JPH0167742U - - Google Patents
Info
- Publication number
- JPH0167742U JPH0167742U JP1987163342U JP16334287U JPH0167742U JP H0167742 U JPH0167742 U JP H0167742U JP 1987163342 U JP1987163342 U JP 1987163342U JP 16334287 U JP16334287 U JP 16334287U JP H0167742 U JPH0167742 U JP H0167742U
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- mold
- semiconductor device
- sealed space
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 3
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図ａ，ｂは本考案の実施例に係る樹脂封止
装置を示す断面図、第２図は従来の樹脂封止装置
を示す断面図である。
１；半導体装置、２；樹脂、３；金型、４；キ
ヤビテイ、５；ポツト、６；プランジヤ、７；通
路、９；密封空間、１４；壁（外包部材）、１８
；排気ポンプ。
1A and 1B are cross-sectional views showing a resin sealing device according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing a conventional resin sealing device. 1; Semiconductor device, 2; Resin, 3; Mold, 4; Cavity, 5; Pot, 6; Plunger, 7; Passage, 9; Sealed space, 14; Wall (outer packaging member), 18
; Exhaust pump.
Claims (1)
キヤビテイ内に押し出してキヤビテイ内に配置さ
れた半導体装置の周囲を樹脂により封止する半導
体装置の樹脂封止装置において、キヤビテイが形
成された金型の外側に密封空間を形成する外包部
材と、前記金型に設けられそのキヤビテイと前記
密封空間とを連通する通路と、前記外包部材に設
けられ前記密封空間と外部とを連通する排気口と
、この排気口に取付けられた排気手段とを有する
ことを特徴とする半導体装置の樹脂封止装置。 In a resin sealing device for a semiconductor device, in which the resin charged in a pot is pushed into a cavity by a plunger and the periphery of a semiconductor device placed in the cavity is sealed with resin, the outside of the mold in which the cavity is formed is used. an outer packaging member that forms a sealed space in the mold; a passage provided in the mold that communicates the cavity with the sealed space; an exhaust port provided in the outer packaging member that communicates the sealed space with the outside; 1. A resin sealing device for a semiconductor device, comprising an exhaust means attached to an opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987163342U JPH0167742U (en) | 1987-10-26 | 1987-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987163342U JPH0167742U (en) | 1987-10-26 | 1987-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167742U true JPH0167742U (en) | 1989-05-01 |
Family
ID=31447982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987163342U Pending JPH0167742U (en) | 1987-10-26 | 1987-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167742U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0482236A (en) * | 1990-07-25 | 1992-03-16 | Toowa Kk | Method and apparatus for resin sealing and molding of electronic component |
| JP2003048237A (en) * | 2001-08-08 | 2003-02-18 | Jsr Corp | Light guide plate molding method and cyclic olefin resin molding method |
| JP2015093398A (en) * | 2013-11-11 | 2015-05-18 | アピックヤマダ株式会社 | Resin mold and resin mold molding method |
-
1987
- 1987-10-26 JP JP1987163342U patent/JPH0167742U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0482236A (en) * | 1990-07-25 | 1992-03-16 | Toowa Kk | Method and apparatus for resin sealing and molding of electronic component |
| JP2003048237A (en) * | 2001-08-08 | 2003-02-18 | Jsr Corp | Light guide plate molding method and cyclic olefin resin molding method |
| JP2015093398A (en) * | 2013-11-11 | 2015-05-18 | アピックヤマダ株式会社 | Resin mold and resin mold molding method |