JPH0161675U - - Google Patents
Info
- Publication number
- JPH0161675U JPH0161675U JP15840587U JP15840587U JPH0161675U JP H0161675 U JPH0161675 U JP H0161675U JP 15840587 U JP15840587 U JP 15840587U JP 15840587 U JP15840587 U JP 15840587U JP H0161675 U JPH0161675 U JP H0161675U
- Authority
- JP
- Japan
- Prior art keywords
- exterior part
- resin exterior
- measuring device
- electronic component
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Description
第１図と第２図は本考案に係る電子部品の測定
装置の一実施例を示す斜視図と平面図、第３図は
第２図のＡ―Ａ線断面図、第４図は超小型の樹脂
封止型半導体装置の斜視図、第５図と第６図は従
来の電子部品の測定装置の各具体例を示す平面図
と側面図、第７図は第５図の測定装置の問題点を
説明するための測定装置の平面図、第８図は第６
図の測定装置の問題点を説明するための電子部品
の平面図である。
１……電子部品、２……リード、３……樹脂外
装部、１１……測子、１２ａ，１２ｂ，１２ｃ，
１２ｄ……押圧体。
Figures 1 and 2 are a perspective view and a plan view showing an embodiment of the electronic component measuring device according to the present invention, Figure 3 is a sectional view taken along line A--A in Figure 2, and Figure 4 is an ultra-compact 5 and 6 are plan views and side views showing specific examples of conventional electronic component measuring devices, and FIG. 7 is a problem with the measuring device shown in FIG. 5. A plan view of the measuring device for explaining the points, FIG.
FIG. 2 is a plan view of electronic components for explaining a problem with the measuring device shown in the figure. 1...Electronic component, 2...Lead, 3...Resin exterior part, 11...Sensor, 12a, 12b, 12c,
12d...Press body.
Claims (1)
に段部を形成したリードを有する電子部品のリー
ドを避けて樹脂外装部側壁を複数方向から押圧し
、所定位置に位置決めする押圧体と、押圧体によ
り位置決めされた位置で各リード先端部の樹脂外
装部底面と平行な部分に接触する測子とを配設し
たことを特徴とする電子部品の測定装置。 A pressing body that presses a side wall of a resin exterior part from a plurality of directions and positions it at a predetermined position while avoiding the leads of an electronic component having a lead led out from both side walls of a resin exterior part and having a stepped portion in the middle; 1. A measuring device for electronic components, characterized in that a measuring element is provided which contacts a portion of each lead tip parallel to a bottom surface of a resin exterior part at a position determined by the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15840587U JPH0161675U (en) | 1987-10-15 | 1987-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15840587U JPH0161675U (en) | 1987-10-15 | 1987-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0161675U true JPH0161675U (en) | 1989-04-19 |
Family
ID=31438704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15840587U Pending JPH0161675U (en) | 1987-10-15 | 1987-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0161675U (en) |
-
1987
- 1987-10-15 JP JP15840587U patent/JPH0161675U/ja active Pending