JPH0166923U - - Google Patents
Info
- Publication number
- JPH0166923U JPH0166923U JP1987161590U JP16159087U JPH0166923U JP H0166923 U JPH0166923 U JP H0166923U JP 1987161590 U JP1987161590 U JP 1987161590U JP 16159087 U JP16159087 U JP 16159087U JP H0166923 U JPH0166923 U JP H0166923U
- Authority
- JP
- Japan
- Prior art keywords
- bead
- outer diameter
- wire saw
- diamond
- beads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
第１図から第４図は本考案の実施例を示す。第
１図は全体構成を示す断面図、第２図および第３
図は詳細説明図であつて、第２図は焼結法による
ビーズの場合を示し、第３図は電着法によるビー
ズの場合の態様を示す。第４図は本考案のワイヤ
ーソーの摩耗状態を示す。第５図と第６図は従来
のワイヤーソーの構造とそのビーズの摩耗態様を
示す図である。
１：ダイヤモンドビーズ、２：ワイヤー芯材、
３：固定層、４：ビーズ基材、５：ダイヤモンド
層、６：振動吸収部、７：スプリング。
1 to 4 show embodiments of the invention. Figure 1 is a sectional view showing the overall configuration, Figures 2 and 3.
The figures are detailed explanatory diagrams, and FIG. 2 shows the case of beads made by the sintering method, and FIG. 3 shows the mode of the beads made by the electrodeposition method. FIG. 4 shows the state of wear of the wire saw of the present invention. FIGS. 5 and 6 are diagrams showing the structure of a conventional wire saw and how its beads wear out. 1: Diamond beads, 2: Wire core material,
3: fixed layer, 4: bead base material, 5: diamond layer, 6: vibration absorber, 7: spring.
Claims (1)
ンドビーズを固定したダイヤモンドワイヤーソー
において、各ビーズ間にビーズの固定能力があり
且つ振動吸収能の高い材料から成り、各ビーズ間
の間隔を埋める長さを有し且つビーズ外径と略同
一外径を有する環状体を配置したことを特徴とす
るダイヤモンドワイヤーソー。 In a diamond wire saw in which multiple diamond beads are fixed at intervals on a wire core material, each bead is made of a material with bead fixing ability and high vibration absorption ability, and the length fills the gap between each bead. 1. A diamond wire saw characterized in that an annular body having an outer diameter substantially the same as the bead outer diameter is arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161590U JPH0166923U (en) | 1987-10-22 | 1987-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161590U JPH0166923U (en) | 1987-10-22 | 1987-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0166923U true JPH0166923U (en) | 1989-04-28 |
Family
ID=31444663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987161590U Pending JPH0166923U (en) | 1987-10-22 | 1987-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0166923U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02256416A (en) * | 1988-10-28 | 1990-10-17 | De Beers Ind Diamond Div Ltd | Cutting member for wrire saw |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS492231A (en) * | 1972-04-22 | 1974-01-10 |
-
1987
- 1987-10-22 JP JP1987161590U patent/JPH0166923U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS492231A (en) * | 1972-04-22 | 1974-01-10 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02256416A (en) * | 1988-10-28 | 1990-10-17 | De Beers Ind Diamond Div Ltd | Cutting member for wrire saw |
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