JPH0171465U - - Google Patents
Info
- Publication number
- JPH0171465U JPH0171465U JP1987165272U JP16527287U JPH0171465U JP H0171465 U JPH0171465 U JP H0171465U JP 1987165272 U JP1987165272 U JP 1987165272U JP 16527287 U JP16527287 U JP 16527287U JP H0171465 U JPH0171465 U JP H0171465U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- molded
- circuit
- electrically conductive
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 229920006015 heat resistant resin Polymers 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の一実施例に係るモールド回路
基板用回路フイルムの要部を示す断面図、第２図
ないし第６図は同回路フイルムの製造過程を示す
断面図、第７図はモールド回路基板の一例を示す
断面図である。
１……回路フイルム、２……樹脂基板、１１…
…絶縁フイルム、１２Ａ，１２Ｂ……回路パター
ン、１３Ａ，１３Ｂ……ソルダーレジスト、１４
……穴、１５……半田、１６Ａ，１６Ｂ……耐熱
性樹脂被膜。
FIG. 1 is a sectional view showing the main parts of a circuit film for a molded circuit board according to an embodiment of the present invention, FIGS. 2 to 6 are sectional views showing the manufacturing process of the circuit film, and FIG. FIG. 2 is a cross-sectional view showing an example of a circuit board. 1...Circuit film, 2...Resin substrate, 11...
...Insulating film, 12A, 12B...Circuit pattern, 13A, 13B...Solder resist, 14
... Hole, 15 ... Solder, 16A, 16B ... Heat-resistant resin coating.
Claims (1)
成し、その穴を半田で穴埋めして両面の回路パタ
ーンを導通させると共に、上記穴埋め半田の少な
くとも樹脂基板がモールド成形されない方の面に
耐熱性樹脂被膜を設けたことを特徴とするモール
ド回路基板用回路フイルム。 A hole is formed at a position where the circuit pattern on both sides is to be electrically conductive, and the hole is filled with solder to make the circuit pattern on both sides electrically conductive, and a heat-resistant resin coating is applied to at least the side of the hole-filling solder on which the resin substrate is not molded. A circuit film for a molded circuit board, characterized in that it is provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165272U JPH0171465U (en) | 1987-10-30 | 1987-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165272U JPH0171465U (en) | 1987-10-30 | 1987-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0171465U true JPH0171465U (en) | 1989-05-12 |
Family
ID=31451606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987165272U Pending JPH0171465U (en) | 1987-10-30 | 1987-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0171465U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0227768U (en) * | 1988-08-10 | 1990-02-22 |
-
1987
- 1987-10-30 JP JP1987165272U patent/JPH0171465U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0227768U (en) * | 1988-08-10 | 1990-02-22 |