JPH0175397U - - Google Patents

Description

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the first embodiment of the present invention, and FIG.
The figure shows the output of the bubble memory versus the bottom surface temperature of the bubble memory device.
FIG. 4 is a diagram for explaining one circuit configuration of a conventional magnetic bubble memory device, and FIG.
Figure 6 shows an example of sense amplifier slice level temperature correction, Figure 6 shows a conventional magnetic bubble memory device, Figure 7 shows the relationship between ambient temperature and chip and device bottom surface temperatures, and Figure 8. FIG. 2 is a diagram showing conventional temperature correction. In the figure, 1 is a bubble memory device, 9 is a direct peripheral circuit, 10 is a temperature detection element, and 11 is a printed board.

Claims (1)

[Claims for Utility Model Registration] 1. In a magnetic bubble memory device having a bubble memory device and a peripheral circuit and temperature-correcting at least one of the sense-up slice level and each gate current, the temperature detection element 10 is connected to the bubble memory device 1. A magnetic bubble memory device characterized by being placed in close contact with the bottom surface of the device. 2. The magnetic bubble memory device according to claim 1, wherein the temperature detection element 10 is built into a peripheral circuit 9 disposed in close contact with the bottom surface of the bubble memory device 1. 3. The magnetic bubble memory device according to claim 1, wherein the peripheral circuit 9 incorporating the temperature detection element is a flat package.