトプレスにより加熱成形
すれば、ホツトメルト型のフイルム型接着剤は溶
融し、素子層間のすべての空隙をもれなく充たし
たコンデンサ素子が成形される。
In the figure, 1 is a dielectric made of plastic film, 2 is a hot-melt film adhesive, and 3 is an electrode made of aluminum foil, for example. As shown in the figure, for example, a dielectric 1 made of plastic film is interposed between two electrodes 3; When the electrodes 3 and the dielectrics 1 are connected to each other, an insulating structure is used in which a hot melt film type adhesive is interposed between the electrodes 3 and the dielectrics 1 and between the dielectrics 1 so that the adjacent dielectrics 1 are sufficiently bonded to each other. and wind it around the winding core. When the capacitor element is then hot-molded using a hot press equipped with a mold, the hot-melt film adhesive is melted and a capacitor element is formed that completely fills all the gaps between the element layers.

ホツトメルト型フイルム型接着剤としては、例
えばポリエチレン、ポリプロピレン、ポリウレタ
ン、ポリアミド、EVA樹脂フイルムによるもの
が好適であり、誘電体としては、接着剤より融点
の高いプラスチツクフイルム、例えばポリプロピ
レンフイルム、ポリエチレンフイルム、ポリエス
テルフイルム、ポリフツ化ビニリデンフイルム、
等のプラスチツクフイルムが使用される。
Suitable hot-melt film adhesives include those made of polyethylene, polypropylene, polyurethane, polyamide, and EVA resin films, and dielectrics include plastic films with a higher melting point than the adhesive, such as polypropylene film, polyethylene film, and polyester. Film, polyvinylidene film,
Plastic films such as are used.

従つてホツトプレスの温度もこれらの材料によ
つて定められる。このように製造されたコンデン
サ素子をタンクに収納し、例えばSF6ガス、窒素
ガス、等ガスを充填するか、あるいはエポキシ、
ポリウレタン、不飽和ポリエステル、ポリプロピ
レン、ポリエチレン等の樹脂をモールドする。
The temperature of the hot press is therefore also determined by these materials. The capacitor element manufactured in this way is stored in a tank and filled with a gas such as SF 6 gas, nitrogen gas, or epoxy,
Molding resins such as polyurethane, unsaturated polyester, polypropylene, and polyethylene.

以上は巻回型素子についての例であるが、第2
図A,Bに示すような積層型のコンデンサ素子と
して製造することもできる。A図は重ね合わせの
寸法状態を、B図は重ね合わせの各層の配置の順
を示しているが、第1の実施例で説明したよう
に、電極3、ホツトメルト型フイルム型接着剤、
誘電体、ホツトメルト型フイルム型接着剤、誘電
体、ホツトメルト型接着剤、電極をそれぞれ所定
の大きさに切断後、前記の順の絶縁構成で、更に
数段積み上げ、これをホツトプレスにかけて積層
型のコンデンサ素子を得る。
The above is an example of a wound type element, but the second
It can also be manufactured as a multilayer capacitor element as shown in Figures A and B. Figure A shows the dimensional state of overlapping, and Figure B shows the order of arrangement of each layer of overlapping.As explained in the first embodiment, the electrode 3, hot melt film adhesive,
After cutting the dielectric material, hot-melt film adhesive, dielectric material, hot-melt adhesive, and electrode into predetermined sizes, they are stacked in several layers with the insulation configuration in the above order, and then hot pressed to form a multilayer capacitor. Get the element.

ガス充填、モールドについては第1の実施例に
ついて説明したところによればよい。
Gas filling and molding may be performed as described in the first embodiment.

以上説明したように本発明の製造方法によれ
ば、高電圧で使用できるモールド型、ガス充填型
コンデンサを得ることができ、仮に事故が起つて
も爆発、燃焼が起らないコンデンサを得ることが
できる。
As explained above, according to the manufacturing method of the present invention, it is possible to obtain a molded type, gas-filled type capacitor that can be used at high voltage, and even if an accident occurs, it is possible to obtain a capacitor that will not explode or burn. can.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明による巻回型コンデンサ素子実
施についての説明図である。第2図Aは各層重ね
合わせの寸法関係を示す。第2図Bは各層配置の
順を示し、積層型コンデンサ素子実施についての
説明図である。 1……誘電体、2……ホツトメルト型フイルム
型接着剤、3……電極。
FIG. 1 is an explanatory diagram of the implementation of a wound capacitor element according to the present invention. FIG. 2A shows the dimensional relationship of the stacked layers. FIG. 2B shows the order of arrangement of each layer and is an explanatory diagram for implementing a multilayer capacitor element. 1...Dielectric material, 2...Hot melt type film adhesive, 3...Electrode.

Claims (1)

【特許請求の範囲】[Claims] 1 コンデンサ素子の製造において、電極と誘電
体との間、誘電体と誘電体との間にホツトメルト
型のフイルム型接着剤を使用し、ホツトプレスに
より成形することを特徴とする乾式コンデンサの
製造方法。
1. A method for manufacturing a dry capacitor, which is characterized in that, in manufacturing a capacitor element, a hot-melt film adhesive is used between an electrode and a dielectric, and between each dielectric, and the capacitor is molded by hot pressing.
JP57087171A 1982-05-22 1982-05-22 Method of producing dry condenser Granted JPS58204521A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57087171A JPS58204521A (en) 1982-05-22 1982-05-22 Method of producing dry condenser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57087171A JPS58204521A (en) 1982-05-22 1982-05-22 Method of producing dry condenser

Publications (2)

Publication Number Publication Date
JPS58204521A JPS58204521A (en) 1983-11-29
JPH0160929B2 true JPH0160929B2 (en) 1989-12-26

Family

ID=13907537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57087171A Granted JPS58204521A (en) 1982-05-22 1982-05-22 Method of producing dry condenser

Country Status (1)

Country Link
JP (1) JPS58204521A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60233813A (en) * 1984-05-02 1985-11-20 ニチコン株式会社 Dry capacitor
JPS6212937U (en) * 1985-07-08 1987-01-26
SE515643C2 (en) * 2000-01-14 2001-09-17 Abb Ab Capacitor element for a power capacitor, method of manufacture thereof and power capacitor including such capacitor element

Also Published As

Publication number Publication date
JPS58204521A (en) 1983-11-29

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