JPH0169792U - - Google Patents
Info
- Publication number
- JPH0169792U JPH0169792U JP1987163845U JP16384587U JPH0169792U JP H0169792 U JPH0169792 U JP H0169792U JP 1987163845 U JP1987163845 U JP 1987163845U JP 16384587 U JP16384587 U JP 16384587U JP H0169792 U JPH0169792 U JP H0169792U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- container
- transporting
- convex portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005192 partition Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Description
第１図ａは本考案の第１の実施例を示す正面図
、第１図ｂは第１図ａのＡ―Ａ′線縦断面図、第
２図ａは従来の集積回路素子の運搬用容器を示す
正面図、第２図ｂは第２図ａのＡ―Ａ′線縦断面
図、第３図ａは本考案の第２の実施例を示す正面
図、第３図ｂは第３図ａのＡ―Ａ′線縦断面図で
ある。
１……仕切用凸部、２……凹部、３……凹部２
の一部に設けた凸部、４……集積回路素子を収納
する凹部、１１……集積回路素子本体、１２……
集積回路素子リード部。
Fig. 1a is a front view showing the first embodiment of the present invention, Fig. 1b is a longitudinal sectional view taken along the line A-A' of Fig. 1a, and Fig. 2a is a conventional integrated circuit device transportation device. FIG. 2b is a longitudinal sectional view taken along the line A-A' in FIG. 2a, FIG. 3a is a front view showing the second embodiment of the present invention, and FIG. FIG. 3 is a vertical cross-sectional view taken along the line AA′ in FIG. 1... Convex part for partition, 2... Recessed part, 3... Recessed part 2
a convex portion provided in a part of 4...a recessed portion for housing the integrated circuit element, 11...the main body of the integrated circuit element, 12...
Integrated circuit element lead section.
Claims (1)
回路素子を収納する容器の凹部の底面の一部に、
前記集積回路素子を収納し前記集積回路素子本体
の底面積より大きい凹部を上面に有する凸部を設
けたことを特徴とする集積回路素子の運搬用容器
。 In a container for transporting an integrated circuit device, a part of the bottom surface of the recess of the container housing the integrated circuit device,
A container for transporting an integrated circuit device, characterized in that the integrated circuit device is housed in a convex portion having a concave portion on the upper surface that is larger than the bottom area of the integrated circuit device body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987163845U JPH0169792U (en) | 1987-10-27 | 1987-10-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987163845U JPH0169792U (en) | 1987-10-27 | 1987-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0169792U true JPH0169792U (en) | 1989-05-09 |
Family
ID=31448937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987163845U Pending JPH0169792U (en) | 1987-10-27 | 1987-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0169792U (en) |
-
1987
- 1987-10-27 JP JP1987163845U patent/JPH0169792U/ja active Pending
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