JPH0167749U - - Google Patents
Info
- Publication number
- JPH0167749U JPH0167749U JP1987161462U JP16146287U JPH0167749U JP H0167749 U JPH0167749 U JP H0167749U JP 1987161462 U JP1987161462 U JP 1987161462U JP 16146287 U JP16146287 U JP 16146287U JP H0167749 U JPH0167749 U JP H0167749U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- electrode pattern
- solder bump
- connection part
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Clocks (AREA)
- Wire Bonding (AREA)
Description
第１図から第４図はこの考案を液晶表示パネル
に適用した場合の一実施例を示し、第１図ａは液
晶表示パネルの側面図、第１図ｂはその正面図、
第２図は電極パターンの拡大図、第３図はＩＣチ
ツプを接合した状態のＡ−Ａ断面図、第４図ａ，
ｂはＩＣチツプの接合状態を示すＢ−Ｂ断面図、
第５図および第６図は電子腕時計に組み込んだ場
合の使用例を示し、第５図はその断面図、第６図
は時計ガラスを取り外した状態の平面図である。
１……液晶表示パネル、２，３……ガラス基板
、４……ＩＣチツプ、４ａ……半田バンプ、６…
…電極パターン、６ａ，６ｂ……分岐接合部。
1 to 4 show an example in which this invention is applied to a liquid crystal display panel, in which FIG. 1a is a side view of the liquid crystal display panel, FIG. 1b is a front view thereof,
Figure 2 is an enlarged view of the electrode pattern, Figure 3 is a sectional view taken along line A-A with the IC chip bonded, Figure 4 a,
b is a BB sectional view showing the bonded state of the IC chip;
5 and 6 show an example of use when incorporated into an electronic wristwatch, with FIG. 5 being a sectional view thereof, and FIG. 6 being a plan view with the watch glass removed. 1...Liquid crystal display panel, 2, 3...Glass substrate, 4...IC chip, 4a...Solder bump, 6...
...Electrode pattern, 6a, 6b... Branch junction.
Claims (1)
ンプが接続される半導体素子接続部の電極パター
ン構造において、 前記半導体素子の各半田バンプが接続される電
極パターンを２股以上に分岐形成したことを特徴
とする半導体素子接続部の電極パターン構造。[Claims for Utility Model Registration] In the structure of an electrode pattern of a semiconductor element connection part which is formed in plurality on a substrate and to which each solder bump of a semiconductor element is connected, two electrode patterns are connected to each solder bump of the semiconductor element. An electrode pattern structure of a semiconductor element connection part characterized by having branches formed at a length greater than the crotch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161462U JPH0167749U (en) | 1987-10-23 | 1987-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161462U JPH0167749U (en) | 1987-10-23 | 1987-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167749U true JPH0167749U (en) | 1989-05-01 |
Family
ID=31444419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987161462U Pending JPH0167749U (en) | 1987-10-23 | 1987-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167749U (en) |
-
1987
- 1987-10-23 JP JP1987161462U patent/JPH0167749U/ja active Pending
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