JPH0167757U - - Google Patents

Info

Publication number
JPH0167757U
JPH0167757U JP1987161543U JP16154387U JPH0167757U JP H0167757 U JPH0167757 U JP H0167757U JP 1987161543 U JP1987161543 U JP 1987161543U JP 16154387 U JP16154387 U JP 16154387U JP H0167757 U JPH0167757 U JP H0167757U
Authority
JP
Japan
Prior art keywords
package
lead
tip
outer periphery
cage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987161543U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987161543U priority Critical patent/JPH0167757U/ja
Publication of JPH0167757U publication Critical patent/JPH0167757U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は、本考案の一実施例の半導
体パツケージを示す斜視図及び側面図、第3図は
本考案の他の実施例を示す側面図、第4図ないし
第6図は従来の半導体パツケージを示す全体の斜
視図、側面図及び部分の斜視図である。 1……リード、2……下部パツケージ、6……
上部パツケージ。
1 and 2 are a perspective view and a side view showing a semiconductor package according to one embodiment of the present invention, FIG. 3 is a side view showing another embodiment of the present invention, and FIGS. 4 to 6 are 1 is an overall perspective view, a side view, and a partial perspective view of a conventional semiconductor package; FIG. 1...Lead, 2...Lower package cage, 6...
Upper package.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 下部パツケージと上部パツケージと、両パツケ
ージ間における外周側より下方に折曲されかつ、
先端側が外方に突出する如く変形されたリードと
を備えた半導体パツケージにおいて、上部パツケ
ージの外周をリードの先端よりも外方に突出させ
て、リード先端を上から被うようにしたことを特
徴とする半導体パツケージ。
The lower package cage and the upper package cage are bent downward from the outer periphery between the two package cages, and
A semiconductor package equipped with a lead deformed so that the tip side protrudes outward, characterized in that the outer periphery of the upper package protrudes further outward than the tip of the lead so as to cover the tip of the lead from above. Semiconductor package.
JP1987161543U 1987-10-22 1987-10-22 Pending JPH0167757U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987161543U JPH0167757U (en) 1987-10-22 1987-10-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987161543U JPH0167757U (en) 1987-10-22 1987-10-22

Publications (1)

Publication Number Publication Date
JPH0167757U true JPH0167757U (en) 1989-05-01

Family

ID=31444572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987161543U Pending JPH0167757U (en) 1987-10-22 1987-10-22

Country Status (1)

Country Link
JP (1) JPH0167757U (en)

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