JPH0171475U - - Google Patents

Info

Publication number
JPH0171475U
JPH0171475U JP1987167244U JP16724487U JPH0171475U JP H0171475 U JPH0171475 U JP H0171475U JP 1987167244 U JP1987167244 U JP 1987167244U JP 16724487 U JP16724487 U JP 16724487U JP H0171475 U JPH0171475 U JP H0171475U
Authority
JP
Japan
Prior art keywords
hole
conductive layer
circuit board
wiring pattern
nickel film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987167244U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987167244U priority Critical patent/JPH0171475U/ja
Publication of JPH0171475U publication Critical patent/JPH0171475U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【図面の簡単な説明】
図は本考案の一実施例を示したものである。第
１図は赤外線受光モジユールの回路基板の正面図
、第２図は同背面図、第３図乃至第７図は回路基
板の製造手段を解説した第２図のＡ−Ａ線断面図
、第８図は連結基板の一部切欠正面図である。 符号説明、１：赤外線受光モジユールの回路基
板、７：配線パターン、１１：端子取付孔、１３
：スルーホール、Ｃ：セラミツク白基板、１９：
ニツケル被膜、２０：導電層、２１：スルーホー
ル電極。

Claims (1)

    【実用新案登録請求の範囲】
  1. 任意形状のスルーホールを開穿したセラミツク
    基板の面上及び前記スルーホール内へ、無電解の
    化学メツキによりニツケル被膜を形成し、更に、
    電解メツキにより、銅等の導電層を設けると共に
    、該導電層をエツチングすることによつて、前記
    スルーホールを含んだ配線パターンを形成したこ
    とを特徴とする赤外線モジユールの回路基板。
JP1987167244U 1987-10-31 1987-10-31 Pending JPH0171475U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987167244U JPH0171475U (ja) 1987-10-31 1987-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987167244U JPH0171475U (ja) 1987-10-31 1987-10-31

Publications (1)

Publication Number Publication Date
JPH0171475U true JPH0171475U (ja) 1989-05-12

Family

ID=31455361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987167244U Pending JPH0171475U (ja) 1987-10-31 1987-10-31

Country Status (1)

Country Link
JP (1) JPH0171475U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59159592A (ja) * 1983-03-03 1984-09-10 オ−ケ−プリント配線株式会社 セラミツク基板の製造方法
JPS62104075A (ja) * 1985-10-30 1987-05-14 Toshiba Corp 固体撮像装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59159592A (ja) * 1983-03-03 1984-09-10 オ−ケ−プリント配線株式会社 セラミツク基板の製造方法
JPS62104075A (ja) * 1985-10-30 1987-05-14 Toshiba Corp 固体撮像装置

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