JPH0171429U - - Google Patents

Info

Publication number
JPH0171429U
JPH0171429U JP1987167503U JP16750387U JPH0171429U JP H0171429 U JPH0171429 U JP H0171429U JP 1987167503 U JP1987167503 U JP 1987167503U JP 16750387 U JP16750387 U JP 16750387U JP H0171429 U JPH0171429 U JP H0171429U
Authority
JP
Japan
Prior art keywords
electronic component
component piece
terminals
terminal
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987167503U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987167503U priority Critical patent/JPH0171429U/ja
Publication of JPH0171429U publication Critical patent/JPH0171429U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Details Of Resistors (AREA)
  • Ceramic Capacitors (AREA)
JP1987167503U 1987-10-30 1987-10-30 Pending JPH0171429U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987167503U JPH0171429U (cs) 1987-10-30 1987-10-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987167503U JPH0171429U (cs) 1987-10-30 1987-10-30

Publications (1)

Publication Number Publication Date
JPH0171429U true JPH0171429U (cs) 1989-05-12

Family

ID=31455859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987167503U Pending JPH0171429U (cs) 1987-10-30 1987-10-30

Country Status (1)

Country Link
JP (1) JPH0171429U (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012004594A (ja) * 2011-09-02 2012-01-05 Renesas Electronics Corp 半導体装置
US8816411B2 (en) 1999-01-28 2014-08-26 Renesas Electronics Corporation Mosfet package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8816411B2 (en) 1999-01-28 2014-08-26 Renesas Electronics Corporation Mosfet package
JP2012004594A (ja) * 2011-09-02 2012-01-05 Renesas Electronics Corp 半導体装置

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