JPH0170329U - - Google Patents
Info
- Publication number
- JPH0170329U JPH0170329U JP1987165540U JP16554087U JPH0170329U JP H0170329 U JPH0170329 U JP H0170329U JP 1987165540 U JP1987165540 U JP 1987165540U JP 16554087 U JP16554087 U JP 16554087U JP H0170329 U JPH0170329 U JP H0170329U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- hot air
- fin
- splashing
- thrown
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims 1
- 239000000428 dust Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
Landscapes
- Drying Of Solid Materials (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図はそのフイン６の斜視図、第３図は本考案の他
の実施例を示す断面図、第４図はそのフイン６′
の斜視図、第５図は従来の温風乾燥装置の断面図
である。
１……送風機、２……発熱体、３……フイルタ
ー、４……半導体基板、５……半導体支持治具、
６，６′……フイン、７……チヤンバー。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a perspective view of the fin 6, FIG. 3 is a sectional view showing another embodiment of the present invention, and FIG. 4 is a fin 6'.
FIG. 5 is a sectional view of a conventional hot air drying device. 1...Blower, 2...Heating element, 3...Filter, 4...Semiconductor substrate, 5...Semiconductor support jig,
6, 6'...Fin, 7...Chamber.
Claims (1)
る装置において、半導体基板支持治具直下に水は
ね防止およびゴミのまき上げ防止のフインを設け
たことを特徴とする温風乾燥機。 What is claimed is: 1. A hot air dryer for drying a semiconductor substrate after wet processing using hot air, characterized in that a fin is provided directly under a semiconductor substrate support jig to prevent water from splashing and dust from being thrown up.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165540U JPH0170329U (en) | 1987-10-28 | 1987-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165540U JPH0170329U (en) | 1987-10-28 | 1987-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170329U true JPH0170329U (en) | 1989-05-10 |
Family
ID=31452118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987165540U Pending JPH0170329U (en) | 1987-10-28 | 1987-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170329U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4918614U (en) * | 1972-05-20 | 1974-02-16 | ||
| JPS52135453A (en) * | 1976-05-08 | 1977-11-12 | Nec Corp | Wafer dryer |
-
1987
- 1987-10-28 JP JP1987165540U patent/JPH0170329U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4918614U (en) * | 1972-05-20 | 1974-02-16 | ||
| JPS52135453A (en) * | 1976-05-08 | 1977-11-12 | Nec Corp | Wafer dryer |
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