JPH0165146U - - Google Patents
Info
- Publication number
- JPH0165146U JPH0165146U JP1987160527U JP16052787U JPH0165146U JP H0165146 U JPH0165146 U JP H0165146U JP 1987160527 U JP1987160527 U JP 1987160527U JP 16052787 U JP16052787 U JP 16052787U JP H0165146 U JPH0165146 U JP H0165146U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- base
- lead
- lead frames
- package according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の第１の実施例に係るＩＣパツ
ケージのリードフレームの構造を説明する図、第
２図は本考案の第２の実施例に係る説明図、第３
図は従来例に係る説明図である。
（符号の説明）、１ａ，１ｂ……ＩＣパツケー
ジ、２ａ，２ｂ，２４，３２……ベース、３ａ，
３ｂ，３，２２，３１，３１ａ，３１ｂ……リー
ドフレーム、４，２５，３３……ガラス（接合材
）、５，２６，３４……ＩＣチツプ、６，２７，
３５……ワイヤ、７……キヤツプ、８……リード
曲り部分、９……リード同志の接触部分、１０…
…ワイヤ曲り部分、２１……金属板、２２ａ，３
１０，３１１，３１２……脚部、２３……スポツ
ト溶接部、２８……開口部、３６……放熱フイン
部分。
FIG. 1 is a diagram explaining the structure of the lead frame of an IC package according to the first embodiment of the present invention, FIG. 2 is an explanatory diagram according to the second embodiment of the present invention, and FIG.
The figure is an explanatory diagram of a conventional example. (Explanation of symbols), 1a, 1b...IC package, 2a, 2b, 24, 32...Base, 3a,
3b, 3, 22, 31, 31a, 31b... Lead frame, 4, 25, 33... Glass (bonding material), 5, 26, 34... IC chip, 6, 27,
35... Wire, 7... Cap, 8... Lead bent portion, 9... Contact portion between leads, 10...
...Wire bent part, 21...Metal plate, 22a, 3
10, 311, 312...Legs, 23...Spot welds, 28...Openings, 36...Radiation fin portions.
Claims (1)
数のリードフレーム２２とを接合するために、該
リードフレーム２２の個々の脚部２２ａをある共
通部分に固定して、クリツプ状にし、前記ベース
２４に狭み込む構造とすることを特徴とするＩＣ
パツケージのリードフレームの構造。 (2) 前記ベース２４とリードフレーム２２との
接合面が選択的に凹凸状をしており、接合材２５
が該凹凸状の溝部に充填されることを特徴とする
実用新案登録請求の範囲第１項に記載するＩＣパ
ツケージのリードフレームの構造。 (3) 前記複数のリードフレーム２２の個々の脚
部２２ａが開口部２８を有する金属板２１にスポ
ツト溶接されていることを特徴とする実用新案登
録請求の範囲第１項に記載するＩＣパツケージの
リードフレームの構造。[Claims for Utility Model Registration] (1) In order to join the base 24 that stores the IC chip 26 and the plurality of lead frames 22, the individual legs 22a of the lead frames 22 are fixed to a certain common part. , an IC characterized in that it is shaped like a clip and has a structure that is narrowed into the base 24.
Structure of package lead frame. (2) The bonding surface between the base 24 and the lead frame 22 is selectively uneven, and the bonding material 25
The structure of a lead frame of an IC package according to claim 1, wherein the uneven grooves are filled with:. (3) The IC package according to claim 1, wherein the individual legs 22a of the plurality of lead frames 22 are spot-welded to the metal plate 21 having an opening 28. Lead frame structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987160527U JPH0165146U (en) | 1987-10-20 | 1987-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987160527U JPH0165146U (en) | 1987-10-20 | 1987-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0165146U true JPH0165146U (en) | 1989-04-26 |
Family
ID=31442665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987160527U Pending JPH0165146U (en) | 1987-10-20 | 1987-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0165146U (en) |
-
1987
- 1987-10-20 JP JP1987160527U patent/JPH0165146U/ja active Pending
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