JPH0164194U - - Google Patents
Info
- Publication number
- JPH0164194U JPH0164194U JP1987158876U JP15887687U JPH0164194U JP H0164194 U JPH0164194 U JP H0164194U JP 1987158876 U JP1987158876 U JP 1987158876U JP 15887687 U JP15887687 U JP 15887687U JP H0164194 U JPH0164194 U JP H0164194U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- temperature
- synthetic resin
- outsert
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 2
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Connection Of Plates (AREA)
Description
図面は全て本考案の一実施例に関し、第１図は
側面図、第２図は斜視図、第３図はローデイング
時の図、第４図はブレーキ力の説明のための図で
ある。
３６…金属基板、４２…樹脂部材（合成樹脂）
、４０…凹部、４０ａ…フツク（一端、温度変位
手段）。
The drawings all relate to one embodiment of the present invention, and FIG. 1 is a side view, FIG. 2 is a perspective view, FIG. 3 is a view during loading, and FIG. 4 is a view for explaining the braking force. 36...Metal substrate, 42...Resin member (synthetic resin)
, 40... recess, 40a... hook (one end, temperature displacement means).
Claims (1)
材を形成した機器の基板装置に於いて、 前記金属基板に設けられ一端が開放された凹部
と、 この凹部内に前記アウトサート成形により設け
られ熱膨張係数が前記金属基板のものと異なる合
成樹脂とを備え、 前記一端を温度に応じて変位する温度変位手段
とすることを特徴とする基板装置。[Claims for Utility Model Registration] In a board device for a device in which a synthetic resin member is formed on a metal substrate by outsert molding, a recess provided in the metal substrate and having one end open, and the outsert in the recess. 1. A substrate device comprising a synthetic resin that is formed by molding and has a coefficient of thermal expansion different from that of the metal substrate, and wherein the one end is a temperature displacement means that changes the temperature according to the temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987158876U JPH0164194U (en) | 1987-10-16 | 1987-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987158876U JPH0164194U (en) | 1987-10-16 | 1987-10-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0164194U true JPH0164194U (en) | 1989-04-25 |
Family
ID=31439600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987158876U Pending JPH0164194U (en) | 1987-10-16 | 1987-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0164194U (en) |
-
1987
- 1987-10-16 JP JP1987158876U patent/JPH0164194U/ja active Pending
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