JPH0173959U - - Google Patents
Info
- Publication number
- JPH0173959U JPH0173959U JP1987169554U JP16955487U JPH0173959U JP H0173959 U JPH0173959 U JP H0173959U JP 1987169554 U JP1987169554 U JP 1987169554U JP 16955487 U JP16955487 U JP 16955487U JP H0173959 U JPH0173959 U JP H0173959U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- shield plate
- sandwiching
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002787 reinforcement Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案のフレキシブル回路基板端子部
の上面図、第２図は第１図の―断面図、第３
図は第２図の要部拡大断面図。
１…フレキシブル回路基板、２…シールド板、
３…補強板、４…半田接続穴、５…ガス抜き穴、
６…穴。
Figure 1 is a top view of the flexible circuit board terminal of the present invention, Figure 2 is a sectional view of Figure 1, and Figure 3 is a cross-sectional view of the flexible circuit board terminal of the present invention.
The figure is an enlarged sectional view of the main part of FIG. 2. 1...Flexible circuit board, 2...Shield plate,
3... Reinforcement plate, 4... Solder connection hole, 5... Gas vent hole,
6...hole.
Claims (1)
の端子部に、耐熱性の補強板をシールド板を挾ん
でフレキシブル回路基板と反対側に設けるととも
に、この補強板にはフレキシブル回路基板のアー
スパターンとシールド板との半田付接続穴に対応
する穴が設けられていることを特徴とするフレキ
シブル回路基板の端子部補強構造。 A heat-resistant reinforcing plate is installed on the opposite side of the flexible circuit board, sandwiching the shield plate between the terminals of the flexible circuit board to which the shield plate is attached. A terminal reinforcement structure for a flexible circuit board, characterized in that a hole corresponding to a solder connection hole is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169554U JPH0173959U (en) | 1987-11-05 | 1987-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169554U JPH0173959U (en) | 1987-11-05 | 1987-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173959U true JPH0173959U (en) | 1989-05-18 |
Family
ID=31459722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987169554U Pending JPH0173959U (en) | 1987-11-05 | 1987-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173959U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015050111A1 (en) * | 2013-10-01 | 2015-04-09 | 株式会社フジクラ | Wiring board assembly and method for producing same |
-
1987
- 1987-11-05 JP JP1987169554U patent/JPH0173959U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015050111A1 (en) * | 2013-10-01 | 2015-04-09 | 株式会社フジクラ | Wiring board assembly and method for producing same |
| US10237971B2 (en) | 2013-10-01 | 2019-03-19 | Fujikura Ltd. | Wiring board assembly and method for producing same |