JPH0173934U - - Google Patents

Info

Publication number
JPH0173934U
JPH0173934U JP1987170543U JP17054387U JPH0173934U JP H0173934 U JPH0173934 U JP H0173934U JP 1987170543 U JP1987170543 U JP 1987170543U JP 17054387 U JP17054387 U JP 17054387U JP H0173934 U JPH0173934 U JP H0173934U
Authority
JP
Japan
Prior art keywords
clamp
wire
section
clamp section
clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987170543U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987170543U priority Critical patent/JPH0173934U/ja
Publication of JPH0173934U publication Critical patent/JPH0173934U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Coiling Of Filamentary Materials In General (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図ａ，ｂは夫々本考案の第１の実施例に係
るワイヤカツトクランプを示す斜視図及び側面図
、第１図ｃはその実施状態を示す側面図、第２図
は本考案の第２の実施例に係るワイヤカツトクラ
ンプを示す斜視図、第３図ａ，ｂは夫々従来のワ
イヤカツトクランプを示す正面図及び側面図、第
４図ａ乃至ｄは同じくそのワイヤカツトクランプ
の動作を示す側面図である。 １；固定クランプアーム、２；駆動クランプア
ーム、３，３ａ，３ｂ；クランプ部、５；ソレノ
イドコイル、８；ワイヤ、９；ウエツジ、１０；
ホーン、１１；パツケージ、１２；ペレツト、１
５；ウエツジのワイヤホール、１６；ホーンのワ
イヤホール、２０；ワイヤガイド、２１；ワイヤ
ガイド溝、２２；クランプ突起。

Claims (1)

    【実用新案登録請求の範囲】
  1. 先端にワイヤをクランプするクランプ部を有す
    る１対のクランプアームと、前記クランプアーム
    を揺動可能に支持する支持部材と、前記クランプ
    アームを駆動して前記クランプ部を開閉させる駆
    動部材と、前記クランプ部にてワイヤの姿勢を所
    定の状態に保持するガイドと、を有し、前記クラ
    ンプ部が閉じた状態でワイヤを挾持すると共に、
    クランプ部が開いた状態で前記ガイドがワイヤを
    保持することを特徴とするワイヤボンダーのワイ
    ヤカツトクランプ。
JP1987170543U 1987-11-07 1987-11-07 Pending JPH0173934U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987170543U JPH0173934U (ja) 1987-11-07 1987-11-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987170543U JPH0173934U (ja) 1987-11-07 1987-11-07

Publications (1)

Publication Number Publication Date
JPH0173934U true JPH0173934U (ja) 1989-05-18

Family

ID=31461583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987170543U Pending JPH0173934U (ja) 1987-11-07 1987-11-07

Country Status (1)

Country Link
JP (1) JPH0173934U (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5324779A (en) * 1976-08-20 1978-03-07 Hitachi Ltd Clamper of wire bonder
JPS5326667A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Clamp chip of wire bonder
JPS61281533A (ja) * 1985-06-07 1986-12-11 Hitachi Tokyo Electron Co Ltd ワイヤボンデイング装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5324779A (en) * 1976-08-20 1978-03-07 Hitachi Ltd Clamper of wire bonder
JPS5326667A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Clamp chip of wire bonder
JPS61281533A (ja) * 1985-06-07 1986-12-11 Hitachi Tokyo Electron Co Ltd ワイヤボンデイング装置

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