JPH0170332U - - Google Patents

Info

Publication number
JPH0170332U
JPH0170332U JP1987165989U JP16598987U JPH0170332U JP H0170332 U JPH0170332 U JP H0170332U JP 1987165989 U JP1987165989 U JP 1987165989U JP 16598987 U JP16598987 U JP 16598987U JP H0170332 U JPH0170332 U JP H0170332U
Authority
JP
Japan
Prior art keywords
high viscosity
paste material
viscosity paste
closed container
pressurizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987165989U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987165989U priority Critical patent/JPH0170332U/ja
Publication of JPH0170332U publication Critical patent/JPH0170332U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の高粘度ペースト状材料の充填装
置の一実施例を示す模式図である。 １……密閉容器、２……高粘度ペースト状材料
、３……吸引管、５……電磁弁、６……高圧空気
加圧装置、７……低圧空気加圧装置、９……充填
ノズル、１２……シリンダ、１３……計量機。 The drawing is a schematic diagram showing an embodiment of the high viscosity paste material filling device of the present invention. 1... Airtight container, 2... High viscosity paste material, 3... Suction pipe, 5... Solenoid valve, 6... High pressure air pressurizing device, 7... Low pressure air pressurizing device, 9... Filling nozzle , 12... cylinder, 13... weighing machine.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 高粘度ペースト状材料が収容された密閉容器と
、この密閉容器を貫通して設けられ、一端が前記
高粘度ペースト状材料中に浸漬された吸引管と、
前記吸引管の他端に接続された充填ノズルと、前
記密閉容器内の空気を加圧する機構とを備えてな
る高粘度ペースト状材料の充填装置において、前
記加圧機構の加圧力を、複数の段階に切り替える
ことができるように構成して成ることを特徴とす
る高粘度ペースト状材料の充填装置。 a closed container containing a high viscosity paste material; a suction tube provided through the closed container and having one end immersed in the high viscosity paste material;
In the filling device for a high viscosity paste material, which includes a filling nozzle connected to the other end of the suction tube and a mechanism for pressurizing the air in the closed container, the pressurizing force of the pressurizing mechanism is applied to a plurality of A filling device for a high viscosity paste material, characterized in that the device is configured to be able to switch between stages.
JP1987165989U 1987-10-29 1987-10-29 Pending JPH0170332U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987165989U JPH0170332U (en) 1987-10-29 1987-10-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987165989U JPH0170332U (en) 1987-10-29 1987-10-29

Publications (1)

Publication Number Publication Date
JPH0170332U true JPH0170332U (en) 1989-05-10

Family

ID=31452972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987165989U Pending JPH0170332U (en) 1987-10-29 1987-10-29

Country Status (1)

Country Link
JP (1) JPH0170332U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008178892A (en) * 2007-01-23 2008-08-07 Canon Machinery Inc Solder supply apparatus and solder supply method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008178892A (en) * 2007-01-23 2008-08-07 Canon Machinery Inc Solder supply apparatus and solder supply method

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