JPH0171445U - - Google Patents

Info

Publication number
JPH0171445U
JPH0171445U JP1987167524U JP16752487U JPH0171445U JP H0171445 U JPH0171445 U JP H0171445U JP 1987167524 U JP1987167524 U JP 1987167524U JP 16752487 U JP16752487 U JP 16752487U JP H0171445 U JPH0171445 U JP H0171445U
Authority
JP
Japan
Prior art keywords
package
fixing
metal plate
wire bonding
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987167524U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987167524U priority Critical patent/JPH0171445U/ja
Publication of JPH0171445U publication Critical patent/JPH0171445U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aは本考案の第1の実施例におけるワイ
ヤーボンデイング装置用パツケージ固定保持器の
斜視図、第1図bは同断面図、第1図cはパツケ
ージ固定保持器の位置ぎめ金属板とパツケージを
装着する前の状態を示す斜視図、第2図aは本考
案の第2の実施例における位置ぎめ金属板とエア
ー吸引用穴をもつシートをステージに貼り付けた
ワイヤーボンデイング装置用パツケージ固定保持
器の斜視図、第2図bは同断面図、第2図cはパ
ツケージ固定保持器の位置ぎめ金属板とパツケー
ジを装着する前の状態を示す斜視図、第3図aは
従来のワイヤーボンデイング装置用パツケージ固
定保持器における斜視図、第3図bは同断面図、
第3図cはパツケージ保持器の位置ぎめ金属板と
パツケージ及びパツケージ固定保持用金属板を装
着する前の状態を示す斜視図である。 1……ステージ、2……ステツチ、3……パツ
ケージ、4……チツプ、5……位置ぎめ金属板、
6……エアー吸引用穴、7……位置ぎめ金属板固
定穴、8……パツケージ固定保持用金属板、9…
…シート。
FIG. 1a is a perspective view of a package fixing holder for a wire bonding device according to the first embodiment of the present invention, FIG. 1b is a sectional view thereof, and FIG. 1c is a positioning metal plate of the package fixing holder. A perspective view showing the state before mounting the package; Figure 2a is a fixing package for a wire bonding device in which a positioning metal plate and a sheet with air suction holes are attached to the stage according to the second embodiment of the present invention. A perspective view of the cage, FIG. 2b is a sectional view of the same, FIG. 2c is a perspective view showing the positioning metal plate of the package fixing cage and the state before the package is attached, and FIG. 3a is a conventional wire A perspective view of a package fixing holder for a bonding device, FIG. 3b is a sectional view of the same,
FIG. 3c is a perspective view showing the state before the positioning metal plate of the package holder, the package, and the metal plate for fixing and holding the package are attached. 1... Stage, 2... Stitch, 3... Package, 4... Chip, 5... Positioning metal plate,
6...Air suction hole, 7...Positioning metal plate fixing hole, 8...Metal plate for fixing and holding package cage, 9...
...Sheet.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードレスパツケージにマウントされた半導体
ペレツトをワイヤーボンデイングするボンデイン
グ装置において、該パツケージを裏面から吸引す
るエアー吸引用穴と、該パツケージを一定個所に
固定する位置ぎめ金属板とをステージに有するこ
とを特徴とするワイヤーボンデイング装置用パツ
ケージ固定保持器。
A bonding device for wire bonding semiconductor pellets mounted on a leadless package, characterized in that the stage has an air suction hole for sucking the package from the back side, and a positioning metal plate for fixing the package at a fixed location. A package fixing holder for wire bonding equipment.
JP1987167524U 1987-10-31 1987-10-31 Pending JPH0171445U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987167524U JPH0171445U (en) 1987-10-31 1987-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987167524U JPH0171445U (en) 1987-10-31 1987-10-31

Publications (1)

Publication Number Publication Date
JPH0171445U true JPH0171445U (en) 1989-05-12

Family

ID=31455899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987167524U Pending JPH0171445U (en) 1987-10-31 1987-10-31

Country Status (1)

Country Link
JP (1) JPH0171445U (en)

Similar Documents

Publication Publication Date Title
JPH0171445U (en)
JPS62138455U (en)
JPH0279036U (en)
JPS59169044U (en) Semiconductor chip adsorption nozzle
JPH044742U (en)
JPS6327077U (en)
JPH01176946U (en)
JPH0455134U (en)
JPH0323944U (en)
JPH0268440U (en)
JPS6365267U (en)
JPH0385640U (en)
JPS58499U (en) Semiconductor device carrier
JPH0412680U (en)
JPH0247062U (en)
JPH01115247U (en)
JPS6379652U (en)
JPS5937749U (en) Lead frame for semiconductor devices
JPS6210440U (en)
JPH0317685U (en)
JPS5844842U (en) semiconductor equipment
JPS63147831U (en)
JPH02110342U (en)
JPH044764U (en)
JPH0474457U (en)